Kunihiro Aoki

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Nagano, JP

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Patents Grantslast 30 patents

Information Patent Grant
Resin molding machine and method of resin molding
- Patent number 6,743,389
- Issue date Jun 1, 2004
- Apic Yamada Corporation
- Fumio Miyajima
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Apparatus for sealing a semiconductor device utilizing a release film
- Patent number 6,459,159
- Issue date Oct 1, 2002
- Apic Yamada Corporation
- Tsutomu Miyagawa
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Resin sealing method for a semiconductor device
- Patent number 6,261,501
- Issue date Jul 17, 2001
- Apic Yamada Corporation
- Tsutomu Miyagawa
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
Resin molding machine and method of resin molding
- Publication number 20020015748
- Publication date Feb 7, 2002
- Fumio Miyajima
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL