Kuang-Neng Yang

Person

Taoyuan County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device structure and methods of forming the same
- Patent number 12,205,946
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Fang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and methods of forming the same
- Patent number 12,132,000
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and methods of forming the same
- Patent number 12,094,764
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Chin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and methods of forming the same
- Patent number 12,074,060
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Chin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having metallization layer with low capacitanc...
- Patent number 12,062,572
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Chin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and methods of forming the same
- Patent number 11,923,357
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Fang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnection structure and methods of forming the...
- Patent number 11,854,963
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure
- Patent number 11,538,749
- Issue date Dec 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED carrier and LED package having the same
- Patent number 10,811,578
- Issue date Oct 20, 2020
- Lextar Electronics Corporation
- Chih-Hao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode and method of making the same
- Patent number 8,791,467
- Issue date Jul 29, 2014
- Epistar Corporation
- Kuang-Neng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode and method of making the same
- Patent number 7,951,633
- Issue date May 31, 2011
- Epistar Corporation
- Kuang-Neng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode and method of making the same
- Patent number 7,615,392
- Issue date Nov 10, 2009
- Epistar Corporation
- Kuang-Neng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode and method of making the same
- Patent number 7,129,527
- Issue date Oct 31, 2006
- United Epitaxy Company Ltd.
- Kuang-Neng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for integrating compound semiconductor with substrate or hig...
- Patent number 6,812,067
- Issue date Nov 2, 2004
- United Epitaxy Company, Ltd.
- Tzer-Perng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED stack manufacturing method and its structure thereof
- Patent number 6,786,390
- Issue date Sep 7, 2004
- United Epitaxy Company Ltd.
- Kuang-Neng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing light-emitting element on non-transparent...
- Patent number 6,762,069
- Issue date Jul 13, 2004
- United Epitaxy Company, Ltd.
- Chung-Kuei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode and method of making the same
- Patent number 6,709,883
- Issue date Mar 23, 2004
- United Epitaxy Co., Ltd.
- Kuang-Neng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode and method of making the same
- Patent number 6,682,950
- Issue date Jan 27, 2004
- United Epitaxy Company, Ltd.
- Kuang-Neng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing high-power light emitting diodes
- Patent number 6,649,437
- Issue date Nov 18, 2003
- United Epitaxy Company, Ltd.
- Kuang-Neng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode with low-temperature solder layer
- Patent number 6,586,875
- Issue date Jul 1, 2003
- United Epitaxy Company, Inc.
- Tzer-Perng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode and method of making the same
- Patent number 6,583,443
- Issue date Jun 24, 2003
- United Epitaxy Co., Ltd.
- Chih-Sung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode and method for manufacturing the same
- Patent number 6,583,448
- Issue date Jun 24, 2003
- United Epitaxy Company, Ltd.
- Jin-Ywan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode and method for manufacturing the same
- Patent number 6,462,358
- Issue date Oct 8, 2002
- United Epitaxy Company, Ltd.
- Jin-Ywan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making light emitting diode
- Patent number 6,319,778
- Issue date Nov 20, 2001
- United Epitaxy Company, Inc.
- Tzer-Perng Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
- Publication number 20250226282
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuang-Wei Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE WITH LOW RC DELAY AND METHOD FOR MANUFACTURI...
- Publication number 20250149436
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Gary LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE
- Publication number 20250132247
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Lin TENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250118598
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20250112088
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20250087532
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuang-Wei YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240413074
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240379413
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING THERMALLY CONDUCTIVE AIR GAP STRUCTURE...
- Publication number 20240379416
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ya LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240379560
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Kuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240371690
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING METALLIZATION LAYER WITH LOW CAPACITANC...
- Publication number 20240363400
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING LOW DIELECTRIC CAPACITANCE AND GOOD ELE...
- Publication number 20240234203
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ya LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE...
- Publication number 20240088023
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Kuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20230378168
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH IMPROVED HEAT DISSIPATION
- Publication number 20230290705
- Publication date Sep 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING METALLIZATION LAYER WITH LOW CAPACITANC...
- Publication number 20230260831
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING THERMALLY CONDUCTIVE AIR GAP STRUCTURE...
- Publication number 20230065583
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ya LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20230066861
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20230067027
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20230067886
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Kuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE
- Publication number 20220359385
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20220359499
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE...
- Publication number 20220285268
- Publication date Sep 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Kuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20220231012
- Publication date Jul 21, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE
- Publication number 20220157711
- Publication date May 19, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED CARRIER AND LED PACKAGE HAVING THE SAME
- Publication number 20200313052
- Publication date Oct 1, 2020
- Lextar Electronics Corporation
- Chih-Hao LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE AND METHOD OF MAKING THE SAME
- Publication number 20110210330
- Publication date Sep 1, 2011
- Kuang-Neng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE AND METHOD OF MAKING THE SAME
- Publication number 20100009486
- Publication date Jan 14, 2010
- Kuang-Neng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light emitting diode and method of making the same
- Publication number 20060057752
- Publication date Mar 16, 2006
- United Epitaxy Company, Ltd.
- Kuang-Neng Yang
- H01 - BASIC ELECTRIC ELEMENTS

Kuang-Neng Yang

Person

Patents Grantslast 30 patents

Semiconductor device structure and methods of forming the same

Semiconductor device structure and methods of forming the same

Interconnect structure and methods of forming the same

Semiconductor device structure and methods of forming the same

Semiconductor device having metallization layer with low capacitanc...

Semiconductor device structure and methods of forming the same

Semiconductor interconnection structure and methods of forming the...

Interconnect structure

LED carrier and LED package having the same

Light emitting diode and method of making the same

Light emitting diode and method of making the same

Light emitting diode and method of making the same

Light emitting diode and method of making the same

Method for integrating compound semiconductor with substrate or hig...

LED stack manufacturing method and its structure thereof

Method for manufacturing light-emitting element on non-transparent...

Light emitting diode and method of making the same

Light emitting diode and method of making the same

Method of manufacturing high-power light emitting diodes

Light emitting diode with low-temperature solder layer

Light emitting diode and method of making the same

Light emitting diode and method for manufacturing the same

Light emitting diode and method for manufacturing the same

Method of making light emitting diode

Patents Applicationslast 30 patents

ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

INTERCONNECT STRUCTURE WITH LOW RC DELAY AND METHOD FOR MANUFACTURI...

INTERCONNECTION STRUCTURE

INTERCONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME

INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE HAVING THERMALLY CONDUCTIVE AIR GAP STRUCTURE...

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE HAVING METALLIZATION LAYER WITH LOW CAPACITANC...

SEMICONDUCTOR DEVICE HAVING LOW DIELECTRIC CAPACITANCE AND GOOD ELE...

SEMICONDUCTOR INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE...

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE WITH IMPROVED HEAT DISSIPATION

SEMICONDUCTOR DEVICE HAVING METALLIZATION LAYER WITH LOW CAPACITANC...

SEMICONDUCTOR DEVICE HAVING THERMALLY CONDUCTIVE AIR GAP STRUCTURE...

INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

INTERCONNECT STRUCTURE

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE...

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

INTERCONNECT STRUCTURE

LED CARRIER AND LED PACKAGE HAVING THE SAME

LIGHT EMITTING DIODE AND METHOD OF MAKING THE SAME

LIGHT EMITTING DIODE AND METHOD OF MAKING THE SAME

Light emitting diode and method of making the same