Kuei Hsiung Chang

Person

Taipei, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Microelectromechanical systems device having a mechanically robust...
- Patent number 12,151,932
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package structure including a base and a lid disposed over the base...
- Patent number 12,002,780
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kuei-Sung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite spring structure to reinforce mechanical robustness of a...
- Patent number 11,993,510
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wire-bond damper for shock absorption
- Patent number 11,987,494
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Lin Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-electro mechanical system device containing a bump stopper an...
- Patent number 11,970,387
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chun-wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package structure and measurement method for the package structure
- Patent number 11,965,731
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kuei-Sung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Outgassing material coated cavity for a micro-electro mechanical sy...
- Patent number 11,827,513
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical systems device having a mechanically robust...
- Patent number 11,814,283
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS structure and method of forming same
- Patent number 11,736,037
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi Heng Tsai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device with dummy-area utilization for pressure enhancement
- Patent number 11,713,242
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,661,333
- Issue date May 30, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wei-Jhih Mao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductive structure and manufacturing method thereof
- Patent number 11,591,211
- Issue date Feb 28, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yen-Cheng Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated circuit structure
- Patent number 11,581,227
- Issue date Feb 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuei-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS apparatus with anti-stiction layer
- Patent number 11,542,151
- Issue date Jan 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of making ohmic contact on low doped bulk silicon for optica...
- Patent number 11,530,130
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Vacuum wafer chuck for manufacturing semiconductor devices
- Patent number 11,508,608
- Issue date Nov 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Fa Lee
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Method of making ohmic contact on low doped bulk silicon for optica...
- Patent number 11,485,631
- Issue date Nov 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Composite spring structure to reinforce mechanical robustness of a...
- Patent number 11,420,866
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,387,232
- Issue date Jul 12, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Han Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-electro mechanical system device containing a bump stopper an...
- Patent number 11,279,611
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Chun-wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,245,034
- Issue date Feb 8, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuei-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Outgassing material coated cavity for a micro-electro mechanical sy...
- Patent number 11,180,363
- Issue date Nov 23, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device with dummy-area utilization for pressure enhancement
- Patent number 11,174,158
- Issue date Nov 16, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bypass structure
- Patent number 11,084,713
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Eason Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,075,125
- Issue date Jul 27, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuei-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectromechanical systems device having a mechanically robust...
- Patent number 11,040,870
- Issue date Jun 22, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Narrow gap device with parallel releasing structure
- Patent number 11,018,218
- Issue date May 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Narrow gap device with parallel releasing structure
- Patent number 11,011,601
- Issue date May 18, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Display device capable of switching image sources and operating system
- Patent number 11,006,051
- Issue date May 11, 2021
- Giga-Byte Technology Co., Ltd.
- Kuei-Shan Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,961,115
- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
STOPPER BUMP STRUCTURES FOR MEMS DEVICE
- Publication number 20240375939
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Jhih Mao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OUTGASSING MATERIAL COATED CAVITY FOR A MICRO-ELECTRO MECHANICAL SY...
- Publication number 20240367964
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE PACKAGE STRUCTURE
- Publication number 20240282739
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- KUEI-SUNG CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE SPRING STRUCTURE TO REINFORCE MECHANICAL ROBUSTNESS OF A...
- Publication number 20240270565
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE STRUCTURE AND MEASUREMENT METHOD FOR THE PACKAGE STRUCTURE
- Publication number 20240263938
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- KUEI-SUNG CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPENSATION METHOD FOR CHARACTERISTIC DIFFERENCE OF PHOTOELECTRIC...
- Publication number 20240178809
- Publication date May 30, 2024
- Teco Image Systems Co., Ltd.
- Kuei-Chung Chang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS
- Publication number 20240162183
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240021485
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS
- Publication number 20240021567
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTROMECHANICAL SYSTEMS DEVICE HAVING A MECHANICALLY ROBUST...
- Publication number 20230382712
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WIRE-BOND DAMPER FOR SHOCK ABSORPTION
- Publication number 20230382720
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Lin Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OUTGASSING MATERIAL COATED CAVITY FOR A MICRO-ELECTRO MECHANICAL SY...
- Publication number 20230365398
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Structure and Method of Forming Same
- Publication number 20230353066
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company Co., Ltd.
- Yi Heng Tsai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STOPPER BUMP STRUCTURES FOR MEMS DEVICE
- Publication number 20230257256
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Jhih Mao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE
- Publication number 20230187283
- Publication date Jun 15, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuei-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VACUUM WAFER CHUCK FOR MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20220415699
- Publication date Dec 29, 2022
- TAIWAN SEMICONDUTOR MANUFACTURING CO., LTD.
- Chien-Fa LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220320086
- Publication date Oct 6, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Han WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE SPRING STRUCTURE TO REINFORCE MECHANICAL ROBUSTNESS OF A...
- Publication number 20220306454
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS
- Publication number 20220270999
- Publication date Aug 25, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-ELECTRO MECHANICAL SYSTEM DEVICE CONTAINING A BUMP STOPPER AN...
- Publication number 20220212917
- Publication date Jul 7, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Chun-wen CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WIRE-BOND DAMPER FOR SHOCK ABSORPTION
- Publication number 20220162058
- Publication date May 26, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Lin Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE PACKAGE STRUCTURE
- Publication number 20220148992
- Publication date May 12, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- KUEI-SUNG CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MEASUREMENT METHOD FOR THE PACKAGE STRUCTURE
- Publication number 20220139789
- Publication date May 5, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- KUEI-SUNG CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220112074
- Publication date Apr 14, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- WEI-JHIH MAO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE WITH DUMMY-AREA UTILIZATION FOR PRESSURE ENHANCEMENT
- Publication number 20220063994
- Publication date Mar 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
VACUUM WAFER CHUCK FOR MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20220059393
- Publication date Feb 24, 2022
- TAIWAN SEMICONDUCTOR MANUFACTURING CO, LTD.
- Chien-Fa LEE
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
OUTGASSING MATERIAL COATED CAVITY FOR A MICRO-ELECTRO MECHANICAL SY...
- Publication number 20220024756
- Publication date Jan 27, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BYPASS STRUCTURE
- Publication number 20210354980
- Publication date Nov 18, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Eason Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE
- Publication number 20210351086
- Publication date Nov 11, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuei-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTROMECHANICAL SYSTEMS DEVICE HAVING A MECHANICALLY ROBUST...
- Publication number 20210309508
- Publication date Oct 7, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Kuei Hsiung Chang

Person

Patents Grantslast 30 patents

Microelectromechanical systems device having a mechanically robust...

Package structure including a base and a lid disposed over the base...

Composite spring structure to reinforce mechanical robustness of a...

Wire-bond damper for shock absorption

Micro-electro mechanical system device containing a bump stopper an...

Package structure and measurement method for the package structure

Outgassing material coated cavity for a micro-electro mechanical sy...

Microelectromechanical systems device having a mechanically robust...

MEMS structure and method of forming same

MEMS device with dummy-area utilization for pressure enhancement

Semiconductor structure and manufacturing method thereof

Semiconductive structure and manufacturing method thereof

Integrated circuit structure

MEMS apparatus with anti-stiction layer

Method of making ohmic contact on low doped bulk silicon for optica...

Vacuum wafer chuck for manufacturing semiconductor devices

Method of making ohmic contact on low doped bulk silicon for optica...

Composite spring structure to reinforce mechanical robustness of a...

Semiconductor device and manufacturing method thereof

Micro-electro mechanical system device containing a bump stopper an...

Semiconductor device and manufacturing method thereof

Outgassing material coated cavity for a micro-electro mechanical sy...

MEMS device with dummy-area utilization for pressure enhancement

Bypass structure

Semiconductor device and manufacturing method thereof

Microelectromechanical systems device having a mechanically robust...

Narrow gap device with parallel releasing structure

Narrow gap device with parallel releasing structure

Display device capable of switching image sources and operating system

Semiconductor structure and manufacturing method thereof

Patents Applicationslast 30 patents

STOPPER BUMP STRUCTURES FOR MEMS DEVICE

OUTGASSING MATERIAL COATED CAVITY FOR A MICRO-ELECTRO MECHANICAL SY...

PACKAGE STRUCTURE AND METHOD OF FORMING THE PACKAGE STRUCTURE

COMPOSITE SPRING STRUCTURE TO REINFORCE MECHANICAL ROBUSTNESS OF A...

PACKAGE STRUCTURE AND MEASUREMENT METHOD FOR THE PACKAGE STRUCTURE

COMPENSATION METHOD FOR CHARACTERISTIC DIFFERENCE OF PHOTOELECTRIC...

DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS

MICROELECTROMECHANICAL SYSTEMS DEVICE HAVING A MECHANICALLY ROBUST...

WIRE-BOND DAMPER FOR SHOCK ABSORPTION

OUTGASSING MATERIAL COATED CAVITY FOR A MICRO-ELECTRO MECHANICAL SY...

MEMS Structure and Method of Forming Same

STOPPER BUMP STRUCTURES FOR MEMS DEVICE

INTEGRATED CIRCUIT STRUCTURE

VACUUM WAFER CHUCK FOR MANUFACTURING SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

COMPOSITE SPRING STRUCTURE TO REINFORCE MECHANICAL ROBUSTNESS OF A...

DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS

MICRO-ELECTRO MECHANICAL SYSTEM DEVICE CONTAINING A BUMP STOPPER AN...

WIRE-BOND DAMPER FOR SHOCK ABSORPTION

PACKAGE STRUCTURE AND METHOD OF FORMING THE PACKAGE STRUCTURE

PACKAGE STRUCTURE AND MEASUREMENT METHOD FOR THE PACKAGE STRUCTURE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

MEMS DEVICE WITH DUMMY-AREA UTILIZATION FOR PRESSURE ENHANCEMENT

VACUUM WAFER CHUCK FOR MANUFACTURING SEMICONDUCTOR DEVICES

OUTGASSING MATERIAL COATED CAVITY FOR A MICRO-ELECTRO MECHANICAL SY...

BYPASS STRUCTURE

INTEGRATED CIRCUIT STRUCTURE

MICROELECTROMECHANICAL SYSTEMS DEVICE HAVING A MECHANICALLY ROBUST...