Kumar Nagarajan

Person

Cupertino, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Molded silicon on passive package
- Patent number 12,165,956
- Issue date Dec 10, 2024
- Apple Inc.
- Kumar Nagarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for hybrid optical package with glass top cover
- Patent number 10,461,066
- Issue date Oct 29, 2019
- Maxim Integrated Products, Inc.
- Kumar Nagarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical sensor having a light emitter and a photodetector assembly...
- Patent number 9,627,573
- Issue date Apr 18, 2017
- Maxim Integreated Products, Inc.
- Jerome C. Bhat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die redistribution layers for active device
- Patent number 9,443,815
- Issue date Sep 13, 2016
- Maxim Integrated Products, Inc.
- Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sacrificial pad on semiconductor package device and method
- Patent number 9,397,027
- Issue date Jul 19, 2016
- Maxim Integrated Products, Inc.
- Xiansong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level lens in package
- Patent number 9,354,111
- Issue date May 31, 2016
- Maxim Integrated Products, Inc.
- Nicole D. Kerness
- G01 - MEASURING TESTING
Information Patent Grant
Stacked LED for optical sensor devices
- Patent number 9,136,258
- Issue date Sep 15, 2015
- Maxim Integrated Products, Inc.
- Ken Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM PACKAGING FOR CELLULAR MODEM AND TRANSCEIVER SYSTEM OF HETE...
- Publication number 20230238365
- Publication date Jul 27, 2023
- Apple Inc.
- Sidharth S. Dalmia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded Silicon on Passive Package
- Publication number 20230178458
- Publication date Jun 8, 2023
- Apple Inc.
- Kumar Nagarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR HYBRID OPTICAL PACKAGE WITH GLASS TOP COVER
- Publication number 20180006003
- Publication date Jan 4, 2018
- Maxim Integrated Products, Inc.
- KUMAR NAGARAJAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LID ASSEMBLY FOR THERMOPILE TEMPERATURE SENSING DEVICE IN THERMAL G...
- Publication number 20150380627
- Publication date Dec 31, 2015
- QUALCOMM TECHNOLOGIES, INC.
- Arvin Emadi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED DIE REDISTRIBUTION LAYERS FOR ACTIVE DEVICE
- Publication number 20150243590
- Publication date Aug 27, 2015
- Maxim Integrated Products, Inc.
- Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSOR HAVING A LIGHT EMITTER AND A PHOTODETECTOR ASSEMBLY...
- Publication number 20150243824
- Publication date Aug 27, 2015
- Maxim Integrated Products, Inc.
- Jerome C. Bhat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL LENS IN PACKAGE
- Publication number 20150109785
- Publication date Apr 23, 2015
- Maxim Integrated Products, Inc.
- Nicole D. Kerness
- F21 - LIGHTING

Kumar Nagarajan

Person

Patents Grantslast 30 patents

Molded silicon on passive package

Structure and method for hybrid optical package with glass top cover

Optical sensor having a light emitter and a photodetector assembly...

Embedded die redistribution layers for active device

Sacrificial pad on semiconductor package device and method

Wafer level lens in package

Stacked LED for optical sensor devices

Patents Applicationslast 30 patents

SYSTEM PACKAGING FOR CELLULAR MODEM AND TRANSCEIVER SYSTEM OF HETE...

Molded Silicon on Passive Package

STRUCTURE AND METHOD FOR HYBRID OPTICAL PACKAGE WITH GLASS TOP COVER

LID ASSEMBLY FOR THERMOPILE TEMPERATURE SENSING DEVICE IN THERMAL G...

EMBEDDED DIE REDISTRIBUTION LAYERS FOR ACTIVE DEVICE

OPTICAL SENSOR HAVING A LIGHT EMITTER AND A PHOTODETECTOR ASSEMBLY...

WAFER LEVEL LENS IN PACKAGE