Kun-Ming HUANG

Person

Chupei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package structure with landing pads and manufacturing...
- Patent number 11,437,336
- Issue date Sep 6, 2022
- Powertech Technology Inc.
- Jeffrey Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,289,401
- Issue date Mar 29, 2022
- Powertech Technology Inc.
- Kun-Yung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of redistribution layer
- Patent number 10,607,856
- Issue date Mar 31, 2020
- Powertech Technology Inc.
- Kun-Yung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 10,460,959
- Issue date Oct 29, 2019
- Powertech Technology Inc.
- Kun-Yung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power conversion device, time signal generator and method thereof
- Patent number 10,284,088
- Issue date May 7, 2019
- uPI Semiconductor Corp.
- Kun-Min Huang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 10,276,545
- Issue date Apr 30, 2019
- Powertech Technology Inc.
- Kun-Yung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulating composition, semiconductor package and manufacturing...
- Patent number 10,177,058
- Issue date Jan 8, 2019
- Powertech Technology Inc.
- Ming-Yi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Information transmission system and method
- Patent number 9,667,434
- Issue date May 30, 2017
- Sonix Technology Co., Ltd.
- Kun-Ming Huang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
IP camera, communication method and communication system
- Patent number 9,609,378
- Issue date Mar 28, 2017
- SONIX Technology Co., Ltd.
- Chung-Chih Ko
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Time signal generating circuit and time signal generating method
- Patent number 9,548,728
- Issue date Jan 17, 2017
- uPI Semiconductor Corp.
- Kun-Min Huang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Time signal generating circuit and time signal generating method
- Patent number 9,401,701
- Issue date Jul 26, 2016
- uPI Semiconductor Corp.
- Kun-Min Huang
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGING ASSEMBLY AND SEMICONDUCTOR PACKAGING STRUCTURE
- Publication number 20230223311
- Publication date Jul 13, 2023
- Powertech Technology Inc.
- Kun-Yung HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210343674
- Publication date Nov 4, 2021
- Powertech Technology Inc.
- Jeffrey Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20200365486
- Publication date Nov 19, 2020
- Powertech Technology Inc.
- Kun-Yung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGE WITH WARPAGE REDUCTION AND MANUFACTURING METHOD THE...
- Publication number 20200211980
- Publication date Jul 2, 2020
- Powertech Technology Inc.
- Kun-Yung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20190287820
- Publication date Sep 19, 2019
- Powertech Technology Inc.
- Kun-Yung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERSION DEVICE, TIME SIGNAL GENERATOR AND METHOD THEREOF
- Publication number 20190115832
- Publication date Apr 18, 2019
- uPI Semiconductor Corp.
- Kun-Min Huang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20190006305
- Publication date Jan 3, 2019
- Powertech Technology Inc.
- Kun-Yung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF REDISTRIBUTION LAYER
- Publication number 20180366344
- Publication date Dec 20, 2018
- Powertech Technology Inc.
- Kun-Yung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20180226442
- Publication date Aug 9, 2018
- Powertech Technology Inc.
- Kun-Yung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFORMATION TRANSMISSION SYSTEM AND METHOD
- Publication number 20160294573
- Publication date Oct 6, 2016
- Sonix Technology Co., Ltd
- Kun-Ming HUANG
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Application
TIME SIGNAL GENERATING CIRCUIT AND TIME SIGNAL GENERATING METHOD
- Publication number 20160277016
- Publication date Sep 22, 2016
- uPI Semiconductor Corp.
- Kun-Min Huang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
IP CAMERA, COMMUNICATION METHOD AND COMMUNICATION SYSTEM
- Publication number 20150163534
- Publication date Jun 11, 2015
- SONIX TECHNOLOGY CO., LTD.
- Chung-Chih Ko
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Kun-Ming HUANG

Person

Patents Grantslast 30 patents

Semiconductor package structure with landing pads and manufacturing...

Semiconductor package

Manufacturing method of redistribution layer

Package structure and manufacturing method thereof

Power conversion device, time signal generator and method thereof

Semiconductor package and manufacturing method thereof

Encapsulating composition, semiconductor package and manufacturing...

Information transmission system and method

IP camera, communication method and communication system

Time signal generating circuit and time signal generating method

Time signal generating circuit and time signal generating method

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGING ASSEMBLY AND SEMICONDUCTOR PACKAGING STRUCTURE

SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

FAN-OUT PACKAGE WITH WARPAGE REDUCTION AND MANUFACTURING METHOD THE...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

POWER CONVERSION DEVICE, TIME SIGNAL GENERATOR AND METHOD THEREOF

SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF REDISTRIBUTION LAYER

IMAGE SENSOR AND MANUFACTURING METHOD THEREOF

INFORMATION TRANSMISSION SYSTEM AND METHOD

TIME SIGNAL GENERATING CIRCUIT AND TIME SIGNAL GENERATING METHOD

IP CAMERA, COMMUNICATION METHOD AND COMMUNICATION SYSTEM