Kuo Feng Peng

Person

Hsinchu Hsien, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Package structure of an image sensor and packaging
- Patent number 6,646,316
- Issue date Nov 11, 2003
- Kingpak Technology, Inc.
- Jichen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure for an integrated circuit package and method fo...
- Patent number 6,489,572
- Issue date Dec 3, 2002
- Kingpak Technology Inc.
- Mon Nan Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure of stacked integrated circuits
- Patent number 6,441,496
- Issue date Aug 27, 2002
- Wen Chuan Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Processes for packing memory cards by single mold
- Publication number 20060090334
- Publication date May 4, 2006
- Chi Hong Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Housing for memory card
- Publication number 20060082986
- Publication date Apr 20, 2006
- Chi Hong Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MMC memory card with TSOP package
- Publication number 20060083044
- Publication date Apr 20, 2006
- Chi Hong Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Window type case for memory card
- Publication number 20050093119
- Publication date May 5, 2005
- ABOUNION TECHNOLOGY, CORP.
- Wen Chuan Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SUBSTRATE STRUCTURE FOR AN INTEGRATED CIRCUIT PACKAGE AND METHOD FO...
- Publication number 20020096360
- Publication date Jul 25, 2002
- Mon Nan Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked structure of integrated circuits
- Publication number 20020096754
- Publication date Jul 25, 2002
- Wen Chuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure of stacked integrated circuits and method for manufacturi...
- Publication number 20020096762
- Publication date Jul 25, 2002
- Wen Chuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package structure of integrated circuits and method for packaging t...
- Publication number 20020096766
- Publication date Jul 25, 2002
- Wen Chuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit structure having an adhesive agent and method fo...
- Publication number 20020096751
- Publication date Jul 25, 2002
- Wen Chuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package structure of an image sensor and method for packaging the same
- Publication number 20020096731
- Publication date Jul 25, 2002
- Jichen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package structure of an image sensor and method for packaging the same
- Publication number 20020096782
- Publication date Jul 25, 2002
- Jichen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE OF STACKED INTEGRATED CIRCUITS AND METHOD FOR MANUFACTURI...
- Publication number 20020096761
- Publication date Jul 25, 2002
- Wen Chuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE OF STACKED INTEGRATED CIRCUITS AND METHOD FOR MANUFACTURI...
- Publication number 20020096780
- Publication date Jul 25, 2002
- Wen Chuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure of a photosensor and method for packaging the same
- Publication number 20020060287
- Publication date May 23, 2002
- Mon Nan Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stackable integrated circuit
- Publication number 20020043709
- Publication date Apr 18, 2002
- Nai Hua Yeh
- H01 - BASIC ELECTRIC ELEMENTS

Kuo Feng Peng

Person

Patents Grantslast 30 patents

Package structure of an image sensor and packaging

Substrate structure for an integrated circuit package and method fo...

Structure of stacked integrated circuits

Patents Applicationslast 30 patents

Processes for packing memory cards by single mold

Housing for memory card

MMC memory card with TSOP package

Window type case for memory card

SUBSTRATE STRUCTURE FOR AN INTEGRATED CIRCUIT PACKAGE AND METHOD FO...

Stacked structure of integrated circuits

Structure of stacked integrated circuits and method for manufacturi...

Package structure of integrated circuits and method for packaging t...

Integrated circuit structure having an adhesive agent and method fo...

Package structure of an image sensor and method for packaging the same

Package structure of an image sensor and method for packaging the same

STRUCTURE OF STACKED INTEGRATED CIRCUITS AND METHOD FOR MANUFACTURI...

STRUCTURE OF STACKED INTEGRATED CIRCUITS AND METHOD FOR MANUFACTURI...

Structure of a photosensor and method for packaging the same

Stackable integrated circuit