Kyle Arrington

Person

Gilbert, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Omni directional interconnect with magnetic fillers in mold matrix
- Patent number 12,354,883
- Issue date Jul 8, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low force liquid metal interconnect solutions
- Patent number 12,349,303
- Issue date Jul 1, 2025
- Intel Corporation
- Karumbu Meyyappan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced base die heat path using through-silicon vias
- Patent number 12,266,589
- Issue date Apr 1, 2025
- Intel Corporation
- Weston Bertrand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Immersion cooling for integrated circuit devices
- Patent number 12,238,892
- Issue date Feb 25, 2025
- Intel Corporation
- Raanan Sover
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enhanced base die heat path using through-silicon vias
- Patent number 12,057,369
- Issue date Aug 6, 2024
- Intel Corporation
- Weston Bertrand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated heat spreader with enhanced vapor chamber for multichip...
- Patent number 12,046,536
- Issue date Jul 23, 2024
- Intel Corporation
- Je-Young Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed heat spreader structures and methods of providing same
- Patent number 11,923,268
- Issue date Mar 5, 2024
- Intel Corporation
- Jesus Gerardo Reyes Schuldes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
First-level integration of second-level thermal interface material...
- Patent number 11,881,438
- Issue date Jan 23, 2024
- Intel Corporation
- Elah Bozorg-Grayeli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface structures for integrated circuit packages
- Patent number 11,869,824
- Issue date Jan 9, 2024
- Intel Corporation
- Kyle J. Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced base die heat path using through-silicon vias
- Patent number 11,854,935
- Issue date Dec 26, 2023
- Intel Corporation
- Weston Bertrand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC assemblies including die perimeter frames suitable for containin...
- Patent number 11,842,944
- Issue date Dec 12, 2023
- Intel Corporation
- Kyle Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Full package vapor chamber with IHS
- Patent number 11,832,419
- Issue date Nov 28, 2023
- Intel Corporation
- Nicholas Neal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid metal thermal interface material application
- Patent number 11,679,407
- Issue date Jun 20, 2023
- Intel Corporation
- Kyle Jordan Arrington
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Low force liquid metal interconnect solutions
- Patent number 11,622,466
- Issue date Apr 4, 2023
- Intel Corporation
- Karumbu Meyyappan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus to provide electrical shielding for integrate...
- Patent number 11,616,000
- Issue date Mar 28, 2023
- Intel Corporation
- Dong-Ho Han
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LOW TEMPERATURE SOLDER INTERCONNECT FOR PACKAGE PITCH SCALING
- Publication number 20250218998
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR POWER AND SPACER COMPONENTS EMBEDDED IN A SUBSTRAT...
- Publication number 20250218904
- Publication date Jul 3, 2025
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH PILLAR-FIRST CONDUCTIVE VIA FORMATI...
- Publication number 20250218880
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO EMBED A SEMICONDUCTOR DEVICE IN A GLASS CORE
- Publication number 20250218957
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PEDESTALS FOR SEMICONDUCTOR COMPONENTS EMBEDDED IN PACKAGE SUBSTRAT...
- Publication number 20250218958
- Publication date Jul 3, 2025
- Intel Corporation
- Brandon Christian Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICALLY EMBEDDED COMPONENTS IN PACKAGE SUBSTRATES
- Publication number 20250219021
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLOW ENHANCED DUMMY STRUCTURE TO ENABLE CAPILLARY FLOW BASED SIDEWA...
- Publication number 20250220818
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO EMBED SEMICONDUCTOR DEVICES IN CORES OF PA...
- Publication number 20250218960
- Publication date Jul 3, 2025
- Intel Corporation
- Clay Bradley Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE COMPONENT ASSEMBLY FOR THICKNESS MODIFICATION TO MATCH CORE...
- Publication number 20250218999
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH CAPACITORS IN MULTI-CORE INTEGRATED CIRCUIT DEVICE PACK...
- Publication number 20250219028
- Publication date Jul 3, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING CAVITY-LESS ENCAPSULATED DIES
- Publication number 20250218926
- Publication date Jul 3, 2025
- Intel Corporation
- Minglu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED PASSIVE ASSEMBLIES FOR EMBEDDING IN THICK CORES
- Publication number 20250218906
- Publication date Jul 3, 2025
- Intel Corporation
- Zhixin XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR CONNECTED COMPONENTS EMBEDDED IN A SUBSTRATE CORE
- Publication number 20250218964
- Publication date Jul 3, 2025
- Intel Corporation
- Kyle J. Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH STRENGTHENED GLASS CORES
- Publication number 20250210426
- Publication date Jun 26, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED BRIDGE WITH THROUGH SILICON VIA BONDING ARCHITECTURES
- Publication number 20250192059
- Publication date Jun 12, 2025
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED BASE DIE HEAT PATH USING THROUGH-SILICON VIAS
- Publication number 20250191998
- Publication date Jun 12, 2025
- Intel Corporation
- Weston BERTRAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDING FOR EMBEDDED BRIDGES WITH VIAS
- Publication number 20250183180
- Publication date Jun 5, 2025
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH THROUGH-GLASS VIA STRESS ALLEVIATIO...
- Publication number 20250183182
- Publication date Jun 5, 2025
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS
- Publication number 20250112136
- Publication date Apr 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR CAPILLARY UNDERFILL OF EMBEDDED DEVICES
- Publication number 20250112085
- Publication date Apr 3, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLING SUBSTRATE BUMP HEIGHT
- Publication number 20250112164
- Publication date Apr 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORES INCLUDING PROTRUDING THROUGH GLASS VIAS AND RELATED MET...
- Publication number 20250105074
- Publication date Mar 27, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STIFFENER ARCHITECTURES FOR GLASS EDGE PROTECTION
- Publication number 20250106983
- Publication date Mar 27, 2025
- Intel Corporation
- Bohan SHAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND APPARATUS TO IMPROVE THERMAL DISSIPATION AND MECHANICAL...
- Publication number 20250014967
- Publication date Jan 9, 2025
- Intel Corporation
- Kyle Jordan Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
2D FILLERS FOR REDUCED CTE FOR PID
- Publication number 20240332125
- Publication date Oct 3, 2024
- Intel Corporation
- Kyle ARRINGTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO IMPROVE...
- Publication number 20240312865
- Publication date Sep 19, 2024
- Intel Corporation
- Kyle Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED BASE DIE HEAT PATH USING THROUGH-SILICON VIAS
- Publication number 20240282667
- Publication date Aug 22, 2024
- Intel Corporation
- Weston BERTRAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPILLARY UNDERFILL FORMULATIONS THAT INCLUDE CARBON NANOTUBES, CON...
- Publication number 20240270929
- Publication date Aug 15, 2024
- Intel Corporation
- Clay Arrington
- B82 - NANO-TECHNOLOGY
Information Patent Application
LIGHT RESPONSIVE PHOTORESISTS AND METHODS
- Publication number 20240264530
- Publication date Aug 8, 2024
- Intel Corporation
- Ryan Carrazzone
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
OPTICAL SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240219659
- Publication date Jul 4, 2024
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS

Kyle Arrington

Person

Patents Grantslast 30 patents

Omni directional interconnect with magnetic fillers in mold matrix

Low force liquid metal interconnect solutions

Enhanced base die heat path using through-silicon vias

Immersion cooling for integrated circuit devices

Enhanced base die heat path using through-silicon vias

Integrated heat spreader with enhanced vapor chamber for multichip...

Printed heat spreader structures and methods of providing same

First-level integration of second-level thermal interface material...

Thermal interface structures for integrated circuit packages

Enhanced base die heat path using through-silicon vias

IC assemblies including die perimeter frames suitable for containin...

Full package vapor chamber with IHS

Liquid metal thermal interface material application

Low force liquid metal interconnect solutions

Methods and apparatus to provide electrical shielding for integrate...

Patents Applicationslast 30 patents

LOW TEMPERATURE SOLDER INTERCONNECT FOR PACKAGE PITCH SCALING

TECHNOLOGIES FOR POWER AND SPACER COMPONENTS EMBEDDED IN A SUBSTRAT...

MICROELECTRONIC ASSEMBLIES WITH PILLAR-FIRST CONDUCTIVE VIA FORMATI...

METHODS AND APPARATUS TO EMBED A SEMICONDUCTOR DEVICE IN A GLASS CORE

PEDESTALS FOR SEMICONDUCTOR COMPONENTS EMBEDDED IN PACKAGE SUBSTRAT...

VERTICALLY EMBEDDED COMPONENTS IN PACKAGE SUBSTRATES

FLOW ENHANCED DUMMY STRUCTURE TO ENABLE CAPILLARY FLOW BASED SIDEWA...

METHODS AND APPARATUS TO EMBED SEMICONDUCTOR DEVICES IN CORES OF PA...

PASSIVE COMPONENT ASSEMBLY FOR THICKNESS MODIFICATION TO MATCH CORE...

DEEP TRENCH CAPACITORS IN MULTI-CORE INTEGRATED CIRCUIT DEVICE PACK...

MICROELECTRONIC ASSEMBLIES INCLUDING CAVITY-LESS ENCAPSULATED DIES

RECONSTITUTED PASSIVE ASSEMBLIES FOR EMBEDDING IN THICK CORES

TECHNOLOGIES FOR CONNECTED COMPONENTS EMBEDDED IN A SUBSTRATE CORE

MICROELECTRONIC ASSEMBLIES WITH STRENGTHENED GLASS CORES

EMBEDDED BRIDGE WITH THROUGH SILICON VIA BONDING ARCHITECTURES

ENHANCED BASE DIE HEAT PATH USING THROUGH-SILICON VIAS

DIRECT BONDING FOR EMBEDDED BRIDGES WITH VIAS

MICROELECTRONIC ASSEMBLIES WITH THROUGH-GLASS VIA STRESS ALLEVIATIO...

GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS

APPARATUS AND METHODS FOR CAPILLARY UNDERFILL OF EMBEDDED DEVICES

CONTROLLING SUBSTRATE BUMP HEIGHT

GLASS CORES INCLUDING PROTRUDING THROUGH GLASS VIAS AND RELATED MET...

STIFFENER ARCHITECTURES FOR GLASS EDGE PROTECTION

METHODS AND APPARATUS TO IMPROVE THERMAL DISSIPATION AND MECHANICAL...

2D FILLERS FOR REDUCED CTE FOR PID

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO IMPROVE...

ENHANCED BASE DIE HEAT PATH USING THROUGH-SILICON VIAS

CAPILLARY UNDERFILL FORMULATIONS THAT INCLUDE CARBON NANOTUBES, CON...

LIGHT RESPONSIVE PHOTORESISTS AND METHODS

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD