Kuo-Hsiu Wei

Person

Tainan City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Metal loss prevention using implantation
- Patent number 12,068,195
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Chieh Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer thinning apparatus having feedback control
- Patent number 11,728,172
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yuan-Hsuan Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Metal loss prevention using implantation
- Patent number 11,710,659
- Issue date Jul 25, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Chieh Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of semiconductor device with conduct...
- Patent number 11,532,514
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Chieh Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming an abrasive slurry and methods for chemical- mec...
- Patent number 11,482,450
- Issue date Oct 25, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal loss prevention using implantation
- Patent number 11,211,289
- Issue date Dec 28, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Chieh Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of semiconductor device with conduct...
- Patent number 10,957,587
- Issue date Mar 23, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Chieh Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming an abrasive slurry and methods for chemical-mech...
- Patent number 10,937,691
- Issue date Mar 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer thinning apparatus having feedback control and method of using
- Patent number 10,643,853
- Issue date May 5, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yuan-Hsuan Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Metal loss prevention using implantation
- Patent number 10,643,892
- Issue date May 5, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Chieh Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer edge trimming tool using abrasive tape
- Patent number 9,931,726
- Issue date Apr 3, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tang-Kuei Chang
- B24 - GRINDING POLISHING
Information Patent Grant
Lithography tool with backside polisher
- Patent number 9,829,806
- Issue date Nov 28, 2017
- Taiwan Semiconductor Manufacturing Company Limited
- Tang-Kuei Chang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Image sensor manufacturing methods
- Patent number 9,721,984
- Issue date Aug 1, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mu-Han Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer edge trim blade with slots
- Patent number 9,676,114
- Issue date Jun 13, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Ting Kuo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for wafer grinding
- Patent number 9,566,683
- Issue date Feb 14, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Hsiu Wei
- B24 - GRINDING POLISHING
Information Patent Grant
Modular grinding apparatuses and methods for wafer thinning
- Patent number 9,570,311
- Issue date Feb 14, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Ting Kuo
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer polishing tool using abrasive tape
- Patent number 9,339,912
- Issue date May 17, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tang-Kuei Chang
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for wafer grinding
- Patent number 9,120,194
- Issue date Sep 1, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Hsiu Wei
- B24 - GRINDING POLISHING
Information Patent Grant
Methods for minimizing edge peeling in the manufacturing of BSI chips
- Patent number 9,064,770
- Issue date Jun 23, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Ting Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Feature dimension measurement
- Patent number 8,049,213
- Issue date Nov 1, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Chung Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Removal of SiON residue after CMP
- Patent number 6,828,226
- Issue date Dec 7, 2004
- Taiwan Semiconductor Manufacturing Company, Limited
- Kei-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for slurry usage reduction in chemical mechanical...
- Patent number 6,769,959
- Issue date Aug 3, 2004
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kei-Wei Chen
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
WAFER THINNING METHOD HAVING FEEDBACK CONTROL
- Publication number 20230360919
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuan-Hsuan Chen
- B24 - GRINDING POLISHING
Information Patent Application
Metal Loss Prevention Using Implantation
- Publication number 20230317519
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Chieh Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming an Abrasive Slurry and Methods for Chemical-Mech...
- Publication number 20220384245
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Loss Prevention Using Implantation
- Publication number 20220122884
- Publication date Apr 21, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Chieh Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Formation Method of Semiconductor Device with Conduct...
- Publication number 20210210383
- Publication date Jul 8, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Chieh Wu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Methods of Forming an Abrasive Slurry and Methods for Chemical-Mech...
- Publication number 20210183688
- Publication date Jun 17, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia Hsuan Lee
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
WAFER THINNING APPARATUS HAVING FEEDBACK CONTROL
- Publication number 20200258756
- Publication date Aug 13, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuan-Hsuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING AN ABRASIVE SLURRY AND METHODS FOR CHEMICAL-MECH...
- Publication number 20200105580
- Publication date Apr 2, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Formation Method of Semiconductor Device with Conduct...
- Publication number 20200043786
- Publication date Feb 6, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Chieh Wu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Metal Loss Prevention Using Implantation
- Publication number 20190385909
- Publication date Dec 19, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Chieh Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Loss Prevention Using Implantation
- Publication number 20190371664
- Publication date Dec 5, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Chieh Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Multi Level Interconnects and Method of F...
- Publication number 20180337113
- Publication date Nov 22, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng Min Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus for Wafer Grinding
- Publication number 20150367475
- Publication date Dec 24, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Hsiu Wei
- B24 - GRINDING POLISHING
Information Patent Application
LITHOGRAPHY TOOL WITH BACKSIDE POLISHER
- Publication number 20150262831
- Publication date Sep 17, 2015
- Taiwan Semiconductor Manufacturing Company Limited
- TANG-KUEI CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Edge Trimming Tool Using Abrasive Tape
- Publication number 20140213152
- Publication date Jul 31, 2014
- Tang-Kuei Chang
- B24 - GRINDING POLISHING
Information Patent Application
Wafer Polishing Tool Using Abrasive Tape
- Publication number 20140213153
- Publication date Jul 31, 2014
- Tang-Kuei Chang
- B24 - GRINDING POLISHING
Information Patent Application
Semiconductor Device With Multi Level Interconnects And Method Of F...
- Publication number 20140209984
- Publication date Jul 31, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng Min Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Minimizing Edge Peeling in the Manufacturing of BSI Chips
- Publication number 20140024170
- Publication date Jan 23, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Ting KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image Sensor Manufacturing Methods
- Publication number 20130273686
- Publication date Oct 17, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mu-Han Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER EDGE TRIM BLADE WITH SLOTS
- Publication number 20130220090
- Publication date Aug 29, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Ting KUO
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
WAFER THINNING APPARATUS HAVING FEEDBACK CONTROL AND METHOD OF USING
- Publication number 20130210172
- Publication date Aug 15, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuan-Hsuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR GRINDING APPARATUSES AND METHODS FOR WAFER THINNING
- Publication number 20130210321
- Publication date Aug 15, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Ting KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus for Wafer Grinding
- Publication number 20130023188
- Publication date Jan 24, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Hsiu Wei
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING SLURRY, SYSTEM AND METHOD
- Publication number 20120264303
- Publication date Oct 18, 2012
- Taiwan Semiconductor Manufacturing Co., LTD
- Kei-Wei CHEN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Feature Dimension Measurement
- Publication number 20090152545
- Publication date Jun 18, 2009
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Chung Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Novel method to reduce stress for copper CMP
- Publication number 20040147116
- Publication date Jul 29, 2004
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Kei-Wei Chen
- B24 - GRINDING POLISHING
Information Patent Application
Method and system for slurry usage reduction in chemical mechanical...
- Publication number 20030143924
- Publication date Jul 31, 2003
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kei-Wei Chen
- B24 - GRINDING POLISHING

Kuo-Hsiu Wei

Person

Patents Grantslast 30 patents

Metal loss prevention using implantation

Wafer thinning apparatus having feedback control

Metal loss prevention using implantation

Structure and formation method of semiconductor device with conduct...

Methods of forming an abrasive slurry and methods for chemical- mec...

Metal loss prevention using implantation

Structure and formation method of semiconductor device with conduct...

Methods of forming an abrasive slurry and methods for chemical-mech...

Wafer thinning apparatus having feedback control and method of using

Metal loss prevention using implantation

Wafer edge trimming tool using abrasive tape

Lithography tool with backside polisher

Image sensor manufacturing methods

Wafer edge trim blade with slots

Method for wafer grinding

Modular grinding apparatuses and methods for wafer thinning

Wafer polishing tool using abrasive tape

Apparatus for wafer grinding

Methods for minimizing edge peeling in the manufacturing of BSI chips

Feature dimension measurement

Removal of SiON residue after CMP

Method and system for slurry usage reduction in chemical mechanical...

Patents Applicationslast 30 patents

WAFER THINNING METHOD HAVING FEEDBACK CONTROL

Metal Loss Prevention Using Implantation

Methods of Forming an Abrasive Slurry and Methods for Chemical-Mech...

Metal Loss Prevention Using Implantation

Structure and Formation Method of Semiconductor Device with Conduct...

Methods of Forming an Abrasive Slurry and Methods for Chemical-Mech...

WAFER THINNING APPARATUS HAVING FEEDBACK CONTROL

METHODS OF FORMING AN ABRASIVE SLURRY AND METHODS FOR CHEMICAL-MECH...

Structure and Formation Method of Semiconductor Device with Conduct...

Metal Loss Prevention Using Implantation

Metal Loss Prevention Using Implantation

Semiconductor Device with Multi Level Interconnects and Method of F...

Apparatus for Wafer Grinding

LITHOGRAPHY TOOL WITH BACKSIDE POLISHER

Wafer Edge Trimming Tool Using Abrasive Tape

Wafer Polishing Tool Using Abrasive Tape

Semiconductor Device With Multi Level Interconnects And Method Of F...

Methods for Minimizing Edge Peeling in the Manufacturing of BSI Chips

Image Sensor Manufacturing Methods

WAFER EDGE TRIM BLADE WITH SLOTS

WAFER THINNING APPARATUS HAVING FEEDBACK CONTROL AND METHOD OF USING

MODULAR GRINDING APPARATUSES AND METHODS FOR WAFER THINNING

Apparatus for Wafer Grinding

CHEMICAL MECHANICAL POLISHING SLURRY, SYSTEM AND METHOD

Feature Dimension Measurement

Novel method to reduce stress for copper CMP

Method and system for slurry usage reduction in chemical mechanical...