Kuiwon KANG

Person

San Diego, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit (IC) packages employing a package substrate with...
- Patent number 11,791,320
- Issue date Oct 17, 2023
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with a substrate comprising protruding pad interconnects
- Patent number 11,776,888
- Issue date Oct 3, 2023
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semi-embedded trace structure with partially buried traces
- Patent number 11,764,076
- Issue date Sep 19, 2023
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) package with stacked die wire bond connecti...
- Patent number 11,676,905
- Issue date Jun 13, 2023
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Uniform via pad structure having covered traces between partially c...
- Patent number 11,637,057
- Issue date Apr 25, 2023
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with local high-density routing region embedded within an...
- Patent number 11,605,595
- Issue date Mar 14, 2023
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passive component embedded in an embedded trace substrate (ETS)
- Patent number 11,552,023
- Issue date Jan 10, 2023
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate comprising a high-density interconnect portion embedded i...
- Patent number 11,552,015
- Issue date Jan 10, 2023
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising an integrated device coupled to a substrate thro...
- Patent number 11,545,439
- Issue date Jan 3, 2023
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double sided embedded trace substrate
- Patent number 11,545,435
- Issue date Jan 3, 2023
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump pad structure
- Patent number 11,527,498
- Issue date Dec 13, 2022
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising a substrate with interconnect routing over solde...
- Patent number 11,444,019
- Issue date Sep 13, 2022
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) packages employing a thermal conductive pac...
- Patent number 11,437,335
- Issue date Sep 6, 2022
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising a substrate configured as a heat spreader
- Patent number 11,404,343
- Issue date Aug 2, 2022
- QUALCOMM Incorporated
- David Fraser Rae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-dielectric structure in two-layer embedded trace substrate
- Patent number 11,342,254
- Issue date May 24, 2022
- QUALCOMM Incorporated
- Joan Rey Villarba Buot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate comprising recessed interconnects and a surface mounted p...
- Patent number 11,075,260
- Issue date Jul 27, 2021
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ground shield plane for ball grid array (BGA) package
- Patent number 10,971,455
- Issue date Apr 6, 2021
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Split conductive pad for device terminal
- Patent number 10,879,158
- Issue date Dec 29, 2020
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density embedded interconnects in substrate
- Patent number 10,804,195
- Issue date Oct 13, 2020
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High thermal release interposer
- Patent number 10,679,919
- Issue date Jun 9, 2020
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile integrated package
- Patent number 10,651,160
- Issue date May 12, 2020
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnects in an embedded trace substrate (ETS) com...
- Patent number 10,622,292
- Issue date Apr 14, 2020
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) package and package substrate comprising st...
- Patent number 10,157,824
- Issue date Dec 18, 2018
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE EMPLOYING CORE WITH CAVITY EMBEDDING REDUCED HEIGHT ELECT...
- Publication number 20240371736
- Publication date Nov 7, 2024
- QUALCOMM Incorporated
- Omar James Bchir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HAVING ELECTRONIC COMPONENT MOUNTED IN A CAVITY OF A CORE...
- Publication number 20240373561
- Publication date Nov 7, 2024
- QUALCOMM Incorporated
- Jung Won PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE HAVING ELECTRONIC COMPONENT MOUNTED IN A CAVITY O...
- Publication number 20240371737
- Publication date Nov 7, 2024
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE HAVING EMBEDDED ELECTRONIC COMPONENT MOUNTED ON C...
- Publication number 20240373560
- Publication date Nov 7, 2024
- QUALCOMM Incorporated
- Seongryul CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PLACED ON CORE OF SUBSTRATE
- Publication number 20240371775
- Publication date Nov 7, 2024
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE HAVING EMBEDDED ELECTRONIC COMPONENT IN A CORE OF...
- Publication number 20240373562
- Publication date Nov 7, 2024
- QUALCOMM Incorporated
- Seongryul CHOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE(S) FOR AN INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A MET...
- Publication number 20240355712
- Publication date Oct 24, 2024
- QUALCOMM Incorporated
- Michelle Yejin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED TRACE SUBSTRATES (ETSs) WITH T-SHAPED INTERCONNECTS WITH R...
- Publication number 20240250009
- Publication date Jul 25, 2024
- QUALCOMM Incorporated
- Seongryul Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH POST INTERCONNECTS HAVING A PRO...
- Publication number 20240079307
- Publication date Mar 7, 2024
- QUALCOMM Incorporated
- Wei WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH A BUMP PAD INTERCONNECT COMPRIS...
- Publication number 20230352390
- Publication date Nov 2, 2023
- QUALCOMM Incorporated
- Chin-Kwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH A SUBSTRATE COMPRISING EMBEDDED ESCAPE INTERCONNECTS A...
- Publication number 20230282585
- Publication date Sep 7, 2023
- QUALCOMM Incorporated
- Kuiwon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATES WITH EMBEDDED DIE-SIDE, FACE-UP DEEP TRENCH CAPA...
- Publication number 20230215849
- Publication date Jul 6, 2023
- QUALCOMM Incorporated
- Seongryul Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING A PACKAGE SUBSTRATE WITH...
- Publication number 20230163112
- Publication date May 25, 2023
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING SUPPLEMENTAL METAL LAYER...
- Publication number 20230118028
- Publication date Apr 20, 2023
- QUALCOMM Incorporated
- Michelle Yejin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED TRACE SUBSTRATE (ETS) WITH EMBEDDED METAL TRACES HAVING MU...
- Publication number 20230114404
- Publication date Apr 13, 2023
- QUALCOMM Incorporated
- Seongryul Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH HIGH-DENSITY INTERCONNECTS
- Publication number 20230073823
- Publication date Mar 9, 2023
- QUALCOMM Incorporated
- Chin-Kwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH A SUBSTRATE COMPRISING PROTRUDING PAD INTERCONNECTS
- Publication number 20220384328
- Publication date Dec 1, 2022
- QUALCOMM Incorporated
- Kuiwon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMI-EMBEDDED TRACE STRUCTURE WITH PARTIALLY BURIED TRACES
- Publication number 20220172963
- Publication date Jun 2, 2022
- QUALCOMM Incorporated
- Kuiwon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY ETCH BACK SUBSTRATE INTERCONNECTIONS
- Publication number 20220108918
- Publication date Apr 7, 2022
- QUALCOMM Incorporated
- Kuiwon KANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
BUMP PAD STRUCTURE
- Publication number 20220102298
- Publication date Mar 31, 2022
- QUALCOMM Incorporated
- Kuiwon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING AN INTEGRATED DEVICE COUPLED TO A SUBSTRATE THRO...
- Publication number 20220077069
- Publication date Mar 10, 2022
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE SUBSTRATE WITH EMBEDDED TRACE SUBST...
- Publication number 20220068780
- Publication date Mar 3, 2022
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES WITH LOCAL HIGH-DENSITY ROUTING REGION EMBEDDED WITHIN AN...
- Publication number 20220051988
- Publication date Feb 17, 2022
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE WITH STACKED DIE WIRE BOND CONNECTI...
- Publication number 20220037257
- Publication date Feb 3, 2022
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE COMPONENT EMBEDDED IN AN EMBEDDED TRACE SUBSTRATE (ETS)
- Publication number 20210407918
- Publication date Dec 30, 2021
- QUALCOMM Incorporated
- Kuiwon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE COMPRISING A HIGH-DENSITY INTERCONNECT PORTION EMBEDDED I...
- Publication number 20210391247
- Publication date Dec 16, 2021
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICORE SUBSTRATE
- Publication number 20210375736
- Publication date Dec 2, 2021
- QUALCOMM Incorporated
- Joan Rey Villarba BUOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH INTERCONNECT ROUTING OVER SOLDE...
- Publication number 20210313266
- Publication date Oct 7, 2021
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIELECTRIC STRUCTURE IN TWO-LAYER EMBEDDED TRACE SUBSTRATE
- Publication number 20210287976
- Publication date Sep 16, 2021
- QUALCOMM Incorporated
- Joan Rey Villarba BUOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE CONFIGURED AS A HEAT SPREADER
- Publication number 20210249325
- Publication date Aug 12, 2021
- QUALCOMM Incorporated
- David Fraser RAE
- H01 - BASIC ELECTRIC ELEMENTS

Kuiwon KANG

Person

Patents Grantslast 30 patents

Integrated circuit (IC) packages employing a package substrate with...

Package with a substrate comprising protruding pad interconnects

Semi-embedded trace structure with partially buried traces

Integrated circuit (IC) package with stacked die wire bond connecti...

Uniform via pad structure having covered traces between partially c...

Packages with local high-density routing region embedded within an...

Passive component embedded in an embedded trace substrate (ETS)

Substrate comprising a high-density interconnect portion embedded i...

Package comprising an integrated device coupled to a substrate thro...

Double sided embedded trace substrate

Bump pad structure

Package comprising a substrate with interconnect routing over solde...

Integrated circuit (IC) packages employing a thermal conductive pac...

Package comprising a substrate configured as a heat spreader

Multi-dielectric structure in two-layer embedded trace substrate

Substrate comprising recessed interconnects and a surface mounted p...

Ground shield plane for ball grid array (BGA) package

Split conductive pad for device terminal

High density embedded interconnects in substrate

High thermal release interposer

Low profile integrated package

High density interconnects in an embedded trace substrate (ETS) com...

Integrated circuit (IC) package and package substrate comprising st...

Patents Applicationslast 30 patents

SUBSTRATE EMPLOYING CORE WITH CAVITY EMBEDDING REDUCED HEIGHT ELECT...

SUBSTRATE HAVING ELECTRONIC COMPONENT MOUNTED IN A CAVITY OF A CORE...

PACKAGE SUBSTRATE HAVING ELECTRONIC COMPONENT MOUNTED IN A CAVITY O...

PACKAGE SUBSTRATE HAVING EMBEDDED ELECTRONIC COMPONENT MOUNTED ON C...

ELECTRONIC COMPONENT PLACED ON CORE OF SUBSTRATE

PACKAGE SUBSTRATE HAVING EMBEDDED ELECTRONIC COMPONENT IN A CORE OF...

SUBSTRATE(S) FOR AN INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A MET...

EMBEDDED TRACE SUBSTRATES (ETSs) WITH T-SHAPED INTERCONNECTS WITH R...

PACKAGE COMPRISING A SUBSTRATE WITH POST INTERCONNECTS HAVING A PRO...

PACKAGE COMPRISING A SUBSTRATE WITH A BUMP PAD INTERCONNECT COMPRIS...

PACKAGE WITH A SUBSTRATE COMPRISING EMBEDDED ESCAPE INTERCONNECTS A...

PACKAGE SUBSTRATES WITH EMBEDDED DIE-SIDE, FACE-UP DEEP TRENCH CAPA...

INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING A PACKAGE SUBSTRATE WITH...

INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING SUPPLEMENTAL METAL LAYER...

EMBEDDED TRACE SUBSTRATE (ETS) WITH EMBEDDED METAL TRACES HAVING MU...

PACKAGE COMPRISING A SUBSTRATE WITH HIGH-DENSITY INTERCONNECTS

PACKAGE WITH A SUBSTRATE COMPRISING PROTRUDING PAD INTERCONNECTS

SEMI-EMBEDDED TRACE STRUCTURE WITH PARTIALLY BURIED TRACES

DRY ETCH BACK SUBSTRATE INTERCONNECTIONS

BUMP PAD STRUCTURE

PACKAGE COMPRISING AN INTEGRATED DEVICE COUPLED TO A SUBSTRATE THRO...

INTEGRATED CIRCUIT (IC) PACKAGE SUBSTRATE WITH EMBEDDED TRACE SUBST...

PACKAGES WITH LOCAL HIGH-DENSITY ROUTING REGION EMBEDDED WITHIN AN...

INTEGRATED CIRCUIT (IC) PACKAGE WITH STACKED DIE WIRE BOND CONNECTI...

PASSIVE COMPONENT EMBEDDED IN AN EMBEDDED TRACE SUBSTRATE (ETS)

SUBSTRATE COMPRISING A HIGH-DENSITY INTERCONNECT PORTION EMBEDDED I...

MULTICORE SUBSTRATE

PACKAGE COMPRISING A SUBSTRATE WITH INTERCONNECT ROUTING OVER SOLDE...

MULTI-DIELECTRIC STRUCTURE IN TWO-LAYER EMBEDDED TRACE SUBSTRATE

PACKAGE COMPRISING A SUBSTRATE CONFIGURED AS A HEAT SPREADER