Kui Won Kang

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Cheongju-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board and semiconductor package with the same
- Patent number 8,253,034
- Issue date Aug 28, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Byoung Chan Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Printed circuit board and semiconductor package with the same
- Publication number 20110286191
- Publication date Nov 24, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Byoung Chan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed circuit board
- Publication number 20090133902
- Publication date May 28, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Chin-Kwan Kim
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...