Kuan-Hsiang Mao

Person

Kaohsiung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Dielectric sidewall protection and sealing for semiconductor device...
- Patent number 12,198,998
- Issue date Jan 14, 2025
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices and methods therefor
- Patent number 12,080,601
- Issue date Sep 3, 2024
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside and sidewall metallization of semiconductor devices
- Patent number 11,935,753
- Issue date Mar 19, 2024
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-resist island forming via method and apparatus
- Patent number 11,640,947
- Issue date May 2, 2023
- NXP B.V.
- Kuan-Hsiang Mao
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE HAVING WIRED UNDER BUMP STRUCTURE AND METHOD T...
- Publication number 20240395674
- Publication date Nov 28, 2024
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICES AND METHODS THEREFOR
- Publication number 20240387271
- Publication date Nov 21, 2024
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADLESS SEMICONDUCTOR PACKAGE WITH DUAL-SIDED STUD STRUCTURE FOR D...
- Publication number 20240339426
- Publication date Oct 10, 2024
- NXP B.V.
- Wen Yuan CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE AND SIDEWALL METALLIZATION OF SEMICONDUCTOR DEVICES
- Publication number 20240194486
- Publication date Jun 13, 2024
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION METALLIZATION AND METHOD T...
- Publication number 20240105659
- Publication date Mar 28, 2024
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UBM-FREE METAL SKELETON FRAME WITH SUPPORT STUDS AND METHOD FOR FAB...
- Publication number 20240030173
- Publication date Jan 25, 2024
- NXP B.V.
- Che Ming Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH LEAD-ON-CHIP INTERCONNECT AND METHOD THER...
- Publication number 20240014123
- Publication date Jan 11, 2024
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYER HAVING A SIDEVIEW ZIG-ZAG PROFILE
- Publication number 20230378107
- Publication date Nov 23, 2023
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE HAVING METAL SKELETON FRAME USING EMBEDDED GROUND PLANE
- Publication number 20230369168
- Publication date Nov 16, 2023
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE AND SIDEWALL METALLIZATION OF SEMICONDUCTOR DEVICES
- Publication number 20230187211
- Publication date Jun 15, 2023
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC SIDEWALL PROTECTION AND SEALING FOR SEMICONDUCTOR DEVICE...
- Publication number 20230187299
- Publication date Jun 15, 2023
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICES AND METHODS THEREFOR
- Publication number 20230014470
- Publication date Jan 19, 2023
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pre-Resist Island Forming Via Method and Apparatus
- Publication number 20220384372
- Publication date Dec 1, 2022
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS

Kuan-Hsiang Mao

Person

Patents Grantslast 30 patents

Dielectric sidewall protection and sealing for semiconductor device...

Packaged semiconductor devices and methods therefor

Backside and sidewall metallization of semiconductor devices

Pre-resist island forming via method and apparatus

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE HAVING WIRED UNDER BUMP STRUCTURE AND METHOD T...

PACKAGED SEMICONDUCTOR DEVICES AND METHODS THEREFOR

LEADLESS SEMICONDUCTOR PACKAGE WITH DUAL-SIDED STUD STRUCTURE FOR D...

BACKSIDE AND SIDEWALL METALLIZATION OF SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE WITH REDISTRIBUTION METALLIZATION AND METHOD T...

UBM-FREE METAL SKELETON FRAME WITH SUPPORT STUDS AND METHOD FOR FAB...

SEMICONDUCTOR DEVICE WITH LEAD-ON-CHIP INTERCONNECT AND METHOD THER...

REDISTRIBUTION LAYER HAVING A SIDEVIEW ZIG-ZAG PROFILE

PACKAGE HAVING METAL SKELETON FRAME USING EMBEDDED GROUND PLANE

BACKSIDE AND SIDEWALL METALLIZATION OF SEMICONDUCTOR DEVICES

DIELECTRIC SIDEWALL PROTECTION AND SEALING FOR SEMICONDUCTOR DEVICE...

PACKAGED SEMICONDUCTOR DEVICES AND METHODS THEREFOR

Pre-Resist Island Forming Via Method and Apparatus