Kuang Liu

Person

Queen Creek, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Immersion cooling for integrated circuit devices
- Patent number 12,238,892
- Issue date Feb 25, 2025
- Intel Corporation
- Raanan Sover
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compression mounted technology (CMT) socket retention mechanisms to...
- Patent number 12,127,363
- Issue date Oct 22, 2024
- Intel Corporation
- Feifei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-sided socket device with corrugation structures and shield str...
- Patent number 12,009,612
- Issue date Jun 11, 2024
- Intel Corporation
- Srikant Nekkanty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective ground flood around reduced land pad on package base laye...
- Patent number 11,737,227
- Issue date Aug 22, 2023
- Intel Corporation
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure features to alter the shape of a socket
- Patent number 11,569,596
- Issue date Jan 31, 2023
- Intel Corporation
- Steven A. Klein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformable heat sink interface with a high thermal conductivity
- Patent number 11,464,139
- Issue date Oct 4, 2022
- Intel Corporation
- Kelly Lofgreen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective ground flood around reduced land pad on package base laye...
- Patent number 11,291,133
- Issue date Mar 29, 2022
- Intel Corporation
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connectors for integrated circuit packages
- Patent number 11,158,969
- Issue date Oct 26, 2021
- Intel Corporation
- Feifei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cable retention assemblies including torsional elements
- Patent number 10,680,367
- Issue date Jun 9, 2020
- Intel Corporation
- Feifei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal head with a thermal barrier for integrated circuit die proc...
- Patent number 10,499,461
- Issue date Dec 3, 2019
- Intel Corporation
- Mohit Mamodia
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device, socket, and spacer to alter socket profile
- Patent number 10,455,685
- Issue date Oct 22, 2019
- Intel Corporation
- Steven A. Klein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques and configurations to control movement and position of s...
- Patent number 10,186,497
- Issue date Jan 22, 2019
- Intel Corporation
- Mark D. Summers
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Universal linear edge connector
- Patent number 10,044,115
- Issue date Aug 7, 2018
- Intel Corporation
- Donald T. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CPU package substrates with removable memory mechanical interfaces
- Patent number 9,832,876
- Issue date Nov 28, 2017
- Intel Corporation
- Mani Prakash
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Linear edge connector with a cable retention mechanism having a bod...
- Patent number 9,825,387
- Issue date Nov 21, 2017
- Intel Corporation
- Feifei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques and configurations to control movement and position of s...
- Patent number 9,647,363
- Issue date May 9, 2017
- Intel Corporation
- Mark D. Summers
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Techniques and configurations associated with a package load assembly
- Patent number 9,615,483
- Issue date Apr 4, 2017
- Intel Corporation
- Gaurav Chawla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly that includes a plurality of electronic packages
- Patent number 9,603,276
- Issue date Mar 21, 2017
- Intel Corporation
- David J. Llapitan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRICAL-OPTICAL CONVERSION WITH 3D STACKED PHOTONIC CHIPLET(S) I...
- Publication number 20250067942
- Publication date Feb 27, 2025
- Lightmatter, Inc
- Kuang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL COMMUNICATION SUBSTRATE USING GLASS INTERPOSER
- Publication number 20240353614
- Publication date Oct 24, 2024
- Lightmatter, Inc
- Darius Bunandar
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METAL PCB FOR TOPSIDE POWER DELIVERY
- Publication number 20230317706
- Publication date Oct 5, 2023
- Intel Corporation
- Kyle ARRINGTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMMERSION COOLING FOR INTEGRATED CIRCUIT DEVICES
- Publication number 20220201889
- Publication date Jun 23, 2022
- Intel Corporation
- Raanan Sover
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELECTIVE GROUND FLOOD AROUND REDUCED LAND PAD ON PACKAGE BASE LAYE...
- Publication number 20220183177
- Publication date Jun 9, 2022
- Intel Corporation
- Zhichao ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPRESSION MOUNTED TECHNOLOGY (CMT) SOCKET RETENTION MECHANISMS TO...
- Publication number 20220102887
- Publication date Mar 31, 2022
- Intel Corporation
- Feifei CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-SIDED SOCKET DEVICE WITH CORRUGATION STRUCTURES AND SHIELD STR...
- Publication number 20220102892
- Publication date Mar 31, 2022
- Intel Corporation
- Srikant Nekkanty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURE FEATURES TO ALTER THE SHAPE OF A SOCKET
- Publication number 20210305731
- Publication date Sep 30, 2021
- Intel Corporation
- Steven A. KLEIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMABLE HEAT SINK INTERFACE WITH A HIGH THERMAL CONDUCTIVITY
- Publication number 20200146183
- Publication date May 7, 2020
- Intel Corporation
- Kelly Lofgreen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELECTIVE GROUND FLOOD AROUND REDUCED LAND PAD ON PACKAGE BASE LAYE...
- Publication number 20190307009
- Publication date Oct 3, 2019
- Zhichao ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSMISSION LINE - LAND GRID ARRAY (TL-LGA) SOCKET WITH CASCADED T...
- Publication number 20190307010
- Publication date Oct 3, 2019
- Zhichao ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REPLACEABLE ON-PACKAGE MEMORY DEVICES
- Publication number 20190182955
- Publication date Jun 13, 2019
- Intel Corporation
- Gregorio R. Murtagian
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTORS FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20190044265
- Publication date Feb 7, 2019
- Intel Corporation
- FEIFEI CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CPU PACKAGE SUBSTRATES WITH REMOVABLE MEMORY MECHANICAL INTERFACES
- Publication number 20180007791
- Publication date Jan 4, 2018
- Intel Corporation
- Mani Prakash
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LINEAR EDGE CONNECTOR WITH A CABLE RETENTION MECHANISM HAVING A BOD...
- Publication number 20170288331
- Publication date Oct 5, 2017
- Intel Corporation
- Feifei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LINEAR EDGE CONNECTOR RETENTION
- Publication number 20170288330
- Publication date Oct 5, 2017
- Intel Corporation
- Feifei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES AND CONFIGURATIONS TO CONTROL MOVEMENT AND POSITION OF S...
- Publication number 20170229420
- Publication date Aug 10, 2017
- Intel Corporation
- Mark D. Summers
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Universal linear edge connector
- Publication number 20170187147
- Publication date Jun 29, 2017
- Donald T. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Head with a Thermal Barrier for Integrated Circuit Die Proc...
- Publication number 20170176516
- Publication date Jun 22, 2017
- Intel Corporation
- Mohit Mamodia
- G01 - MEASURING TESTING
Information Patent Application
SOCKET THAT ENGAGES A PLURALITY OF ELECTRONIC PACKAGES
- Publication number 20160190716
- Publication date Jun 30, 2016
- Kuang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY THAT INCLUDES A PLURALITY OF ELECTRONIC PACKAGES
- Publication number 20160190717
- Publication date Jun 30, 2016
- David J. Llapitan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CPU PACKAGE SUBSTRATES WITH REMOVABLE MEMORY MECHANICAL INTERFACES
- Publication number 20160183374
- Publication date Jun 23, 2016
- Mani Prakash
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES AND CONFIGURATIONS TO CONTROL MOVEMENT AND POSITION OF S...
- Publication number 20160087361
- Publication date Mar 24, 2016
- Intel Corporation
- Mark D. Summers
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TECHNIQUES AND CONFIGURATIONS ASSOCIATED WITH A PACKAGE LOAD ASSEMBLY
- Publication number 20160079150
- Publication date Mar 17, 2016
- Intel Corporation
- Gaurav Chawla
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Immersion cooling for integrated circuit devices

Compression mounted technology (CMT) socket retention mechanisms to...

Dual-sided socket device with corrugation structures and shield str...

Selective ground flood around reduced land pad on package base laye...

Pressure features to alter the shape of a socket

Conformable heat sink interface with a high thermal conductivity

Selective ground flood around reduced land pad on package base laye...

Connectors for integrated circuit packages

Cable retention assemblies including torsional elements

Thermal head with a thermal barrier for integrated circuit die proc...

Electronic device, socket, and spacer to alter socket profile

Techniques and configurations to control movement and position of s...

Universal linear edge connector

CPU package substrates with removable memory mechanical interfaces

Linear edge connector with a cable retention mechanism having a bod...

Techniques and configurations to control movement and position of s...

Techniques and configurations associated with a package load assembly

Electronic assembly that includes a plurality of electronic packages

Patents Applicationslast 30 patents

ELECTRICAL-OPTICAL CONVERSION WITH 3D STACKED PHOTONIC CHIPLET(S) I...

OPTICAL COMMUNICATION SUBSTRATE USING GLASS INTERPOSER

METAL PCB FOR TOPSIDE POWER DELIVERY

IMMERSION COOLING FOR INTEGRATED CIRCUIT DEVICES

SELECTIVE GROUND FLOOD AROUND REDUCED LAND PAD ON PACKAGE BASE LAYE...

COMPRESSION MOUNTED TECHNOLOGY (CMT) SOCKET RETENTION MECHANISMS TO...

DUAL-SIDED SOCKET DEVICE WITH CORRUGATION STRUCTURES AND SHIELD STR...

PRESSURE FEATURES TO ALTER THE SHAPE OF A SOCKET

CONFORMABLE HEAT SINK INTERFACE WITH A HIGH THERMAL CONDUCTIVITY

SELECTIVE GROUND FLOOD AROUND REDUCED LAND PAD ON PACKAGE BASE LAYE...

TRANSMISSION LINE - LAND GRID ARRAY (TL-LGA) SOCKET WITH CASCADED T...

REPLACEABLE ON-PACKAGE MEMORY DEVICES

CONNECTORS FOR INTEGRATED CIRCUIT PACKAGES

CPU PACKAGE SUBSTRATES WITH REMOVABLE MEMORY MECHANICAL INTERFACES

LINEAR EDGE CONNECTOR WITH A CABLE RETENTION MECHANISM HAVING A BOD...

LINEAR EDGE CONNECTOR RETENTION

TECHNIQUES AND CONFIGURATIONS TO CONTROL MOVEMENT AND POSITION OF S...

Universal linear edge connector

Thermal Head with a Thermal Barrier for Integrated Circuit Die Proc...

SOCKET THAT ENGAGES A PLURALITY OF ELECTRONIC PACKAGES

ELECTRONIC ASSEMBLY THAT INCLUDES A PLURALITY OF ELECTRONIC PACKAGES

CPU PACKAGE SUBSTRATES WITH REMOVABLE MEMORY MECHANICAL INTERFACES

TECHNIQUES AND CONFIGURATIONS TO CONTROL MOVEMENT AND POSITION OF S...

TECHNIQUES AND CONFIGURATIONS ASSOCIATED WITH A PACKAGE LOAD ASSEMBLY