Kyle Arrington

Person

Gilbert, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Enhanced base die heat path using through-silicon vias
- Patent number 12,057,369
- Issue date Aug 6, 2024
- Intel Corporation
- Weston Bertrand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated heat spreader with enhanced vapor chamber for multichip...
- Patent number 12,046,536
- Issue date Jul 23, 2024
- Intel Corporation
- Je-Young Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed heat spreader structures and methods of providing same
- Patent number 11,923,268
- Issue date Mar 5, 2024
- Intel Corporation
- Jesus Gerardo Reyes Schuldes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
First-level integration of second-level thermal interface material...
- Patent number 11,881,438
- Issue date Jan 23, 2024
- Intel Corporation
- Elah Bozorg-Grayeli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface structures for integrated circuit packages
- Patent number 11,869,824
- Issue date Jan 9, 2024
- Intel Corporation
- Kyle J. Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced base die heat path using through-silicon vias
- Patent number 11,854,935
- Issue date Dec 26, 2023
- Intel Corporation
- Weston Bertrand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC assemblies including die perimeter frames suitable for containin...
- Patent number 11,842,944
- Issue date Dec 12, 2023
- Intel Corporation
- Kyle Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Full package vapor chamber with IHS
- Patent number 11,832,419
- Issue date Nov 28, 2023
- Intel Corporation
- Nicholas Neal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid metal thermal interface material application
- Patent number 11,679,407
- Issue date Jun 20, 2023
- Intel Corporation
- Kyle Jordan Arrington
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Low force liquid metal interconnect solutions
- Patent number 11,622,466
- Issue date Apr 4, 2023
- Intel Corporation
- Karumbu Meyyappan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus to provide electrical shielding for integrate...
- Patent number 11,616,000
- Issue date Mar 28, 2023
- Intel Corporation
- Dong-Ho Han
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO IMPROVE...
- Publication number 20240312865
- Publication date Sep 19, 2024
- Intel Corporation
- Kyle Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED BASE DIE HEAT PATH USING THROUGH-SILICON VIAS
- Publication number 20240282667
- Publication date Aug 22, 2024
- Intel Corporation
- Weston BERTRAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPILLARY UNDERFILL FORMULATIONS THAT INCLUDE CARBON NANOTUBES, CON...
- Publication number 20240270929
- Publication date Aug 15, 2024
- Intel Corporation
- Clay Arrington
- B82 - NANO-TECHNOLOGY
Information Patent Application
LIGHT RESPONSIVE PHOTORESISTS AND METHODS
- Publication number 20240264530
- Publication date Aug 8, 2024
- Intel Corporation
- Ryan Carrazzone
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
OPTICAL SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240219659
- Publication date Jul 4, 2024
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACH IN GLASS CORE PACKAGE THROUGH ORGANIC-TO-ORGANIC BONDING
- Publication number 20240222345
- Publication date Jul 4, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR ATTACHING AN OPTICAL COMPONENT USING HYBRI...
- Publication number 20240222243
- Publication date Jul 4, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO PRODUCE...
- Publication number 20240222259
- Publication date Jul 4, 2024
- Intel Corporation
- Haobo Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240219655
- Publication date Jul 4, 2024
- Intel Corporation
- Haobo Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240219660
- Publication date Jul 4, 2024
- Intel Corporation
- Bohan Shan
- G02 - OPTICS
Information Patent Application
METHODS AND APPARATUS FOR OPTICAL THERMAL TREATMENT IN SEMICONDUCTO...
- Publication number 20240222301
- Publication date Jul 4, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO REDUCE SOLDER BUMP BRIDGING BETWEEN TWO SU...
- Publication number 20240222304
- Publication date Jul 4, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL LAYER WITH ROUGHENED SURFACES
- Publication number 20240222136
- Publication date Jul 4, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS SUBSTRATE DEVICE WITH PLATED THROUGH HOLES
- Publication number 20240222257
- Publication date Jul 4, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240219654
- Publication date Jul 4, 2024
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240219656
- Publication date Jul 4, 2024
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS SUBSTRATE FABRICATION USING HYBRID BONDING
- Publication number 20240222210
- Publication date Jul 4, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR ATTACHING AN OPTICAL COMPONENT USING NO RE...
- Publication number 20240222238
- Publication date Jul 4, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS SUBSTRATE DEVICE WITH EMBEDDED COMPONENTS
- Publication number 20240213170
- Publication date Jun 27, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO COOL IN...
- Publication number 20240213116
- Publication date Jun 27, 2024
- Intel Corporation
- Kyle Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS SUBSTRATE DEVICE WITH THROUGH GLASS CAVITY
- Publication number 20240215269
- Publication date Jun 27, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW DIE HEIGHT GLASS SUBSTRATE DEVICE AND METHOD
- Publication number 20240213169
- Publication date Jun 27, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP...
- Publication number 20240186228
- Publication date Jun 6, 2024
- Intel Corporation
- Haobo Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP...
- Publication number 20240186227
- Publication date Jun 6, 2024
- Intel Corporation
- Haobo Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES
- Publication number 20240112971
- Publication date Apr 4, 2024
- Intel Corporation
- Yiqun Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH GLASS VIAS (TGVS) IN GLASS CORE SUBSTRATES
- Publication number 20240071848
- Publication date Feb 29, 2024
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL BASED FIRST LEVEL INTERCONNECTS
- Publication number 20240006400
- Publication date Jan 4, 2024
- Intel Corporation
- Kyle J. Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PCB FOR TOPSIDE POWER DELIVERY
- Publication number 20230317706
- Publication date Oct 5, 2023
- Intel Corporation
- Kyle ARRINGTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGULATED DIE SHIPPING TRAY ASSEMBLY
- Publication number 20230290661
- Publication date Sep 14, 2023
- Intel Corporation
- Kyle ARRINGTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW FORCE LIQUID METAL INTERCONNECT SOLUTIONS
- Publication number 20230209759
- Publication date Jun 29, 2023
- Intel Corporation
- Karumbu MEYYAPPAN
- H01 - BASIC ELECTRIC ELEMENTS

Kyle Arrington

Person

Patents Grantslast 30 patents

Enhanced base die heat path using through-silicon vias

Integrated heat spreader with enhanced vapor chamber for multichip...

Printed heat spreader structures and methods of providing same

First-level integration of second-level thermal interface material...

Thermal interface structures for integrated circuit packages

Enhanced base die heat path using through-silicon vias

IC assemblies including die perimeter frames suitable for containin...

Full package vapor chamber with IHS

Liquid metal thermal interface material application

Low force liquid metal interconnect solutions

Methods and apparatus to provide electrical shielding for integrate...

Patents Applicationslast 30 patents

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO IMPROVE...

ENHANCED BASE DIE HEAT PATH USING THROUGH-SILICON VIAS

CAPILLARY UNDERFILL FORMULATIONS THAT INCLUDE CARBON NANOTUBES, CON...

LIGHT RESPONSIVE PHOTORESISTS AND METHODS

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD

DIE ATTACH IN GLASS CORE PACKAGE THROUGH ORGANIC-TO-ORGANIC BONDING

APPARATUS AND METHOD FOR ATTACHING AN OPTICAL COMPONENT USING HYBRI...

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO PRODUCE...

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD

METHODS AND APPARATUS FOR OPTICAL THERMAL TREATMENT IN SEMICONDUCTO...

METHODS AND APPARATUS TO REDUCE SOLDER BUMP BRIDGING BETWEEN TWO SU...

ELECTRICAL LAYER WITH ROUGHENED SURFACES

GLASS SUBSTRATE DEVICE WITH PLATED THROUGH HOLES

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD

GLASS SUBSTRATE FABRICATION USING HYBRID BONDING

APPARATUS AND METHOD FOR ATTACHING AN OPTICAL COMPONENT USING NO RE...

GLASS SUBSTRATE DEVICE WITH EMBEDDED COMPONENTS

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO COOL IN...

GLASS SUBSTRATE DEVICE WITH THROUGH GLASS CAVITY

LOW DIE HEIGHT GLASS SUBSTRATE DEVICE AND METHOD

INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP...

INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP...

SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES

THROUGH GLASS VIAS (TGVS) IN GLASS CORE SUBSTRATES

LIQUID METAL BASED FIRST LEVEL INTERCONNECTS

METAL PCB FOR TOPSIDE POWER DELIVERY

SINGULATED DIE SHIPPING TRAY ASSEMBLY

LOW FORCE LIQUID METAL INTERCONNECT SOLUTIONS