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Tampin, MY
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device including a solder barrier
Patent number
9,640,459
Issue date
May 2, 2017
Infineon Technologies AG
Wee Boon Tay
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flexible routing for high current module application
Patent number
8,779,566
Issue date
Jul 15, 2014
National Semiconductor Corporation
Lee Han Meng @ Eugene Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Module package with embedded substrate and leadframe
Patent number
8,304,887
Issue date
Nov 6, 2012
Texas Instruments Incorporated
Lee Han Meng @ Eugene Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Tie bar and mold cavity bar arrangements for multiple leadframe sta...
Patent number
8,203,199
Issue date
Jun 19, 2012
National Semiconductor Corporation
Lee Han Meng Eugene Lee
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
FLEXIBLE ROUTING FOR HIGH CURRENT MODULE APPLICATION
Publication number
20130045572
Publication date
Feb 21, 2013
National Semiconductor Corporation
Lee Han Meng @ Eugene Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TIE BAR AND MOLD CAVITY BAR ARRANGEMENTS FOR MULTIPLE LEADFRAME STA...
Publication number
20110140249
Publication date
Jun 16, 2011
National Semiconductor Corporation
Lee Han Meng Eugene LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MODULE PACKAGE WITH EMBEDDED SUBSTRATE AND LEADFRAME
Publication number
20110140262
Publication date
Jun 16, 2011
National Semiconductor Corporation
Lee Han Meng Eugene LEE
H01 - BASIC ELECTRIC ELEMENTS