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Keelung City, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Method for forming chip package with second opening surrounding fir...
Patent number
11,973,095
Issue date
Apr 30, 2024
Xintec Inc.
Kuei-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method of chip package and chip package
Patent number
11,942,563
Issue date
Mar 26, 2024
Xintec Inc.
Chia-Sheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method of chip package and chip package
Patent number
11,705,368
Issue date
Jul 18, 2023
Xintec Inc.
Chia-Sheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package with substrate having first opening surrounded by seco...
Patent number
11,450,697
Issue date
Sep 20, 2022
Xintec Inc.
Kuei-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method of chip package and chip package
Patent number
11,121,031
Issue date
Sep 14, 2021
Xintec Inc.
Chia-Sheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package
Patent number
11,056,427
Issue date
Jul 6, 2021
Xintec Inc.
Kuei-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer level array of chips and method thereof
Patent number
9,318,461
Issue date
Apr 19, 2016
Xintec Inc.
Chun-Wei Chang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
Publication number
20240178261
Publication date
May 30, 2024
XINTEC INC.
Kuei-Wei CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20230369362
Publication date
Nov 16, 2023
XINTEC INC.
Po-Han LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
Publication number
20220344396
Publication date
Oct 27, 2022
XINTEC INC.
Kuei-Wei CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF CHIP PACKAGE AND CHIP PACKAGE
Publication number
20210343591
Publication date
Nov 4, 2021
XINTEC INC.
Chia-Sheng LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF CHIP PACKAGE AND CHIP PACKAGE
Publication number
20200144116
Publication date
May 7, 2020
XINTEC INC.
Chia-Sheng LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE
Publication number
20200111737
Publication date
Apr 9, 2020
XINTEC INC.
Kuei-Wei CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
Publication number
20200098811
Publication date
Mar 26, 2020
XINTEC INC.
Kuei-Wei CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
Publication number
20170256496
Publication date
Sep 7, 2017
XINTEC INC.
Chia-Sheng LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER LEVEL ARRAY OF CHIPS AND METHOD THEREOF
Publication number
20140312482
Publication date
Oct 23, 2014
XINTEC INC.
Chun-Wei CHANG
H01 - BASIC ELECTRIC ELEMENTS