Kunizo Sahara

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Nishitama, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wafer scale or full wafer memory system, packaging method thereof,...
- Patent number 5,309,011
- Issue date May 3, 1994
- Hitachi, Ltd.
- Masanori Tazunoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer scale of full wafer memory system, packaging method thereof,...
- Patent number 5,191,224
- Issue date Mar 2, 1993
- Hitachi, Ltd.
- Masanori Tazunoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding metals, and method and apparatus for producing se...
- Patent number 5,188,280
- Issue date Feb 23, 1993
- Hitachi Ltd.
- Takashi Nakao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding metals, and method and apparatus for producing se...
- Patent number 5,090,609
- Issue date Feb 25, 1992
- Hitachi, Ltd.
- Takashi Nakao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having leads for mounting to a surface of a pr...
- Patent number 5,067,007
- Issue date Nov 19, 1991
- Hitachi, Ltd.
- Kanji Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and process for producing the same
- Patent number 4,764,804
- Issue date Aug 16, 1988
- Hitachi, Ltd.
- Kunizo Sahara
- H01 - BASIC ELECTRIC ELEMENTS