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Kyong-Mo Bang
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San Jose, CA, US
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Patents Grants
last 30 patents
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Patent Grant
Components, methods and assemblies for stacked packages
Patent number
7,935,569
Issue date
May 3, 2011
Tessera, Inc.
Kyong-Mo Bang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Components, methods and assemblies for stacked packages
Patent number
7,294,928
Issue date
Nov 13, 2007
Tessera, Inc.
Kyong-Mo Bang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Methods of making microelectronic packages including folded substrates
Patent number
7,246,431
Issue date
Jul 24, 2007
Tessera, Inc.
Kyong-Mo Bang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic packages with self-aligning features
Patent number
7,053,485
Issue date
May 30, 2006
Tessera, Inc.
Kyong-Mo Bang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Alignment and cutting of microelectronic substrates
Publication number
20080156518
Publication date
Jul 3, 2008
Tessera, Inc.
Kenneth Allen Honer
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Components, methods and assemblies for stacked packages
Publication number
20080042274
Publication date
Feb 21, 2008
Tessera, Inc.
Kyong-Mo Bang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Components, methods and assemblies for stacked packages
Publication number
20040145054
Publication date
Jul 29, 2004
Tessera, Inc.
Kyong-Mo Bang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Methods of making microelectronic packages including folded substrates
Publication number
20040115866
Publication date
Jun 17, 2004
Tessera, Inc.
Kyong-Mo Bang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Microelectronic packages with self-aligning features
Publication number
20040104470
Publication date
Jun 3, 2004
Tessera, Inc.
Kyong-Mo Bang
H01 - BASIC ELECTRIC ELEMENTS