Kumar Abhishek Singh

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Coupled cooling fins in ultra-small systems
- Patent number 11,574,851
- Issue date Feb 7, 2023
- Intel Corporation
- Aastha Uppal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management solutions for integrated circuit packages
- Patent number 11,545,407
- Issue date Jan 3, 2023
- Intel Corporation
- Kumar Abhishek Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-trenching mold interface in a pop package
- Patent number 11,462,527
- Issue date Oct 4, 2022
- Intel Corporation
- Kumar Abhishek Singh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THERMAL INTERFACE STRUCTURES FOR OPTICAL COMMUNICATION DEVICES
- Publication number 20220390694
- Publication date Dec 8, 2022
- Intel Corporation
- Chia-Pin Chiu
- G02 - OPTICS
Information Patent Application
IC DIE PACKAGE THERMAL SPREADER AND EMI SHIELD COMPRISING GRAPHITE
- Publication number 20200273811
- Publication date Aug 27, 2020
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRYSTALLINE CARBON HEAT SPREADING MATERIALS FOR IC DIE HOT SPOT RED...
- Publication number 20200273768
- Publication date Aug 27, 2020
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COUPLED COOLING FINS IN ULTRA-SMALL SYSTEMS
- Publication number 20200273772
- Publication date Aug 27, 2020
- Intel Corporation
- Aastha Uppal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20200227332
- Publication date Jul 16, 2020
- Intel Corporation
- Kumar Abhishek Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-TRENCHING MOLD INTERFACE IN A POP PACKAGE
- Publication number 20200035658
- Publication date Jan 30, 2020
- Intel Corporation
- Kumar Abhishek SINGH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIVERSAL PICK AND PLACE HEAD FOR HANDLING COMPONENTS OF ANY SHAPE
- Publication number 20170166407
- Publication date Jun 15, 2017
- Intel Corporation
- Kumar Abhishek Singh
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS

Kumar Abhishek Singh

Person

Patents Grantslast 30 patents

Coupled cooling fins in ultra-small systems

Thermal management solutions for integrated circuit packages

Micro-trenching mold interface in a pop package

Patents Applicationslast 30 patents

THERMAL INTERFACE STRUCTURES FOR OPTICAL COMMUNICATION DEVICES

IC DIE PACKAGE THERMAL SPREADER AND EMI SHIELD COMPRISING GRAPHITE

CRYSTALLINE CARBON HEAT SPREADING MATERIALS FOR IC DIE HOT SPOT RED...

COUPLED COOLING FINS IN ULTRA-SMALL SYSTEMS

THERMAL MANAGEMENT SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES

MICRO-TRENCHING MOLD INTERFACE IN A POP PACKAGE

UNIVERSAL PICK AND PLACE HEAD FOR HANDLING COMPONENTS OF ANY SHAPE