Kundae Yeom

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Cheonan-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor module adapted to be inserted into connector of exter...
- Patent number 10,008,488
- Issue date Jun 26, 2018
- Samsung Electronics Co., Inc.
- Yongkwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,024,426
- Issue date May 5, 2015
- Samsung Electronics Co., Ltd.
- Kundae Yeom
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250014963
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Yongkwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGES
- Publication number 20220093673
- Publication date Mar 24, 2022
- Samsung Electronics Co., Ltd.
- Raehyung DO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MODULE SUBSTRATE AND SEMICONDUCTOR MODULE
- Publication number 20170309606
- Publication date Oct 26, 2017
- Samsung Electronics Co., Ltd.
- Yongkwan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140103516
- Publication date Apr 17, 2014
- Kundae Yeom
- H01 - BASIC ELECTRIC ELEMENTS