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Kumar Nagarajan
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Cupertino, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Structure and method for hybrid optical package with glass top cover
Patent number
10,461,066
Issue date
Oct 29, 2019
Maxim Integrated Products, Inc.
Kumar Nagarajan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Optical sensor having a light emitter and a photodetector assembly...
Patent number
9,627,573
Issue date
Apr 18, 2017
Maxim Integreated Products, Inc.
Jerome C. Bhat
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Embedded die redistribution layers for active device
Patent number
9,443,815
Issue date
Sep 13, 2016
Maxim Integrated Products, Inc.
Kai Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sacrificial pad on semiconductor package device and method
Patent number
9,397,027
Issue date
Jul 19, 2016
Maxim Integrated Products, Inc.
Xiansong Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer level lens in package
Patent number
9,354,111
Issue date
May 31, 2016
Maxim Integrated Products, Inc.
Nicole D. Kerness
G01 - MEASURING TESTING
Information
Patent Grant
Stacked LED for optical sensor devices
Patent number
9,136,258
Issue date
Sep 15, 2015
Maxim Integrated Products, Inc.
Ken Wang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SYSTEM PACKAGING FOR CELLULAR MODEM AND TRANSCEIVER SYSTEM OF HETE...
Publication number
20230238365
Publication date
Jul 27, 2023
Apple Inc.
Sidharth S. Dalmia
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Molded Silicon on Passive Package
Publication number
20230178458
Publication date
Jun 8, 2023
Apple Inc.
Kumar Nagarajan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURE AND METHOD FOR HYBRID OPTICAL PACKAGE WITH GLASS TOP COVER
Publication number
20180006003
Publication date
Jan 4, 2018
Maxim Integrated Products, Inc.
KUMAR NAGARAJAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LID ASSEMBLY FOR THERMOPILE TEMPERATURE SENSING DEVICE IN THERMAL G...
Publication number
20150380627
Publication date
Dec 31, 2015
QUALCOMM TECHNOLOGIES, INC.
Arvin Emadi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EMBEDDED DIE REDISTRIBUTION LAYERS FOR ACTIVE DEVICE
Publication number
20150243590
Publication date
Aug 27, 2015
Maxim Integrated Products, Inc.
Kai Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OPTICAL SENSOR HAVING A LIGHT EMITTER AND A PHOTODETECTOR ASSEMBLY...
Publication number
20150243824
Publication date
Aug 27, 2015
Maxim Integrated Products, Inc.
Jerome C. Bhat
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER LEVEL LENS IN PACKAGE
Publication number
20150109785
Publication date
Apr 23, 2015
Maxim Integrated Products, Inc.
Nicole D. Kerness
F21 - LIGHTING