Kuan-Chi Tsai

Person

Kaohsiung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit
- Patent number 11,264,378
- Issue date Mar 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shao-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trap layer substrate stacking technique to improve performance for...
- Patent number 11,121,098
- Issue date Sep 14, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Yu Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trap layer substrate stacking technique to improve performance for...
- Patent number 11,121,100
- Issue date Sep 14, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Yu Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and manufacturing method thereof
- Patent number 10,515,949
- Issue date Dec 24, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shao-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress reduction apparatus with an inverted cup-shaped layer
- Patent number 10,290,576
- Issue date May 14, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ti Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a high-electron-mobility transistor...
- Patent number 10,153,300
- Issue date Dec 11, 2018
- Taiwan Semiconductor Manufacturing Company Limited
- Jun-De Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for forming the same
- Patent number 10,090,327
- Issue date Oct 2, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Yu Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress reduction apparatus
- Patent number 9,865,534
- Issue date Jan 9, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ti Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with metal ring on silicon-on-insula...
- Patent number 9,799,557
- Issue date Oct 24, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Yu Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trap layer substrate stacking technique to improve performance for...
- Patent number 9,761,546
- Issue date Sep 12, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Yu Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate fabrication method to improve RF (radio frequency) device...
- Patent number 9,711,521
- Issue date Jul 18, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yong-En Syu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming radio frequency (RF) area of integrated circ...
- Patent number 9,589,831
- Issue date Mar 7, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Yu Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MIM capacitors for leakage current improvement
- Patent number 9,543,152
- Issue date Jan 10, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ching-Hung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress reduction apparatus
- Patent number 9,373,536
- Issue date Jun 21, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ti Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor structure and method of forming the same
- Patent number 9,373,675
- Issue date Jun 21, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tai-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection between inductor and metal-insulator-metal (MIM) ca...
- Patent number 9,362,222
- Issue date Jun 7, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hung Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit using deep trench through silicon (DTS)
- Patent number 9,343,352
- Issue date May 17, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Yu Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming radio frequency (RF) area of integrated circ...
- Patent number 9,230,988
- Issue date Jan 5, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Yu Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating integrated passive devices on glass substrates
- Patent number 9,184,154
- Issue date Nov 10, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming semiconductor device structure with floating...
- Patent number 9,048,287
- Issue date Jun 2, 2015
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Yu Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit using deep trench through silicon (DTS)
- Patent number 8,941,211
- Issue date Jan 27, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Yu Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of ultra thick trench etch with multi-slope profile
- Patent number 8,884,441
- Issue date Nov 11, 2014
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hung Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preventing the cracking of passivation layers on ultra-thick metals
- Patent number 8,860,224
- Issue date Oct 14, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming metal-insulator-metal capacitors over a top metal layer
- Patent number 8,741,732
- Issue date Jun 3, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kun-Mao Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress reduction apparatus with an inverted cup-shaped layer
- Patent number 8,629,559
- Issue date Jan 14, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ti Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming metal-insulator-metal capacitors over a top metal layer
- Patent number 8,552,486
- Issue date Oct 8, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kun-Mao Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method thereof
- Patent number 8,076,235
- Issue date Dec 13, 2011
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuan-Chi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method thereof
- Patent number 7,846,832
- Issue date Dec 7, 2010
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuan-Chi Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT
- Publication number 20200126976
- Publication date Apr 23, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shao-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRAP LAYER SUBSTRATE STACKING TECHNIQUE TO IMPROVE PERFORMANCE FOR...
- Publication number 20200058608
- Publication date Feb 20, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Kuo-Yu Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stress Reduction Apparatus
- Publication number 20180145025
- Publication date May 24, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ti Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRAP LAYER SUBSTRATE STACKING TECHNIQUE TO IMPROVE PERFORMANCE FOR...
- Publication number 20180012850
- Publication date Jan 11, 2018
- Taiwan Semiconductor Manufacturing Co., LTD
- Kuo-Yu Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A HIGH-ELECTRON-MOBILITY TRANSISTOR...
- Publication number 20170229480
- Publication date Aug 10, 2017
- Taiwan Semiconductor Manufacturing Company Limited
- Jun-De Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRAP LAYER SUBSTRATE STACKING TECHNIQUE TO IMPROVE PERFORMANCE FOR...
- Publication number 20170110420
- Publication date Apr 20, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Kuo-Yu Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FABRICATION METHOD TO IMPROVE RF (RADIO FREQUENCY) DEVICE...
- Publication number 20170062452
- Publication date Mar 2, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Yong-En Syu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stress Reduction Apparatus
- Publication number 20160300794
- Publication date Oct 13, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ti Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANISMS FOR FORMING RADIO FREQUENCY (RF) AREA OF INTEGRATED CIRC...
- Publication number 20160099169
- Publication date Apr 7, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Yu CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIM CAPACITORS FOR LEAKAGE CURRENT IMPROVEMENT
- Publication number 20160005805
- Publication date Jan 7, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Hung HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20150206902
- Publication date Jul 23, 2015
- Taiwan Semiconductor Manufacturing Co., LTD
- Kuo-Yu CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH METAL RING ON SILICON-ON-INSULA...
- Publication number 20150206964
- Publication date Jul 23, 2015
- Taiwan Semiconductor Manufacturing Co., LTD
- Kuo-Yu CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANISMS FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE WITH FLOATING...
- Publication number 20150137234
- Publication date May 21, 2015
- Taiwan Semiconductor Manufacturing Co., LTD
- Kuo-Yu CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Using Deep Trench Through Silicon (DTS)
- Publication number 20150132918
- Publication date May 14, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Yu Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION BETWEEN INDUCTOR AND METAL-INSULATOR-METAL (MIM) CA...
- Publication number 20150115404
- Publication date Apr 30, 2015
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Hung HSUEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANISMS FOR FORMING RADIO FREQUENCY (RF) AREA OF INTEGRATED CIRC...
- Publication number 20150115381
- Publication date Apr 30, 2015
- Taiwan Semiconductor Manufacturing Co., LTD
- Kuo-Yu CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREOF
- Publication number 20150108607
- Publication date Apr 23, 2015
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shao-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Using Deep Trench Through Silicon (DTS)
- Publication number 20140246751
- Publication date Sep 4, 2014
- Taiwan Semiconductor Manufacturing Company,Ltd.
- Kuo-Yu Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process of Ultra Thick Trench Etch with Multi-Slope Profile
- Publication number 20140231955
- Publication date Aug 21, 2014
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Hung Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Fabricating Integrated Passive Devices on Glass Substrates
- Publication number 20140134801
- Publication date May 15, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stress Reduction Apparatus
- Publication number 20140106563
- Publication date Apr 17, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ti Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Metal-Insulator-Metal Capacitors Over a Top Metal Layer
- Publication number 20140038384
- Publication date Feb 6, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kun-Mao Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stress Reduction Apparatus
- Publication number 20130207264
- Publication date Aug 15, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ti Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capacitor Structure and Method of Forming the Same
- Publication number 20130200490
- Publication date Aug 8, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tai-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Preventing the Cracking of Passivation Layers on Ultra-Thick Metals
- Publication number 20120217641
- Publication date Aug 30, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Fabricating Integrated Passive Devices on Glass Substrates
- Publication number 20120190152
- Publication date Jul 26, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Metal-Insulator-Metal Capacitors Over a Top Metal Layer
- Publication number 20120181657
- Publication date Jul 19, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kun-Mao Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Fabrication Method Thereof
- Publication number 20110039408
- Publication date Feb 17, 2011
- Taiwan Semiconductor Manufacturing Co., LTD
- Kuan-Chi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and fabrication method thereof
- Publication number 20070010085
- Publication date Jan 11, 2007
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuan-Chi Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Kuan-Chi Tsai

Person

Patents Grantslast 30 patents

Integrated circuit

Trap layer substrate stacking technique to improve performance for...

Trap layer substrate stacking technique to improve performance for...

Integrated circuit and manufacturing method thereof

Stress reduction apparatus with an inverted cup-shaped layer

Semiconductor device including a high-electron-mobility transistor...

Semiconductor device and method for forming the same

Stress reduction apparatus

Semiconductor device structure with metal ring on silicon-on-insula...

Trap layer substrate stacking technique to improve performance for...

Substrate fabrication method to improve RF (radio frequency) device...

Mechanisms for forming radio frequency (RF) area of integrated circ...

MIM capacitors for leakage current improvement

Stress reduction apparatus

Capacitor structure and method of forming the same

Interconnection between inductor and metal-insulator-metal (MIM) ca...

Integrated circuit using deep trench through silicon (DTS)

Mechanisms for forming radio frequency (RF) area of integrated circ...

Methods for fabricating integrated passive devices on glass substrates

Mechanisms for forming semiconductor device structure with floating...

Integrated circuit using deep trench through silicon (DTS)

Process of ultra thick trench etch with multi-slope profile

Preventing the cracking of passivation layers on ultra-thick metals

Forming metal-insulator-metal capacitors over a top metal layer

Stress reduction apparatus with an inverted cup-shaped layer

Forming metal-insulator-metal capacitors over a top metal layer

Semiconductor device and fabrication method thereof

Semiconductor device and fabrication method thereof

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT

TRAP LAYER SUBSTRATE STACKING TECHNIQUE TO IMPROVE PERFORMANCE FOR...

Stress Reduction Apparatus

TRAP LAYER SUBSTRATE STACKING TECHNIQUE TO IMPROVE PERFORMANCE FOR...

SEMICONDUCTOR DEVICE INCLUDING A HIGH-ELECTRON-MOBILITY TRANSISTOR...

TRAP LAYER SUBSTRATE STACKING TECHNIQUE TO IMPROVE PERFORMANCE FOR...

SUBSTRATE FABRICATION METHOD TO IMPROVE RF (RADIO FREQUENCY) DEVICE...

Stress Reduction Apparatus

MECHANISMS FOR FORMING RADIO FREQUENCY (RF) AREA OF INTEGRATED CIRC...

MIM CAPACITORS FOR LEAKAGE CURRENT IMPROVEMENT

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE STRUCTURE WITH METAL RING ON SILICON-ON-INSULA...

MECHANISMS FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE WITH FLOATING...

Integrated Circuit Using Deep Trench Through Silicon (DTS)

INTERCONNECTION BETWEEN INDUCTOR AND METAL-INSULATOR-METAL (MIM) CA...

MECHANISMS FOR FORMING RADIO FREQUENCY (RF) AREA OF INTEGRATED CIRC...

INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREOF

Integrated Circuit Using Deep Trench Through Silicon (DTS)

Process of Ultra Thick Trench Etch with Multi-Slope Profile

Methods for Fabricating Integrated Passive Devices on Glass Substrates

Stress Reduction Apparatus

Forming Metal-Insulator-Metal Capacitors Over a Top Metal Layer

Stress Reduction Apparatus

Capacitor Structure and Method of Forming the Same

Preventing the Cracking of Passivation Layers on Ultra-Thick Metals

Methods for Fabricating Integrated Passive Devices on Glass Substrates

Forming Metal-Insulator-Metal Capacitors Over a Top Metal Layer

Semiconductor Device and Fabrication Method Thereof

Semiconductor device and fabrication method thereof