Kuowei Liu

Person

Santa Clara, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Low dielectric constant film produced from silicon compounds compri...
- Patent number 7,651,725
- Issue date Jan 26, 2010
- Applied Materials, Inc.
- Wai-Fan Yau
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated low k dielectrics and etch stops
- Patent number 7,227,244
- Issue date Jun 5, 2007
- Applied Materials, Inc.
- Claes H. Bjorkman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing low k films
- Patent number 7,160,821
- Issue date Jan 9, 2007
- Applied Materials, Inc.
- Tzu-Fang Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of decreasing the k value in sioc layer deposited by chemica...
- Patent number 7,074,708
- Issue date Jul 11, 2006
- Applied Materials, Inc.
- Frederic Gaillard
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Low dielectric constant film produced from silicon compounds compri...
- Patent number 7,023,092
- Issue date Apr 4, 2006
- Applied Materials Inc.
- Wai-Fan Yau
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated low K dielectrics and etch stops
- Patent number 6,858,153
- Issue date Feb 22, 2005
- Applied Materials Inc.
- Claes H. Bjorkman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing low K films
- Patent number 6,806,207
- Issue date Oct 19, 2004
- Applied Materials Inc.
- Tzu-Fang Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of decreasing the K value in SIOC layer deposited by chemica...
- Patent number 6,784,119
- Issue date Aug 31, 2004
- Applied Materials Inc.
- Frederic Gaillard
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing a low dielectric with organo silane
- Patent number 6,770,556
- Issue date Aug 3, 2004
- Applied Materials Inc.
- Wai-Fan Yau
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing a low K dielectric with organo silane
- Patent number 6,730,593
- Issue date May 4, 2004
- Applied Materials Inc.
- Wai-Fan Yau
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated low k dielectrics and etch stops
- Patent number 6,669,858
- Issue date Dec 30, 2003
- Applied Materials Inc.
- Claes H. Bjorkman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of decreasing the K value in SiOC layer deposited by chemica...
- Patent number 6,627,532
- Issue date Sep 30, 2003
- Applied Materials, Inc.
- Frederic Gaillard
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing low k films using an oxidizing plasma
- Patent number 6,593,247
- Issue date Jul 15, 2003
- Applied Materials, Inc.
- Tzu-Fang Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing a low k dielectric with organo silane
- Patent number 6,511,903
- Issue date Jan 28, 2003
- Applied Materials, Inc.
- Wai-Fan Yau
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing a low K dielectric with organo silane
- Patent number 6,511,909
- Issue date Jan 28, 2003
- Applied Materials, Inc.
- Wai-Fan Yau
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated low K dielectrics and etch stops
- Patent number 6,340,435
- Issue date Jan 22, 2002
- Applied Materials, Inc.
- Claes H. Bjorkman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Low power method of depositing a low k dielectric with organo silane
- Patent number 6,072,227
- Issue date Jun 6, 2000
- Applied Materials, Inc.
- Wai-Fan Yau
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing a low k dielectric with organo silane
- Patent number 6,054,379
- Issue date Apr 25, 2000
- Applied Materials, Inc.
- Wai-Fan Yau
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
LOW DIELECTRIC CONSTANT FILM PRODUCED FROM SILICON COMPOUNDS COMPRI...
- Publication number 20080064225
- Publication date Mar 13, 2008
- WAI-FAN YAU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LOW DIELECTRIC CONSTANT FILM PRODUCED FROM SILICON COMPOUNDS COMPRI...
- Publication number 20080061439
- Publication date Mar 13, 2008
- WAI-FAN YAU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LOW DIELECTRIC CONSTANT FILM PRODUCED FROM SILICON COMPOUNDS COMPRI...
- Publication number 20080044557
- Publication date Feb 21, 2008
- WAI-FAN YAU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing low k films
- Publication number 20050260864
- Publication date Nov 24, 2005
- APPLIED MATERIALS, INC.
- Tzu-Fang Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Low dielectric constant film produced from silicon compounds compri...
- Publication number 20050156317
- Publication date Jul 21, 2005
- APPLIED MATERIALS, INC.
- Wai-Fan Yau
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Integrated low k dielectrics and etch stops
- Publication number 20050023694
- Publication date Feb 3, 2005
- Claes H. Bjorkman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Low dielectric constant film produced from silicon compounds compri...
- Publication number 20040201103
- Publication date Oct 14, 2004
- WAI-FAN YAU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of decreasing the K value in SIOC layer deposited by chemica...
- Publication number 20040166665
- Publication date Aug 26, 2004
- APPLIED MATERIALS, INC.
- Frederic Gaillard
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Low dielectric constant film produced from silicon compounds compri...
- Publication number 20040147109
- Publication date Jul 29, 2004
- APPLIED MATERIALS, INC.
- Wai-Fan Yau
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of decreasing the K value in SIOC layer deposited by chemica...
- Publication number 20040029400
- Publication date Feb 12, 2004
- APPLIED MATERIALS, INC.
- Frederic Gaillard
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing low K films
- Publication number 20030162410
- Publication date Aug 28, 2003
- APPLIED MATERIALS, INC.
- Tzu-Fang Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing a low dielectric with organo silane
- Publication number 20030113992
- Publication date Jun 19, 2003
- APPLIED MATERIALS, INC.
- Wai-Fan Yau
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing a low K dielectric with organo silane
- Publication number 20020111042
- Publication date Aug 15, 2002
- APPLIED MATERIALS, INC.
- Wai-Fan Yau
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Intergrated low k dielectrics and etch stops
- Publication number 20020084257
- Publication date Jul 4, 2002
- APPLIED MATERIALS, INC.
- Claes H. Bjorkman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Integrated low k dielectrics and etch stops
- Publication number 20020074309
- Publication date Jun 20, 2002
- APPLIED MATERIALS, INC.
- Claes H. Bjorkman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
A LOW DIELECTRIC CONSTANT FILM PRODUCED FROM SILICON COMPOUNDS COMP...
- Publication number 20020000670
- Publication date Jan 3, 2002
- WAI-FAN YAU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA PROCESSES FOR DEPOSITING LOW DIELECTRIC CONSTANT FILMS
- Publication number 20010004479
- Publication date Jun 21, 2001
- DAVID CHEUNG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Person

Patents Grantslast 30 patents

Low dielectric constant film produced from silicon compounds compri...

Integrated low k dielectrics and etch stops

Method of depositing low k films

Method of decreasing the k value in sioc layer deposited by chemica...

Low dielectric constant film produced from silicon compounds compri...

Integrated low K dielectrics and etch stops

Method of depositing low K films

Method of decreasing the K value in SIOC layer deposited by chemica...

Method of depositing a low dielectric with organo silane

Method of depositing a low K dielectric with organo silane

Integrated low k dielectrics and etch stops

Method of decreasing the K value in SiOC layer deposited by chemica...

Method of depositing low k films using an oxidizing plasma

Method of depositing a low k dielectric with organo silane

Method of depositing a low K dielectric with organo silane

Integrated low K dielectrics and etch stops

Low power method of depositing a low k dielectric with organo silane

Method of depositing a low k dielectric with organo silane

Patents Applicationslast 30 patents

LOW DIELECTRIC CONSTANT FILM PRODUCED FROM SILICON COMPOUNDS COMPRI...

LOW DIELECTRIC CONSTANT FILM PRODUCED FROM SILICON COMPOUNDS COMPRI...

LOW DIELECTRIC CONSTANT FILM PRODUCED FROM SILICON COMPOUNDS COMPRI...

Method of depositing low k films

Low dielectric constant film produced from silicon compounds compri...

Integrated low k dielectrics and etch stops

Low dielectric constant film produced from silicon compounds compri...

Method of decreasing the K value in SIOC layer deposited by chemica...

Low dielectric constant film produced from silicon compounds compri...

Method of decreasing the K value in SIOC layer deposited by chemica...

Method of depositing low K films

Method of depositing a low dielectric with organo silane

Method of depositing a low K dielectric with organo silane

Intergrated low k dielectrics and etch stops

Integrated low k dielectrics and etch stops

A LOW DIELECTRIC CONSTANT FILM PRODUCED FROM SILICON COMPOUNDS COMP...

PLASMA PROCESSES FOR DEPOSITING LOW DIELECTRIC CONSTANT FILMS