Kyoung Moo HARR

Person

Suwon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Fan-out semiconductor package
- Patent number 10,741,461
- Issue date Aug 11, 2020
- Samsung Electronics Co., Ltd.
- Hyoung Joon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package and method of manufacturing the fan-o...
- Patent number 10,622,322
- Issue date Apr 14, 2020
- Samsung Electronics Co., Ltd.
- Hyoung Joon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package and method of manufacturing same
- Patent number 10,388,614
- Issue date Aug 20, 2019
- Samsung Electronics Co., Ltd.
- Ji Hyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,224,288
- Issue date Mar 5, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Kyung Seob Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,211,149
- Issue date Feb 19, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Kyoung Moo Harr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,170,382
- Issue date Jan 1, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Hyoung Joon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 10,154,594
- Issue date Dec 11, 2018
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jeong-Ho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package and method of manufacturing same
- Patent number 10,062,652
- Issue date Aug 28, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Ji Hyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,043,758
- Issue date Aug 7, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Ji Hyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package and method of manufacturing the same
- Patent number 9,905,526
- Issue date Feb 27, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Kyoung Moo Harr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 9,881,873
- Issue date Jan 30, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Kyung Seob Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for removing seed layer in manufacturing printed circuit boa...
- Patent number 8,957,319
- Issue date Feb 17, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Sung Han
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Electronic Component Package
- Publication number 20200027833
- Publication date Jan 23, 2020
- Samsung Electronics Co., Ltd.
- Ji Hyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20180323119
- Publication date Nov 8, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Hyoung Joon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20180240751
- Publication date Aug 23, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Kyoung Moo HARR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20180226350
- Publication date Aug 9, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Ji Hyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20180197827
- Publication date Jul 12, 2018
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Ji Hyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE FAN-O...
- Publication number 20180122759
- Publication date May 3, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Hyoung Joon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20180090402
- Publication date Mar 29, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Hyoung Joon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20180033733
- Publication date Feb 1, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Kyung Seob OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20170365558
- Publication date Dec 21, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Kyung Seob OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20170271272
- Publication date Sep 21, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Ji Hyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20170125318
- Publication date May 4, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Kyoung Moo HARR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD, MANUFACTURING METHOD THEREOF AND ELECTRONIC...
- Publication number 20160316557
- Publication date Oct 27, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Jeong-Ho LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND ELECTRONIC COMPONENT MODULE
- Publication number 20160198568
- Publication date Jul 7, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Mi Jin PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME
- Publication number 20150000958
- Publication date Jan 1, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Kyoung Moo HARR
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD HAVING COPPER PLATED LAYER WITH ROUGHNESS AND...
- Publication number 20140186651
- Publication date Jul 3, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Sung Han
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR REMOVING SEED LAYER IN MANUFACTURING PRINTED CIRCUIT BOA...
- Publication number 20140076619
- Publication date Mar 20, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Sung Han
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THREE-DIMENSIONAL (3D) SEMICONDUCTOR PACKAGE
- Publication number 20140042604
- Publication date Feb 13, 2014
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hyung Jin Jeon
- H01 - BASIC ELECTRIC ELEMENTS

Kyoung Moo HARR

Person

Patents Grantslast 30 patents

Fan-out semiconductor package

Fan-out semiconductor package and method of manufacturing the fan-o...

Fan-out semiconductor package and method of manufacturing same

Fan-out semiconductor package

Fan-out semiconductor package

Fan-out semiconductor package

Printed circuit board

Fan-out semiconductor package and method of manufacturing same

Fan-out semiconductor package

Electronic component package and method of manufacturing the same

Fan-out semiconductor package

Method for removing seed layer in manufacturing printed circuit boa...

Patents Applicationslast 30 patents

Electronic Component Package

FAN-OUT SEMICONDUCTOR PACKAGE

FAN-OUT SEMICONDUCTOR PACKAGE

FAN-OUT SEMICONDUCTOR PACKAGE

FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME

FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE FAN-O...

FAN-OUT SEMICONDUCTOR PACKAGE

FAN-OUT SEMICONDUCTOR PACKAGE

FAN-OUT SEMICONDUCTOR PACKAGE

FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME

ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD, MANUFACTURING METHOD THEREOF AND ELECTRONIC...

PRINTED CIRCUIT BOARD AND ELECTRONIC COMPONENT MODULE

PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME

PRINTED CIRCUIT BOARD HAVING COPPER PLATED LAYER WITH ROUGHNESS AND...

METHOD FOR REMOVING SEED LAYER IN MANUFACTURING PRINTED CIRCUIT BOA...

THREE-DIMENSIONAL (3D) SEMICONDUCTOR PACKAGE