Kuniaki Mamitsu

Person

Okazaki-city, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 10,079,226
- Issue date Sep 18, 2018
- Denso Corporation
- Kuniaki Mamitsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including cooler
- Patent number 9,070,666
- Issue date Jun 30, 2015
- Denso Corporation
- Kuniaki Mamitsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with surface electrodes
- Patent number 8,963,315
- Issue date Feb 24, 2015
- Denso Corporation
- Daisuke Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including cooler
- Patent number 8,957,517
- Issue date Feb 17, 2015
- Denso Corporation
- Kuniaki Mamitsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including cooler
- Patent number 8,884,426
- Issue date Nov 11, 2014
- Denso Corporation
- Kuniaki Mamitsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package cooled by grounded cooler
- Patent number 8,558,375
- Issue date Oct 15, 2013
- Denso Corporation
- Kuniaki Mamitsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fixing structure and fixing method of circuit board with embedded e...
- Patent number 8,547,697
- Issue date Oct 1, 2013
- Denso Corporation
- Keita Fukutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module and method of manufacturing the same
- Patent number 8,497,572
- Issue date Jul 30, 2013
- Denso Corporation
- Keita Fukutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having semiconductor chip and metal plate
- Patent number 8,441,122
- Issue date May 14, 2013
- Denso Corporation
- Daisuke Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus having a two-side heat radiation structure
- Patent number 8,278,747
- Issue date Oct 2, 2012
- Denso Corporation
- Kuniaki Mamitsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,125,781
- Issue date Feb 28, 2012
- Denso Corporation
- Kuniaki Mamitsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module
- Patent number 7,957,135
- Issue date Jun 7, 2011
- Denso Corporation
- Yasuyuki Ohkouchi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor module molded by resin with heat radiation plate open...
- Patent number 7,944,045
- Issue date May 17, 2011
- Denso Corporation
- Chikage Noritake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin mold type semiconductor device
- Patent number 7,728,413
- Issue date Jun 1, 2010
- Denso Corporation
- Tomoo Iwade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device
- Patent number 7,573,687
- Issue date Aug 11, 2009
- Denso Corporation
- Kuniaki Mamitsu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device
- Patent number 7,470,939
- Issue date Dec 30, 2008
- Denso Corporation
- Akira Mochida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having semiconductor chip on base through sold...
- Patent number 7,345,369
- Issue date Mar 18, 2008
- Denso Corporation
- Naoki Hirasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having heat radiation plate and bonding member
- Patent number 7,239,016
- Issue date Jul 3, 2007
- Denso Corporation
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having metallic plate with groove
- Patent number 7,235,876
- Issue date Jun 26, 2007
- Denso Corporation
- Tomomi Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer-molded power device and method for manufacturing transfer-...
- Patent number 7,145,254
- Issue date Dec 5, 2006
- Denso Corporation
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,091,603
- Issue date Aug 15, 2006
- Denso Corporation
- Kuniaki Mamitsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having radiation structure
- Patent number 6,992,383
- Issue date Jan 31, 2006
- Denso Corporation
- Kuniaki Mamitsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having radiation structure
- Patent number 6,967,404
- Issue date Nov 22, 2005
- Denso Corporation
- Kuniaki Mamitsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having radiation structure
- Patent number 6,960,825
- Issue date Nov 1, 2005
- Denso Corporation
- Kuniaki Mamitsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having radiation structure
- Patent number 6,891,265
- Issue date May 10, 2005
- Denso Corporation
- Kuniaki Mamitsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a protective film
- Patent number 6,803,667
- Issue date Oct 12, 2004
- Denso Corporation
- Yasushi Okura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having radiation structure
- Patent number 6,798,062
- Issue date Sep 28, 2004
- Denso Corporation
- Kuniaki Mamitsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having radiation structure
- Patent number 6,703,707
- Issue date Mar 9, 2004
- Denso Corporation
- Kuniaki Mamitsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having radiation structure and method for manu...
- Patent number 6,693,350
- Issue date Feb 17, 2004
- Denso Corporation
- Takanori Teshima
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING COOLER
- Publication number 20140361425
- Publication date Dec 11, 2014
- Kuniaki MAMITSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING COOLER
- Publication number 20140203426
- Publication date Jul 24, 2014
- DENSO CORPORATION
- Kuniaki MAMITSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING COOLER
- Publication number 20140015120
- Publication date Jan 16, 2014
- DENSO CORPORATION
- Kuniaki MAMITSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120119347
- Publication date May 17, 2012
- DENSO CORPORATION
- Kuniaki Mamitsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120001318
- Publication date Jan 5, 2012
- DENSO CORPORATION
- Kuniaki MAMITSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120001308
- Publication date Jan 5, 2012
- DENSO CORPORATION
- Keita Fukutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIXING STRUCTURE AND FIXING METHOD OF CIRCUIT BOARD WITH EMBEDDED E...
- Publication number 20110317366
- Publication date Dec 29, 2011
- DENSO CORPORATION
- Keita FUKUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110186981
- Publication date Aug 4, 2011
- DENSO CORPORATION
- Daisuke Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having semiconductor chip and metal plate and...
- Publication number 20110042741
- Publication date Feb 24, 2011
- DENSO CORPORATION
- Daisuke Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor apparatus having both-side heat radiation structure a...
- Publication number 20090289351
- Publication date Nov 26, 2009
- DENSO CORPORATION
- Kuniaki Mamitsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090224398
- Publication date Sep 10, 2009
- DENSO CORPORATION
- Chikage NORITAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20090201708
- Publication date Aug 13, 2009
- DENSO CORPORATION
- Yasuyuki OHKOUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power semiconductor device
- Publication number 20080117557
- Publication date May 22, 2008
- DENSO CORPORATION
- Kuniaki Mamitsu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Semiconductor device having heat radiation member and semiconductor...
- Publication number 20070236891
- Publication date Oct 11, 2007
- DENSO CORPORATION
- Kuniaki Mamitsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having metallic plate with groove
- Publication number 20070057373
- Publication date Mar 15, 2007
- DENSO CORPORATION
- Tomomi Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resin mold type semiconductor device
- Publication number 20070052072
- Publication date Mar 8, 2007
- DENSO CORPORATION
- Tomoo Iwade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20070018197
- Publication date Jan 25, 2007
- DENSO CORPORATION
- Akira Mochida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20060096299
- Publication date May 11, 2006
- Denso Corporation
- Kuniaki Mamitsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device having semiconductor chip on base through sold...
- Publication number 20060087043
- Publication date Apr 27, 2006
- DENSO CORPORATION
- Naoki Hirasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING RADIATION STRUCTURE
- Publication number 20050167821
- Publication date Aug 4, 2005
- Kuniaki Mamitsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20050167802
- Publication date Aug 4, 2005
- DENSO Corporation
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20050145999
- Publication date Jul 7, 2005
- DENSO Corporation
- Kuniaki Mamitsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having heat radiation plate and bonding member
- Publication number 20050077617
- Publication date Apr 14, 2005
- DENSO Corporation
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having radiation structure
- Publication number 20040097082
- Publication date May 20, 2004
- Kuniaki Mamitsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having radiation structure
- Publication number 20040089940
- Publication date May 13, 2004
- Kuniaki Mamitsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having radiation structure
- Publication number 20040089941
- Publication date May 13, 2004
- Kuniaki Mamitsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having radiation structure
- Publication number 20040089942
- Publication date May 13, 2004
- Kuniaki Mamitsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having radiation structure
- Publication number 20040070060
- Publication date Apr 15, 2004
- Kuniaki Mamitsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having radiation structure
- Publication number 20040070072
- Publication date Apr 15, 2004
- Kuniaki Mamitsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having radiation structure and method for manu...
- Publication number 20030132530
- Publication date Jul 17, 2003
- Takanori Teshima
- H01 - BASIC ELECTRIC ELEMENTS

Kuniaki Mamitsu

Person

Patents Grantslast 30 patents

Semiconductor device

Semiconductor device including cooler

Semiconductor device with surface electrodes

Semiconductor device including cooler

Semiconductor device including cooler

Semiconductor package cooled by grounded cooler

Fixing structure and fixing method of circuit board with embedded e...

Semiconductor module and method of manufacturing the same

Semiconductor device having semiconductor chip and metal plate

Semiconductor apparatus having a two-side heat radiation structure

Semiconductor device

Semiconductor module

Semiconductor module molded by resin with heat radiation plate open...

Resin mold type semiconductor device

Power semiconductor device

Semiconductor device

Semiconductor device having semiconductor chip on base through sold...

Semiconductor device having heat radiation plate and bonding member

Semiconductor device having metallic plate with groove

Transfer-molded power device and method for manufacturing transfer-...

Semiconductor device

Semiconductor device having radiation structure

Semiconductor device having radiation structure

Semiconductor device having radiation structure

Semiconductor device having radiation structure

Semiconductor device having a protective film

Semiconductor device having radiation structure

Semiconductor device having radiation structure

Semiconductor device having radiation structure and method for manu...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE INCLUDING COOLER

SEMICONDUCTOR DEVICE INCLUDING COOLER

SEMICONDUCTOR DEVICE INCLUDING COOLER

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME

FIXING STRUCTURE AND FIXING METHOD OF CIRCUIT BOARD WITH EMBEDDED E...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device having semiconductor chip and metal plate and...

Semiconductor apparatus having both-side heat radiation structure a...

SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR MODULE

Power semiconductor device

Semiconductor device having heat radiation member and semiconductor...

Semiconductor device having metallic plate with groove

Resin mold type semiconductor device

Semiconductor device

Semiconductor device

Semiconductor device having semiconductor chip on base through sold...

SEMICONDUCTOR DEVICE HAVING RADIATION STRUCTURE

Semiconductor device

Semiconductor device

Semiconductor device having heat radiation plate and bonding member

Semiconductor device having radiation structure

Semiconductor device having radiation structure

Semiconductor device having radiation structure

Semiconductor device having radiation structure

Semiconductor device having radiation structure

Semiconductor device having radiation structure

Semiconductor device having radiation structure and method for manu...