KURT H. JUNKER

Person

DRIPPING SPRINGS, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods for forming semiconductor devices with stepped bond pads
- Patent number 9,780,051
- Issue date Oct 3, 2017
- NXP USA, INC.
- Tu-Anh N. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a die with recessed aluminum die pads
- Patent number 9,209,078
- Issue date Dec 8, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Gregory S. Spencer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a die with recessed aluminum die pads
- Patent number 8,722,530
- Issue date May 13, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Gregory S. Spencer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an organic anti-reflective coating (ARC...
- Patent number 8,039,389
- Issue date Oct 18, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Douglas M. Reber
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for forming a through silicon via layout
- Patent number 7,799,678
- Issue date Sep 21, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Thomas J. Kropewnicki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of removing defects from a dielectric material in a semicond...
- Patent number 7,776,731
- Issue date Aug 17, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Kurt H. Junker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer silicon nitride deposition for a semiconductor device
- Patent number 7,700,499
- Issue date Apr 20, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Kurt H. Junker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device with multiple tensile stre...
- Patent number 7,678,698
- Issue date Mar 16, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Xiangzheng Bo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep STI trench and SOI undercut enabling STI oxide stressor
- Patent number 7,678,665
- Issue date Mar 16, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Michael D. Turner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Disposable organic spacers
- Patent number 7,579,228
- Issue date Aug 25, 2009
- FREESCALE SEMICONDUCTOR, INC.
- Paul A. Grudowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition and patterning of boron nitride nanotube ILD
- Patent number 7,279,433
- Issue date Oct 9, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Peter L. G. Ventzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an organic anti-reflective coating (ARC...
- Patent number 7,199,429
- Issue date Apr 3, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Douglas M. Reber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma treatment for surface of semiconductor device
- Patent number 7,176,130
- Issue date Feb 13, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Jin Miao Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming boron carbo-nitride layers for integrated circui...
- Patent number 7,144,803
- Issue date Dec 5, 2006
- Semiconductor Research Corporation
- Edward R. Engbrecht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capping layer for reducing amorphous carbon contamination of photor...
- Patent number 7,109,101
- Issue date Sep 19, 2006
- AMD, Inc.
- Marilyn I. Wright
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of ultra low K dielectric in a semiconductor fabricatio...
- Patent number 6,992,003
- Issue date Jan 31, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Gregory S. Spencer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an organic anti-reflective coating (ARC...
- Patent number 6,972,255
- Issue date Dec 6, 2005
- FREESCALE SEMICONDUCTOR, INC.
- Douglas M. Reber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
UV cure process and tool for low k film formation
- Patent number 6,475,930
- Issue date Nov 5, 2002
- Motorola, Inc.
- Kurt H. Junker
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE HAVING A METAL OXIDE METAL (MOM) CAPACITOR AND...
- Publication number 20170053930
- Publication date Feb 23, 2017
- FREESCALE SEMICONDUCTOR, INC.
- ERWIN J. PRINZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING SEMICONDUCTOR DEVICES WITH STEPPED BOND PADS
- Publication number 20150171035
- Publication date Jun 18, 2015
- TU-ANH N. TRAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A DIE WITH RECESSED ALUMINUM DIE PADS
- Publication number 20140213050
- Publication date Jul 31, 2014
- FREESCALE SEMICONDUCTOR, INC.
- GREGORY S. SPENCER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A DIE WITH RECESSED ALUMIUM DIE PADS
- Publication number 20130029485
- Publication date Jan 31, 2013
- Gregory S. Spencer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER SILICON NITRIDE DEPOSITION FOR A SEMICONDUCTOR DEVICE
- Publication number 20110210401
- Publication date Sep 1, 2011
- Freescale Semiconductor Inc.
- Kurt H. Junker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A THROUGH SILICON VIA LAYOUT
- Publication number 20090191708
- Publication date Jul 30, 2009
- Thomas J. Kropewnicki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REMOVING DEFECTS FROM A DIELECTRIC MATERIAL IN A SEMICOND...
- Publication number 20090075434
- Publication date Mar 19, 2009
- Kurt H. Junker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Disposable organic spacers
- Publication number 20090017587
- Publication date Jan 15, 2009
- Freescale Semiconductor, Inc.
- Paul A. Grudowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH MULTIPLE TENSILE STRESSOR LAYERS AND METHOD
- Publication number 20080272411
- Publication date Nov 6, 2008
- Xiangzheng Bo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Deep STI trench and SOI undercut enabling STI oxide stressor
- Publication number 20080220617
- Publication date Sep 11, 2008
- Freescale Semiconductor, Inc.
- Michael D. Turner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer silicon nitride deposition for a semiconductor device
- Publication number 20080173908
- Publication date Jul 24, 2008
- Freescale Semiconductor, Inc.
- Kurt H. Junker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer silicon nitride deposition for a semiconductor device
- Publication number 20080173986
- Publication date Jul 24, 2008
- Freescale Semiconductor, Inc.
- Kurt H. Junker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A STRESSOR LAYER
- Publication number 20080026517
- Publication date Jan 31, 2008
- Paul A. Grudowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING AN ORGANIC ANTI-REFLECTIVE COATING (ARC...
- Publication number 20070141770
- Publication date Jun 21, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Douglas M. Reber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma treatment for surface of semiconductor device
- Publication number 20060105568
- Publication date May 18, 2006
- Jin Miao Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Deposition and patterning of boron nitride nanotube ILD
- Publication number 20060063392
- Publication date Mar 23, 2006
- Freescale Semiconductor Inc.
- Peter L.G. Ventzek
- B82 - NANO-TECHNOLOGY
Information Patent Application
Semiconductor device having an organic anti-reflective coating (ARC...
- Publication number 20050181596
- Publication date Aug 18, 2005
- Douglas M. Reber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integration of ultra low K dielectric in a semiconductor fabricatio...
- Publication number 20050059245
- Publication date Mar 17, 2005
- Gregory S. Spencer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having an organic anti-reflective coating (ARC...
- Publication number 20050026338
- Publication date Feb 3, 2005
- Douglas M. Reber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of forming boron carbo-nitride layers for integrated circui...
- Publication number 20040259353
- Publication date Dec 23, 2004
- Edward R. Engbrecht
- H01 - BASIC ELECTRIC ELEMENTS

KURT H. JUNKER

Person

Patents Grantslast 30 patents

Methods for forming semiconductor devices with stepped bond pads

Method of making a die with recessed aluminum die pads

Method of making a die with recessed aluminum die pads

Semiconductor device having an organic anti-reflective coating (ARC...

Method for forming a through silicon via layout

Method of removing defects from a dielectric material in a semicond...

Multilayer silicon nitride deposition for a semiconductor device

Method of forming a semiconductor device with multiple tensile stre...

Deep STI trench and SOI undercut enabling STI oxide stressor

Disposable organic spacers

Deposition and patterning of boron nitride nanotube ILD

Semiconductor device having an organic anti-reflective coating (ARC...

Plasma treatment for surface of semiconductor device

Methods of forming boron carbo-nitride layers for integrated circui...

Capping layer for reducing amorphous carbon contamination of photor...

Integration of ultra low K dielectric in a semiconductor fabricatio...

Semiconductor device having an organic anti-reflective coating (ARC...

UV cure process and tool for low k film formation

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE HAVING A METAL OXIDE METAL (MOM) CAPACITOR AND...

METHODS FOR FORMING SEMICONDUCTOR DEVICES WITH STEPPED BOND PADS

METHOD OF MAKING A DIE WITH RECESSED ALUMINUM DIE PADS

METHOD OF MAKING A DIE WITH RECESSED ALUMIUM DIE PADS

MULTILAYER SILICON NITRIDE DEPOSITION FOR A SEMICONDUCTOR DEVICE

METHOD FOR FORMING A THROUGH SILICON VIA LAYOUT

METHOD OF REMOVING DEFECTS FROM A DIELECTRIC MATERIAL IN A SEMICOND...

Disposable organic spacers

SEMICONDUCTOR DEVICE WITH MULTIPLE TENSILE STRESSOR LAYERS AND METHOD

Deep STI trench and SOI undercut enabling STI oxide stressor

Multilayer silicon nitride deposition for a semiconductor device

Multilayer silicon nitride deposition for a semiconductor device

METHOD FOR FORMING A STRESSOR LAYER

SEMICONDUCTOR DEVICE HAVING AN ORGANIC ANTI-REFLECTIVE COATING (ARC...

Plasma treatment for surface of semiconductor device

Deposition and patterning of boron nitride nanotube ILD

Semiconductor device having an organic anti-reflective coating (ARC...

Integration of ultra low K dielectric in a semiconductor fabricatio...

Semiconductor device having an organic anti-reflective coating (ARC...

Methods of forming boron carbo-nitride layers for integrated circui...