Kuniyasu HOSODA

Person

Hanno-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board, method for forming frame ground for printed...
- Patent number 8,159,833
- Issue date Apr 17, 2012
- Kabushiki Kaisha Toshiba
- Norihiro Ishii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board, mounting method of electronic component, and...
- Patent number 7,675,172
- Issue date Mar 9, 2010
- Kabushiki Kaisha Toshiba
- Minoru Takizawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module substrate and disk apparatus
- Patent number 7,327,040
- Issue date Feb 5, 2008
- Kabushiki Kaisha Toshiba
- Makoto Aoki
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD, METHOD FOR FORMING FRAME GROUND FOR PRINTED...
- Publication number 20090219703
- Publication date Sep 3, 2009
- Kabushiki Kaisha Toshiba
- Norihiro ISHII
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD MODULE, ELECTRIC DEVICE, AND METHOD FOR PRODUCING CIR...
- Publication number 20090134529
- Publication date May 28, 2009
- Kabushiki Kaisha Toshiba
- Norihiro Ishii
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Printed Circuit Board, Mounting Method of Electronic Component, and...
- Publication number 20090001575
- Publication date Jan 1, 2009
- Kabushiki Kaisha Toshiba
- Minoru Takizawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Printed Circuit Board, Printed Circuit Board Manufacturing Method a...
- Publication number 20080303145
- Publication date Dec 11, 2008
- Kabushiki Kaisha Toshiba
- Minoru Takizawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PRINTED CIRCUIT BOARD AND ELECTRONIC APPARATUS
- Publication number 20080173472
- Publication date Jul 24, 2008
- Kabushiki Kaisha Toshiba
- Minoru Takizawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board and electronic apparatus including printed ci...
- Publication number 20070035021
- Publication date Feb 15, 2007
- Daigo Suzuki
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor device, semiconductor device mounting board, and meth...
- Publication number 20060267215
- Publication date Nov 30, 2006
- Hideki Ogawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Module substrate and disk apparatus
- Publication number 20060103030
- Publication date May 18, 2006
- Makoto Aoki
- G11 - INFORMATION STORAGE
Information Patent Application
Circuit wiring board and method of manufacturing the same
- Publication number 20040083606
- Publication date May 6, 2004
- Kabushiki Kaisha Toshiba
- Sadao Makita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Kuniyasu HOSODA

Person

Patents Grantslast 30 patents

Printed circuit board, method for forming frame ground for printed...

Printed circuit board, mounting method of electronic component, and...

Module substrate and disk apparatus

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD, METHOD FOR FORMING FRAME GROUND FOR PRINTED...

CIRCUIT BOARD MODULE, ELECTRIC DEVICE, AND METHOD FOR PRODUCING CIR...

Printed Circuit Board, Mounting Method of Electronic Component, and...

Printed Circuit Board, Printed Circuit Board Manufacturing Method a...

PRINTED CIRCUIT BOARD AND ELECTRONIC APPARATUS

Printed circuit board and electronic apparatus including printed ci...

Semiconductor device, semiconductor device mounting board, and meth...

Module substrate and disk apparatus

Circuit wiring board and method of manufacturing the same