Kuniaki Horie

Person

Yamato-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electrochemical deposition method
- Patent number 9,624,596
- Issue date Apr 18, 2017
- Ebara Corporation
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrochemical deposition method
- Patent number 9,593,430
- Issue date Mar 14, 2017
- Ebara Corporation
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrochemical deposition method
- Patent number 9,506,162
- Issue date Nov 29, 2016
- Ebara Corporation
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrochemical deposition method
- Patent number 9,388,505
- Issue date Jul 12, 2016
- Ebara Corporation
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrochemical deposition apparatus
- Patent number 8,936,705
- Issue date Jan 20, 2015
- Ebara Corporation
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Substrate holder and plating apparatus
- Patent number 8,337,680
- Issue date Dec 25, 2012
- Ebara Corporation
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Substrate holder and plating apparatus
- Patent number 7,901,551
- Issue date Mar 8, 2011
- Ebara Corporation
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Substrate holder and plating apparatus
- Patent number 7,601,248
- Issue date Oct 13, 2009
- Ebara Corporation
- Junichiro Yoshioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for forming thin film of metal
- Patent number 6,972,256
- Issue date Dec 6, 2005
- Ebara Corporation
- Akira Fukunaga
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Coating, modification and etching of substrate surface with particl...
- Patent number 6,921,722
- Issue date Jul 26, 2005
- Ebara Corporation
- Naoaki Ogure
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus of producing thin film of metal or metal compound
- Patent number 6,780,245
- Issue date Aug 24, 2004
- Ebara Corporation
- Kuniaki Horie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of and apparatus for forming interconnection
- Patent number 6,730,596
- Issue date May 4, 2004
- Ebara Corporation
- Akira Fukunaga
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus of producing thin film of metal or metal compound
- Patent number 6,517,642
- Issue date Feb 11, 2003
- Ebara Corporation
- Kuniaki Horie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Trap apparatus
- Patent number 6,488,774
- Issue date Dec 3, 2002
- Ebara Corporation
- Kuniaki Horie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High energy sputtering method for forming interconnects
- Patent number 6,458,694
- Issue date Oct 1, 2002
- Ebara Corporation
- Naoaki Ogure
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Positive displacement type liquid-delivery apparatus
- Patent number 6,419,462
- Issue date Jul 16, 2002
- Ebara Corporation
- Kuniaki Horie
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Apparatus and method for processing substrate
- Patent number 6,387,182
- Issue date May 14, 2002
- Ebara Corporation
- Kuniaki Horie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Liquid feed vaporization system and gas injection device
- Patent number 6,282,368
- Issue date Aug 28, 2001
- Ebara Corporation
- Kuniaki Horie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Liquid feed vaporization system and gas injection device
- Patent number 6,269,221
- Issue date Jul 31, 2001
- Ebara Corporation
- Kuniaki Horie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Liquid feed vaporization system and gas injection device
- Patent number 6,195,504
- Issue date Feb 27, 2001
- Ebara Corporation
- Kuniaki Horie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Thin-film deposition apparatus
- Patent number 6,176,929
- Issue date Jan 23, 2001
- Ebara Corporation
- Yukio Fukunaga
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Vapor-phase film growth apparatus and gas ejection head
- Patent number 6,132,512
- Issue date Oct 17, 2000
- Ebara Corporation
- Kuniaki Horie
- C30 - CRYSTAL GROWTH
Information Patent Grant
Valving device
- Patent number 6,116,267
- Issue date Sep 12, 2000
- Ebara Corporation
- Hidenao Suzuki
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Vaporizer apparatus and film deposition apparatus therewith
- Patent number 5,951,923
- Issue date Sep 14, 1999
- Ebara Corporation
- Kuniaki Horie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Vapor feed supply system
- Patent number 5,950,646
- Issue date Sep 14, 1999
- Ebara Corporation
- Kuniaki Horie
- B08 - CLEANING
Information Patent Grant
Vaporizer apparatus
- Patent number 5,862,605
- Issue date Jan 26, 1999
- Ebara Corporation
- Kuniaki Horie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
ELECTROCHEMICAL DEPOSITION METHOD
- Publication number 20160319455
- Publication date Nov 3, 2016
- EBARA CORPORATION
- Junichiro YOSHIOKA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROCHEMICAL DEPOSITION METHOD
- Publication number 20160319454
- Publication date Nov 3, 2016
- EBARA CORPORATION
- Junichiro YOSHIOKA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROCHEMICAL DEPOSITION METHOD
- Publication number 20160319456
- Publication date Nov 3, 2016
- EBARA CORPORATION
- Junichiro YOSHIOKA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROCHEMICAL DEPOSITION METHOD
- Publication number 20150136610
- Publication date May 21, 2015
- EBARA CORPORATION
- Junichiro YOSHIOKA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrochemical deposition apparatus
- Publication number 20130081941
- Publication date Apr 4, 2013
- EBARA CORPORATION
- Junichiro YOSHIOKA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND PLATING METHOD
- Publication number 20130015075
- Publication date Jan 17, 2013
- Masahiko SEKIMOTO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE HOLDER AND PLATING APPARATUS
- Publication number 20110127159
- Publication date Jun 2, 2011
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Substrate Holder and Plating Apparatus
- Publication number 20100000858
- Publication date Jan 7, 2010
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND PLATING METHOD
- Publication number 20090301395
- Publication date Dec 10, 2009
- Masahiko SEKIMOTO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating apparatus and plating method
- Publication number 20060141157
- Publication date Jun 29, 2006
- Masahiko Sekimoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Substrate holder and plating apparatus
- Publication number 20050014368
- Publication date Jan 20, 2005
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method and apparatus of producing thin film of metal or metal compound
- Publication number 20030098531
- Publication date May 29, 2003
- EBARA CORPORATION
- Kuniaki Horie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and apparatus for forming thin film of metal
- Publication number 20020160103
- Publication date Oct 31, 2002
- Akira Fukunaga
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and apparatus for forming interconnect
- Publication number 20020009883
- Publication date Jan 24, 2002
- Naoaki Ogure
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Coating, modification and etching of substrate surface with particl...
- Publication number 20010055649
- Publication date Dec 27, 2001
- Naoaki Ogure
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and apparatus of producing thin film of metal or metal compound
- Publication number 20010010837
- Publication date Aug 2, 2001
- Kuniaki Horie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Kuniaki Horie

Person

Patents Grantslast 30 patents

Electrochemical deposition method

Electrochemical deposition method

Electrochemical deposition method

Electrochemical deposition method

Electrochemical deposition apparatus

Substrate holder and plating apparatus

Substrate holder and plating apparatus

Substrate holder and plating apparatus

Method and apparatus for forming thin film of metal

Coating, modification and etching of substrate surface with particl...

Method and apparatus of producing thin film of metal or metal compound

Method of and apparatus for forming interconnection

Method and apparatus of producing thin film of metal or metal compound

Trap apparatus

High energy sputtering method for forming interconnects

Positive displacement type liquid-delivery apparatus

Apparatus and method for processing substrate

Liquid feed vaporization system and gas injection device

Liquid feed vaporization system and gas injection device

Liquid feed vaporization system and gas injection device

Thin-film deposition apparatus

Vapor-phase film growth apparatus and gas ejection head

Valving device

Vaporizer apparatus and film deposition apparatus therewith

Vapor feed supply system

Vaporizer apparatus

Patents Applicationslast 30 patents

ELECTROCHEMICAL DEPOSITION METHOD

ELECTROCHEMICAL DEPOSITION METHOD

ELECTROCHEMICAL DEPOSITION METHOD

ELECTROCHEMICAL DEPOSITION METHOD

Electrochemical deposition apparatus

PLATING APPARATUS AND PLATING METHOD

SUBSTRATE HOLDER AND PLATING APPARATUS

Substrate Holder and Plating Apparatus

PLATING APPARATUS AND PLATING METHOD

Plating apparatus and plating method

Substrate holder and plating apparatus

Method and apparatus of producing thin film of metal or metal compound

Method and apparatus for forming thin film of metal

Method and apparatus for forming interconnect

Coating, modification and etching of substrate surface with particl...

Method and apparatus of producing thin film of metal or metal compound