Kunihito Ide

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus
- Patent number 11,373,916
- Issue date Jun 28, 2022
- Canon Kabushiki Kaisha
- Kunihito Ide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroplating apparatus and electroplating method
- Patent number 8,029,653
- Issue date Oct 4, 2011
- Ebara Corporation
- Satoru Yamamoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus
- Patent number 7,901,550
- Issue date Mar 8, 2011
- Ebara Corporation
- Natsuki Makino
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus and plating method
- Patent number 7,736,474
- Issue date Jun 15, 2010
- Ebara Corporation
- Keiichi Kurashina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrolytic processing apparatus and substrate processing method
- Patent number 7,374,646
- Issue date May 20, 2008
- Ebara Corporation
- Hidenao Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating method and plating apparatus
- Patent number 7,169,705
- Issue date Jan 30, 2007
- Ebara Corporation
- Kunihito Ide
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ORGANIC LIGHT-EMITTING DEVICE, DISPLAY APPARATUS INCLUDING THE SAME...
- Publication number 20230077028
- Publication date Mar 9, 2023
- Canon Kabushiki Kaisha
- Mariko Furuta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS
- Publication number 20200411389
- Publication date Dec 31, 2020
- Canon Kabushiki Kaisha
- Kunihito Ide
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLATING APPARATUS AND PLATING METHOD
- Publication number 20100219078
- Publication date Sep 2, 2010
- Keiichi Kurashina
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating method
- Publication number 20090095634
- Publication date Apr 16, 2009
- Natsuki Makino
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating apparatus
- Publication number 20090095618
- Publication date Apr 16, 2009
- Natsuki Makino
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Apparatus and method for processing a substrate
- Publication number 20090045067
- Publication date Feb 19, 2009
- Koji Mishima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroplating apparatus and electroplating method
- Publication number 20080029398
- Publication date Feb 7, 2008
- Satoru Yamamoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating apparatus and plating method
- Publication number 20060086616
- Publication date Apr 27, 2006
- Keiichi Kurashina
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating method and plating apparatus
- Publication number 20050164498
- Publication date Jul 28, 2005
- Kunihito Ide
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Apparatus and method for processing substrate
- Publication number 20050145482
- Publication date Jul 7, 2005
- Hidenao Suzuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method and apparatus for controlling electrolytic solution
- Publication number 20050051434
- Publication date Mar 10, 2005
- Koji Mishima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Apparatus and method for processing a substrate
- Publication number 20050000820
- Publication date Jan 6, 2005
- Koji Mishima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrolytic solution supply and recovery facility and liquid compo...
- Publication number 20040256221
- Publication date Dec 23, 2004
- Koji Mishima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrolytic processing apparatus and substrate processing method
- Publication number 20040256238
- Publication date Dec 23, 2004
- Hidenao Suzuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Kunihito Ide

Person

Patents Grantslast 30 patents

Method and apparatus

Electroplating apparatus and electroplating method

Plating apparatus

Plating apparatus and plating method

Electrolytic processing apparatus and substrate processing method

Plating method and plating apparatus

Patents Applicationslast 30 patents

ORGANIC LIGHT-EMITTING DEVICE, DISPLAY APPARATUS INCLUDING THE SAME...

METHOD AND APPARATUS

PLATING APPARATUS AND PLATING METHOD

Plating method

Plating apparatus

Apparatus and method for processing a substrate

Electroplating apparatus and electroplating method

Plating apparatus and plating method

Plating method and plating apparatus

Apparatus and method for processing substrate

Method and apparatus for controlling electrolytic solution

Apparatus and method for processing a substrate

Electrolytic solution supply and recovery facility and liquid compo...

Electrolytic processing apparatus and substrate processing method