Number | Date | Country | Kind |
---|---|---|---|
61-35105 | Feb 1986 | JPX |
Number | Name | Date | Kind |
---|---|---|---|
3675089 | Hantusch et al. | Jul 1972 | |
3686748 | Engeler et al. | Aug 1972 | |
3761783 | Kroger et al. | Sep 1973 | |
3922775 | Potter | Dec 1975 | |
3961103 | Aisenberg | Jun 1976 | |
4339870 | Ball et al. | Jul 1982 | |
4571447 | Prins | Feb 1986 | |
4582954 | Eaton et al. | Apr 1986 | |
4651192 | Matshshita et al. | Mar 1987 | |
4703339 | Matsuo | Oct 1987 |
Number | Date | Country |
---|---|---|
1108191 | May 1986 | JPX |
Entry |
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Loeffel et al., Heat Transfer Apparatus for Semiconductor Chip, IBM Tech. Disc. Bull., V. 21, #6, Nov. 1978, p. 2430 relied on. |