Kuo-Liang Lee

Person

Hsinchu County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Magnetoresistive random access memory
- Patent number 12,150,314
- Issue date Nov 19, 2024
- United Microelectronics Corp.
- Kuo-Hsing Lee
- G11 - INFORMATION STORAGE
Information Patent Grant
High efficiency control method for ups
- Patent number 12,142,964
- Issue date Nov 12, 2024
- SCHNEIDER ELECTRIC IT CORPORATION
- Andraw Chih-Feng Ho
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Vertically arranged semiconductor pixel sensor
- Patent number 12,142,630
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pellicle frame with stress relief trenches
- Patent number 12,130,551
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Hao Lee
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Resistor and resistor-transistor-logic circuit with GaN structure a...
- Patent number 12,132,043
- Issue date Oct 29, 2024
- United Microelectronics Corp.
- Kuo-Hsing Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bit cell structure for one-time-programming
- Patent number 12,133,377
- Issue date Oct 29, 2024
- United Microelectronics Corp.
- Kuo-Hsing Lee
- G11 - INFORMATION STORAGE
Information Patent Grant
Image sensor and method of making
- Patent number 12,125,864
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid-cooling heat dissipation plate with unequal height pin-fins...
- Patent number 12,120,845
- Issue date Oct 15, 2024
- AMULAIRE THERMAL TECHNOLOGY, INC.
- Yi-Hsin Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resistor and resistor-transistor-logic circuit with GaN structure a...
- Patent number 12,119,342
- Issue date Oct 15, 2024
- United Microelectronics Corp.
- Kuo-Hsing Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bonding structure and manufacturing method thereof
- Patent number 12,113,042
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Liang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for sensing long wavelength light
- Patent number 12,113,086
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yun-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside refraction layer for backside illuminated image sensor and...
- Patent number 12,107,104
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,088,940
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yun-Wei Cheng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image sensor including light shielding layer and patterned dielectr...
- Patent number 12,081,866
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yun-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer layouts on integrated circuits and methods for...
- Patent number 12,068,246
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Yuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Roughness selectivity for MEMS movement stiction reduction
- Patent number 12,054,382
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsi-Cheng Hsu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pixel array including octagon pixel sensors
- Patent number 12,051,704
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation structures
- Patent number 12,046,528
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yun-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mid-manufacturing semiconductor wafer layer testing
- Patent number 12,033,902
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate container system
- Patent number 12,017,841
- Issue date Jun 25, 2024
- Gudeng Precision Industrial Co., Ltd.
- Ming-Chien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer (RDL) layouts for integrated circuits
- Patent number 12,021,054
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Yuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pixel array including octagon pixel sensors
- Patent number 12,021,105
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Chien Hsieh
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor structure
- Patent number 12,009,323
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High electron mobility transistor and method for fabricating the same
- Patent number 12,009,415
- Issue date Jun 11, 2024
- United Microelectronics Corp.
- Kuo-Hsing Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical blocking structures for black level correction pixels in an...
- Patent number 11,996,428
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grid structure with at least partially angled sidewalls
- Patent number 11,990,488
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pixel array including dark pixel sensors
- Patent number 11,985,438
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pixel sensors and methods of forming the same
- Patent number 11,978,751
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Wen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint identification module, method for making same, and elec...
- Patent number 11,973,099
- Issue date Apr 30, 2024
- Hon Hai Precision Industry Co., Ltd.
- Kuo-Sheng Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High electron mobility transistor and method for fabricating the same
- Patent number 11,973,133
- Issue date Apr 30, 2024
- United Microelectronics Corp.
- Kuo-Hsing Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL FINGERPRINT SENSOR WITH ENHANCED ANTI-COUNTERFEITING FEATURES
- Publication number 20240386743
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Chien Hsieh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATING METHOD OF THE SAME
- Publication number 20240387523
- Publication date Nov 21, 2024
- UNITED MICROELECTRONICS CORP.
- Hsin-Hsien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING
- Publication number 20240379705
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Feng-Chien HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR FOR SENSING LED LIGHT WITH REDUCED FLICKERING
- Publication number 20240380986
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Yun-Wei CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379611
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Liang LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE REFRACTION LAYER FOR BACKSIDE ILLUMINATED IMAGE SENSOR AND...
- Publication number 20240379704
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Han CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240373145
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yun-Wei Cheng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CMOS IMAGE SENSOR AND METHOD FOR MAKING THE SAME
- Publication number 20240355847
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hsien YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Dissipation Structures
- Publication number 20240332115
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yun-Wei CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIXEL ARRAY INCLUDING OCTAGON PIXEL SENSORS
- Publication number 20240332325
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Chien HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VALVE COVER AND SUBSTRATE CARRIER USING THE SAME
- Publication number 20240321614
- Publication date Sep 26, 2024
- Gudeng Precision Industrial Co, Ltd
- MING-CHIEN CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR DEVICE AND METHODS OF FORMATION
- Publication number 20240323555
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Cheng LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE CARRIER HAVING INSTALLATION STRUCTURE FOR GAS DIFFUSER
- Publication number 20240312817
- Publication date Sep 19, 2024
- GUDENG PRECISION INDUSTRIAL CO, LTD.
- Ming-Chien CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ABSORPTION STRUCTURE FOR OPTOELECTRONIC DEVICE
- Publication number 20240304653
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Liang LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMMERSION-TYPE LIQUID COOLING HEAT DISSIPATION STRUCTURE
- Publication number 20240295371
- Publication date Sep 5, 2024
- Amulaire thermal technology, INC.
- KUO-WEI LEE
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR FABRICATING THE SAME
- Publication number 20240290875
- Publication date Aug 29, 2024
- UNITED MICROELECTRONICS CORP.
- Kuo-Hsing Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELASTIC CLOTH AND PROTECTOR
- Publication number 20240285009
- Publication date Aug 29, 2024
- Plus Meditech Co., Ltd.
- Yueh-Hua Chiang
- A41 - WEARING APPAREL
Information Patent Application
DOOR HAVING STABLIZING MECHNISAM FOR LOCK, AND SUBSTRATE CARRIER
- Publication number 20240287833
- Publication date Aug 29, 2024
- GUDENG PRECISION INDUSTRIAL CO., LTD
- Ming-Chien CHIU
- E05 - LOCKS KEYS WINDOW OR DOOR FITTINGS SAFES
Information Patent Application
PIXEL SENSOR ARRAYS AND METHODS OF FORMATION
- Publication number 20240274636
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hsien YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISTRIBUTIVE FAST CHARGING DEVICE AND CHARGING SYSTEM
- Publication number 20240258814
- Publication date Aug 1, 2024
- DEXIN CORP.
- Ho Lung LU
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
LIQUID-COOLING HEAT DISSIPATION STRUCTURE HAVING NONLINEAR FIN ARRA...
- Publication number 20240247882
- Publication date Jul 25, 2024
- Amulaire thermal technology, INC.
- KUO-WEI LEE
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
RETICLE POD WITH QUICK-RELEASE SUPPORT MECHANISM
- Publication number 20240242991
- Publication date Jul 18, 2024
- GUDENG PRECISION INDUSTRIAL CO., LTD
- Ming-Chien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR FABRICATING THE SAME
- Publication number 20240234559
- Publication date Jul 11, 2024
- UNITED MICROELECTRONICS CORP.
- Kuo-Hsing Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIXEL SENSORS AND METHODS OF FORMING THE SAME
- Publication number 20240234460
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Wen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTOMOTIVE LIQUID-COOLING COOLER STRUCTURE
- Publication number 20240237309
- Publication date Jul 11, 2024
- Amulaire thermal technology, INC.
- Kuo-Wei LEE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW PRESSURE DROP AUTOMOTIVE LIQUID-COOLING HEAT DISSIPATION PLATE...
- Publication number 20240230245
- Publication date Jul 11, 2024
- Amulaire thermal technology, INC.
- CHUN-LI HSIUNG
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
LIQUID-COOLING HEAT DISSIPATION PLATE WITH UNEQUAL HEIGHT PIN-FINS...
- Publication number 20240224464
- Publication date Jul 4, 2024
- Amulaire thermal technology, INC.
- YI-HSIN HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Data Storage Cell, Memory, and Memory Fabrication Method Thereof
- Publication number 20240215264
- Publication date Jun 27, 2024
- UNITED MICROELECTRONICS CORP.
- Kuo-Hsing Lee
Information Patent Application
METHOD OF MAKING A SEMICONDUCTOR IMAGE SENSOR HAVING REFLECTION COM...
- Publication number 20240204024
- Publication date Jun 20, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Chun-Liang LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System And Method For Cooling Electronic Computing Device With Mult...
- Publication number 20240196565
- Publication date Jun 13, 2024
- QUANTA COMPUTER INC.
- Chao-Jung CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Kuo-Liang Lee

Person

Patents Grantslast 30 patents

Magnetoresistive random access memory

High efficiency control method for ups

Vertically arranged semiconductor pixel sensor

Pellicle frame with stress relief trenches

Resistor and resistor-transistor-logic circuit with GaN structure a...

Bit cell structure for one-time-programming

Image sensor and method of making

Liquid-cooling heat dissipation plate with unequal height pin-fins...

Resistor and resistor-transistor-logic circuit with GaN structure a...

Metal bonding structure and manufacturing method thereof

Apparatus and methods for sensing long wavelength light

Backside refraction layer for backside illuminated image sensor and...

Semiconductor device and method of manufacture

Image sensor including light shielding layer and patterned dielectr...

Redistribution layer layouts on integrated circuits and methods for...

Roughness selectivity for MEMS movement stiction reduction

Pixel array including octagon pixel sensors

Heat dissipation structures

Mid-manufacturing semiconductor wafer layer testing

Substrate container system

Redistribution layer (RDL) layouts for integrated circuits

Pixel array including octagon pixel sensors

Semiconductor structure

High electron mobility transistor and method for fabricating the same

Optical blocking structures for black level correction pixels in an...

Grid structure with at least partially angled sidewalls

Pixel array including dark pixel sensors

Pixel sensors and methods of forming the same

Fingerprint identification module, method for making same, and elec...

High electron mobility transistor and method for fabricating the same

Patents Applicationslast 30 patents

OPTICAL FINGERPRINT SENSOR WITH ENHANCED ANTI-COUNTERFEITING FEATURES

SEMICONDUCTOR DEVICE AND FABRICATING METHOD OF THE SAME

SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING

IMAGE SENSOR FOR SENSING LED LIGHT WITH REDUCED FLICKERING

METAL BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF

BACKSIDE REFRACTION LAYER FOR BACKSIDE ILLUMINATED IMAGE SENSOR AND...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

CMOS IMAGE SENSOR AND METHOD FOR MAKING THE SAME

Heat Dissipation Structures

PIXEL ARRAY INCLUDING OCTAGON PIXEL SENSORS

VALVE COVER AND SUBSTRATE CARRIER USING THE SAME

IMAGE SENSOR DEVICE AND METHODS OF FORMATION

SUBSTRATE CARRIER HAVING INSTALLATION STRUCTURE FOR GAS DIFFUSER

HIGH ABSORPTION STRUCTURE FOR OPTOELECTRONIC DEVICE

IMMERSION-TYPE LIQUID COOLING HEAT DISSIPATION STRUCTURE

HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR FABRICATING THE SAME

ELASTIC CLOTH AND PROTECTOR

DOOR HAVING STABLIZING MECHNISAM FOR LOCK, AND SUBSTRATE CARRIER

PIXEL SENSOR ARRAYS AND METHODS OF FORMATION

DISTRIBUTIVE FAST CHARGING DEVICE AND CHARGING SYSTEM

LIQUID-COOLING HEAT DISSIPATION STRUCTURE HAVING NONLINEAR FIN ARRA...

RETICLE POD WITH QUICK-RELEASE SUPPORT MECHANISM

HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR FABRICATING THE SAME

PIXEL SENSORS AND METHODS OF FORMING THE SAME

AUTOMOTIVE LIQUID-COOLING COOLER STRUCTURE

LOW PRESSURE DROP AUTOMOTIVE LIQUID-COOLING HEAT DISSIPATION PLATE...

LIQUID-COOLING HEAT DISSIPATION PLATE WITH UNEQUAL HEIGHT PIN-FINS...

Data Storage Cell, Memory, and Memory Fabrication Method Thereof

METHOD OF MAKING A SEMICONDUCTOR IMAGE SENSOR HAVING REFLECTION COM...

System And Method For Cooling Electronic Computing Device With Mult...