Kwai Hong Wong

Person

Melaka, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with protruding component portion and method o...
- Patent number 8,664,753
- Issue date Mar 4, 2014
- Infineon Technologies AG
- Teck Sim Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor chips with separate encapsulations
- Patent number 8,334,586
- Issue date Dec 18, 2012
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor chips with separate encapsulations
- Patent number 7,969,018
- Issue date Jun 28, 2011
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE BASED FAN-OUT WAFER LEVEL PACKAGING
- Publication number 20190259731
- Publication date Aug 22, 2019
- UNISEM (M) BERHAD
- Kim Heng Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMI SHIELDING FOR DISCRETE INTEGRATED CIRCUIT PACKAGES
- Publication number 20190181095
- Publication date Jun 13, 2019
- Unisem (M) Berhad
- Kwai Hong Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate Based Fan-Out Wafer Level Packaging
- Publication number 20180130769
- Publication date May 10, 2018
- UNISEM (M) BERHAD
- Kim Heng Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate Based Fan-Out Wafer Level Packaging
- Publication number 20180130720
- Publication date May 10, 2018
- UNISEM (M) BERHAD
- Kim Heng Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate Based Fan-Out Wafer Level Packaging
- Publication number 20180130768
- Publication date May 10, 2018
- UNISEM (M) BERHAD
- Kim Heng Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR CHIPS
- Publication number 20110215460
- Publication date Sep 8, 2011
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH PROTRUDING COMPONENT PORTION AND METHOD O...
- Publication number 20110121439
- Publication date May 26, 2011
- INFINEON TECHNOLOGIES AG
- Teck Sim Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR CHIPS
- Publication number 20100013106
- Publication date Jan 21, 2010
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS

Kwai Hong Wong

Person

Patents Grantslast 30 patents

Semiconductor device with protruding component portion and method o...

Stacked semiconductor chips with separate encapsulations

Stacked semiconductor chips with separate encapsulations

Patents Applicationslast 30 patents

SUBSTRATE BASED FAN-OUT WAFER LEVEL PACKAGING

EMI SHIELDING FOR DISCRETE INTEGRATED CIRCUIT PACKAGES

Substrate Based Fan-Out Wafer Level Packaging

Substrate Based Fan-Out Wafer Level Packaging

Substrate Based Fan-Out Wafer Level Packaging

STACKED SEMICONDUCTOR CHIPS

SEMICONDUCTOR DEVICE WITH PROTRUDING COMPONENT PORTION AND METHOD O...

STACKED SEMICONDUCTOR CHIPS