Kuo-Liang Lee

Person

Hsinchu County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
CMOS image sensor having indented photodiode structure
- Patent number 12,191,327
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor and method of making
- Patent number 12,183,753
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluorine passivation in a pixel sensor
- Patent number 12,183,751
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic radiation detection method
- Patent number 12,176,361
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kun-Huei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pixel sensors and methods of forming the same
- Patent number 12,170,301
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Wen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Increased optical path for long wavelength light by grating structure
- Patent number 12,170,302
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yun-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Daisy-chain seal ring structure
- Patent number 12,170,234
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Liang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pixel array including time-of-flight sensors
- Patent number 12,164,034
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pixel array including octagon pixel sensors
- Patent number 12,166,048
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joint orthosis assembly
- Patent number 12,150,879
- Issue date Nov 26, 2024
- Plus Meditech Co., Ltd.
- Yueh-Hua Chiang
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Image sensors with stress adjusting layers
- Patent number 12,154,933
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetoresistive random access memory
- Patent number 12,150,314
- Issue date Nov 19, 2024
- United Microelectronics Corp.
- Kuo-Hsing Lee
- G11 - INFORMATION STORAGE
Information Patent Grant
Vertically arranged semiconductor pixel sensor
- Patent number 12,142,630
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High efficiency control method for ups
- Patent number 12,142,964
- Issue date Nov 12, 2024
- SCHNEIDER ELECTRIC IT CORPORATION
- Andraw Chih-Feng Ho
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Pellicle frame with stress relief trenches
- Patent number 12,130,551
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Hao Lee
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Resistor and resistor-transistor-logic circuit with GaN structure a...
- Patent number 12,132,043
- Issue date Oct 29, 2024
- United Microelectronics Corp.
- Kuo-Hsing Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bit cell structure for one-time-programming
- Patent number 12,133,377
- Issue date Oct 29, 2024
- United Microelectronics Corp.
- Kuo-Hsing Lee
- G11 - INFORMATION STORAGE
Information Patent Grant
Image sensor and method of making
- Patent number 12,125,864
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid-cooling heat dissipation plate with unequal height pin-fins...
- Patent number 12,120,845
- Issue date Oct 15, 2024
- AMULAIRE THERMAL TECHNOLOGY, INC.
- Yi-Hsin Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resistor and resistor-transistor-logic circuit with GaN structure a...
- Patent number 12,119,342
- Issue date Oct 15, 2024
- United Microelectronics Corp.
- Kuo-Hsing Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bonding structure and manufacturing method thereof
- Patent number 12,113,042
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Liang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for sensing long wavelength light
- Patent number 12,113,086
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yun-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside refraction layer for backside illuminated image sensor and...
- Patent number 12,107,104
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,088,940
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yun-Wei Cheng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image sensor including light shielding layer and patterned dielectr...
- Patent number 12,081,866
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yun-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer layouts on integrated circuits and methods for...
- Patent number 12,068,246
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Yuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Roughness selectivity for MEMS movement stiction reduction
- Patent number 12,054,382
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsi-Cheng Hsu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pixel array including octagon pixel sensors
- Patent number 12,051,704
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation structures
- Patent number 12,046,528
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yun-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mid-manufacturing semiconductor wafer layer testing
- Patent number 12,033,902
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BIT CELL STRUCTURE FOR ONE-TIME-PROGRAMMING
- Publication number 20250014661
- Publication date Jan 9, 2025
- UNITED MICROELECTRONICS CORP.
- Kuo-Hsing Lee
- G11 - INFORMATION STORAGE
Information Patent Application
MULTI-WAFER STACKED CMOS IMAGE SENSOR STRUCTURE
- Publication number 20250008244
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- Ming-Hsien Yang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
RESISTOR AND RESISTOR-TRANSISTOR-LOGIC CIRCUIT WITH GAN STRUCTURE A...
- Publication number 20240429228
- Publication date Dec 26, 2024
- UNITED MICROELECTRONICS CORP.
- Kuo-Hsing Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR DEVICE AND METHODS OF FORMING THE SAME
- Publication number 20240421174
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL BLOCKING REGIONS FOR PIXEL SENSORS
- Publication number 20240405047
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Chien HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECRONIC DEVICE WITH POLARIZING MASK STRUCTURE
- Publication number 20240405053
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Liang LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS FOR PHASE DETECTION AUTO FOCUS
- Publication number 20240406596
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Chien HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20240402441
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- Kuo-Hao LEE
- G02 - OPTICS
Information Patent Application
OPTOELECTRONIC DEVICE HAVING A PHOTODIODE INCLUDING A QUANTUM DOT M...
- Publication number 20240395847
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hao LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A WAFER STACK AND WAFER STACK PRODUCED THEREBY
- Publication number 20240395785
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- Ming-Hsien Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MID-MANUFACTURING SEMICONDUCTOR WAFER LAYER TESTING
- Publication number 20240395638
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR DEVICES AND METHODS OF FORMATION
- Publication number 20240387596
- Publication date Nov 21, 2024
- Traiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Chien HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image Sensors With Stress Adjusting Layers
- Publication number 20240387595
- Publication date Nov 21, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Feng-Chien HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOSCALE HOLES FOR PIXEL SENSORS AND METHODS OF FORMING THE SAME
- Publication number 20240387599
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Lin CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL FINGERPRINT SENSOR WITH ENHANCED ANTI-COUNTERFEITING FEATURES
- Publication number 20240386743
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Chien Hsieh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FLUORINE PASSIVATION IN A PIXEL SENSOR
- Publication number 20240387574
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Lin CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIXEL SHIELDING USING AIR GAPS
- Publication number 20240387584
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- ChunHao LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC DEVICE INCLUDING NEAR INFRARED PHOTODIODES AND NEAR...
- Publication number 20240387600
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manfacturing Company, Ltd.
- Chun-Hao LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATING METHOD OF THE SAME
- Publication number 20240387523
- Publication date Nov 21, 2024
- UNITED MICROELECTRONICS CORP.
- Hsin-Hsien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING
- Publication number 20240379705
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Feng-Chien HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR FOR SENSING LED LIGHT WITH REDUCED FLICKERING
- Publication number 20240380986
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Yun-Wei CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379611
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Liang LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE REFRACTION LAYER FOR BACKSIDE ILLUMINATED IMAGE SENSOR AND...
- Publication number 20240379704
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Han CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240373145
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yun-Wei Cheng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CMOS IMAGE SENSOR AND METHOD FOR MAKING THE SAME
- Publication number 20240355847
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hsien YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Dissipation Structures
- Publication number 20240332115
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yun-Wei CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIXEL ARRAY INCLUDING OCTAGON PIXEL SENSORS
- Publication number 20240332325
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Chien HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR DEVICE AND METHODS OF FORMATION
- Publication number 20240323555
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Cheng LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VALVE COVER AND SUBSTRATE CARRIER USING THE SAME
- Publication number 20240321614
- Publication date Sep 26, 2024
- Gudeng Precision Industrial Co, Ltd
- MING-CHIEN CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE CARRIER HAVING INSTALLATION STRUCTURE FOR GAS DIFFUSER
- Publication number 20240312817
- Publication date Sep 19, 2024
- GUDENG PRECISION INDUSTRIAL CO, LTD.
- Ming-Chien CHIU
- H01 - BASIC ELECTRIC ELEMENTS

Kuo-Liang Lee

Person

Patents Grantslast 30 patents

CMOS image sensor having indented photodiode structure

Image sensor and method of making

Fluorine passivation in a pixel sensor

Electromagnetic radiation detection method

Pixel sensors and methods of forming the same

Increased optical path for long wavelength light by grating structure

Daisy-chain seal ring structure

Pixel array including time-of-flight sensors

Pixel array including octagon pixel sensors

Joint orthosis assembly

Image sensors with stress adjusting layers

Magnetoresistive random access memory

Vertically arranged semiconductor pixel sensor

High efficiency control method for ups

Pellicle frame with stress relief trenches

Resistor and resistor-transistor-logic circuit with GaN structure a...

Bit cell structure for one-time-programming

Image sensor and method of making

Liquid-cooling heat dissipation plate with unequal height pin-fins...

Resistor and resistor-transistor-logic circuit with GaN structure a...

Metal bonding structure and manufacturing method thereof

Apparatus and methods for sensing long wavelength light

Backside refraction layer for backside illuminated image sensor and...

Semiconductor device and method of manufacture

Image sensor including light shielding layer and patterned dielectr...

Redistribution layer layouts on integrated circuits and methods for...

Roughness selectivity for MEMS movement stiction reduction

Pixel array including octagon pixel sensors

Heat dissipation structures

Mid-manufacturing semiconductor wafer layer testing

Patents Applicationslast 30 patents

BIT CELL STRUCTURE FOR ONE-TIME-PROGRAMMING

MULTI-WAFER STACKED CMOS IMAGE SENSOR STRUCTURE

RESISTOR AND RESISTOR-TRANSISTOR-LOGIC CIRCUIT WITH GAN STRUCTURE A...

IMAGE SENSOR DEVICE AND METHODS OF FORMING THE SAME

OPTICAL BLOCKING REGIONS FOR PIXEL SENSORS

OPTOELECRONIC DEVICE WITH POLARIZING MASK STRUCTURE

STRUCTURES AND METHODS FOR PHASE DETECTION AUTO FOCUS

PHOTONIC PACKAGE AND METHOD FOR FORMING THE SAME

OPTOELECTRONIC DEVICE HAVING A PHOTODIODE INCLUDING A QUANTUM DOT M...

METHOD OF FABRICATING A WAFER STACK AND WAFER STACK PRODUCED THEREBY

MID-MANUFACTURING SEMICONDUCTOR WAFER LAYER TESTING

IMAGE SENSOR DEVICES AND METHODS OF FORMATION

Image Sensors With Stress Adjusting Layers

NANOSCALE HOLES FOR PIXEL SENSORS AND METHODS OF FORMING THE SAME

OPTICAL FINGERPRINT SENSOR WITH ENHANCED ANTI-COUNTERFEITING FEATURES

FLUORINE PASSIVATION IN A PIXEL SENSOR

PIXEL SHIELDING USING AIR GAPS

OPTOELECTRONIC DEVICE INCLUDING NEAR INFRARED PHOTODIODES AND NEAR...

SEMICONDUCTOR DEVICE AND FABRICATING METHOD OF THE SAME

SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING

IMAGE SENSOR FOR SENSING LED LIGHT WITH REDUCED FLICKERING

METAL BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF

BACKSIDE REFRACTION LAYER FOR BACKSIDE ILLUMINATED IMAGE SENSOR AND...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

CMOS IMAGE SENSOR AND METHOD FOR MAKING THE SAME

Heat Dissipation Structures

PIXEL ARRAY INCLUDING OCTAGON PIXEL SENSORS

IMAGE SENSOR DEVICE AND METHODS OF FORMATION

VALVE COVER AND SUBSTRATE CARRIER USING THE SAME

SUBSTRATE CARRIER HAVING INSTALLATION STRUCTURE FOR GAS DIFFUSER