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Kyuil Cho
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Santa Clara, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Package core assembly and fabrication methods
Patent number
12,087,679
Issue date
Sep 10, 2024
Han-Wen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stretchable polymer and dielectric layers for electronic displays
Patent number
11,925,073
Issue date
Mar 5, 2024
Applied Materials, Inc.
Kyuil Cho
Information
Patent Grant
Package structure and fabrication methods
Patent number
11,887,934
Issue date
Jan 30, 2024
Applied Materials, Inc.
Han-Wen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package core assembly and fabrication methods
Patent number
11,881,447
Issue date
Jan 23, 2024
Applied Materials, Inc.
Han-Wen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package core assembly and fabrication methods
Patent number
11,862,546
Issue date
Jan 2, 2024
Applied Materials, Inc.
Han-Wen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for substrate registration and anchoring in inkjet printing
Patent number
11,798,831
Issue date
Oct 24, 2023
Applied Materials, Inc.
Daihua Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High connectivity device stacking
Patent number
11,742,330
Issue date
Aug 29, 2023
Applied Materials, Inc.
Kurtis Leschkies
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reconstituted substrate structure and fabrication methods for heter...
Patent number
11,715,700
Issue date
Aug 1, 2023
Applied Materials, Inc.
Han-Wen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of micro-via formation for advanced packaging
Patent number
11,705,365
Issue date
Jul 18, 2023
Applied Materials, Inc.
Wei-Sheng Lei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and fabrication methods
Patent number
11,521,935
Issue date
Dec 6, 2022
Applied Materials, Inc.
Han-Wen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reconstituted substrate structure and fabrication methods for heter...
Patent number
11,476,202
Issue date
Oct 18, 2022
Applied Materials, Inc.
Han-Wen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reconstituted substrate structure and fabrication methods for heter...
Patent number
11,398,433
Issue date
Jul 26, 2022
Applied Materials, Inc.
Han-Wen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for improved polymer-copper adhesion
Patent number
11,388,822
Issue date
Jul 12, 2022
Applied Materials, Inc.
Tapash Chakraborty
B32 - LAYERED PRODUCTS
Information
Patent Grant
Method for substrate registration and anchoring in inkjet printing
Patent number
11,367,643
Issue date
Jun 21, 2022
Applied Materials, Inc.
Daihua Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Encapsulation having polymer and dielectric layers for electronic d...
Patent number
11,362,307
Issue date
Jun 14, 2022
Applied Materials, Inc.
Kyuil Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fine redistribution interconnect formation for advanced p...
Patent number
11,342,256
Issue date
May 24, 2022
Applied Materials, Inc.
Han-Wen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Anchoring dies using 3D printing to form reconstructed wafer
Patent number
11,329,003
Issue date
May 10, 2022
Applied Materials, Inc.
Daihua Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for substrate registration and anchoring in inkjet printing
Patent number
11,322,381
Issue date
May 3, 2022
Applied Materials, Inc.
Daihua Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for via formation by micro-imprinting
Patent number
11,281,094
Issue date
Mar 22, 2022
Applied Materials, Inc.
Roman Gouk
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Grant
Reconstituted substrate structure and fabrication methods for heter...
Patent number
11,264,333
Issue date
Mar 1, 2022
Applied Materials, Inc.
Han-Wen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and fabrication methods
Patent number
11,264,331
Issue date
Mar 1, 2022
Applied Materials, Inc.
Han-Wen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of forming stretchable encapsulation for electronic displays
Patent number
11,258,045
Issue date
Feb 22, 2022
Applied Materials, Inc.
Kyuil Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High connectivity device stacking
Patent number
11,257,790
Issue date
Feb 22, 2022
Applied Materials, Inc.
Kurtis Leschkies
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Stretchable polymer and dielectric layers for electronic displays
Patent number
11,211,439
Issue date
Dec 28, 2021
Applied Materials, Inc.
Kyuil Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure with embedded core
Patent number
10,937,726
Issue date
Mar 2, 2021
Applied Materials, Inc.
Han-Wen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and fabrication methods
Patent number
10,886,232
Issue date
Jan 5, 2021
Applied Materials, Inc.
Han-Wen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for via formation in flowable epoxy materials by micro-imprint
Patent number
10,727,083
Issue date
Jul 28, 2020
Applied Materials, Inc.
Roman Gouk
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Grant
Energy storage device having an interlayer between electrode and el...
Patent number
10,547,040
Issue date
Jan 28, 2020
Applied Materials, Inc.
Giback Park
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of reconstituted substrate formation for advanced packaging...
Patent number
10,211,072
Issue date
Feb 19, 2019
Applied Materials, Inc.
Han-Wen Chen
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
EFFICIENT AUTOCATALYTIC METALLIZATION OF POLYMERIC SURFACES
Publication number
20240222142
Publication date
Jul 4, 2024
Applied Materials, Inc.
Tapash CHAKRABORTY
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RECONSTITUTED SUBSTRATE STRUCTURE AND FABRICATION METHODS FOR HETER...
Publication number
20240021533
Publication date
Jan 18, 2024
Applied Materials, Inc.
Han-Wen CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH CONNECTIVITY DEVICE STACKING
Publication number
20240021582
Publication date
Jan 18, 2024
Applied Materials, Inc.
Kurtis LESCHKIES
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND FABRICATION METHODS
Publication number
20230187370
Publication date
Jun 15, 2023
Applied Materials, Inc.
Han-Wen CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS OF MICRO-VIA FORMATION FOR ADVANCED PACKAGING
Publication number
20220375787
Publication date
Nov 24, 2022
Applied Materials, Inc.
Wei-Sheng LEI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR SUBSTRATE REGISTRATION AND ANCHORING IN INKJET PRINTING
Publication number
20220336246
Publication date
Oct 20, 2022
Applied Materials, Inc.
Daihua Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS FOR SUBSTRATE REGISTRATION AND ANCHORING IN INKJET PRINTING
Publication number
20220328336
Publication date
Oct 13, 2022
Applied Materials, Inc.
Daihua Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ENCAPSULATION HAVING POLYMER AND DIELECTRIC LAYERS FOR ELECTRONIC D...
Publication number
20220293888
Publication date
Sep 15, 2022
Applied Materials, Inc.
Kyuil Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING STRETCHABLE ENCAPSULATION FOR ELECTRONIC DISPLAYS
Publication number
20220246888
Publication date
Aug 4, 2022
Applied Materials, Inc.
Kyuil Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR VIA FORMATION BY MICRO-IMPRINTING
Publication number
20220171281
Publication date
Jun 2, 2022
Applied Materials, Inc.
Roman GOUK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH CONNECTIVITY DEVICE STACKING
Publication number
20220139884
Publication date
May 5, 2022
Applied Materials, Inc.
Kurtis LESCHKIES
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Methods for Improved Polymer-Copper Adhesion
Publication number
20220071023
Publication date
Mar 3, 2022
Applied Materials, Inc.
Tapash Chakraborty
B32 - LAYERED PRODUCTS
Information
Patent Application
STRETCHABLE POLYMER AND DIELECTRIC LAYERS FOR ELECTRONIC DISPLAYS
Publication number
20220028942
Publication date
Jan 27, 2022
Applied Materials, Inc.
Kyuil Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH CONNECTIVITY DEVICE STACKING
Publication number
20210288027
Publication date
Sep 16, 2021
Applied Materials, Inc.
Kurtis LESCHKIES
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE CORE ASSEMBLY AND FABRICATION METHODS
Publication number
20210257289
Publication date
Aug 19, 2021
Applied Materials, Inc.
Han-Wen CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND FABRICATION METHODS
Publication number
20210257306
Publication date
Aug 19, 2021
Applied Materials, Inc.
Han-Wen CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RECONSTITUTED SUBSTRATE STRUCTURE AND FABRICATION METHODS FOR HETER...
Publication number
20210257307
Publication date
Aug 19, 2021
Applied Materials, Inc.
Han-Wen CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE CORE ASSEMBLY AND FABRICATION METHODS
Publication number
20210249345
Publication date
Aug 12, 2021
Applied Materials, Inc.
Han-Wen CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE CORE ASSEMBLY AND FABRICATION METHODS
Publication number
20210159160
Publication date
May 27, 2021
Applied Materials, Inc.
Han-Wen CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Encapsulation Having Polymer and Dielectric Layers for Electronic D...
Publication number
20210159458
Publication date
May 27, 2021
Applied Materials, Inc.
Kyuil Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stretchable Polymer and Dielectric Layers for Electronic Displays
Publication number
20210159457
Publication date
May 27, 2021
Applied Materials, Inc.
Kyuil Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE CORE ASSEMBLY AND FABRICATION METHODS
Publication number
20210159158
Publication date
May 27, 2021
Applied Materials, Inc.
Han-Wen CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS OF FORMING STRETCHABLE ENCAPSULATION FOR ELECTRONIC DISPLAYS
Publication number
20210159459
Publication date
May 27, 2021
Applied Materials, Inc.
Kyuil Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ANCHORING DIES USING 3D PRINTING TO FORM RECONSTRUCTED WAFER
Publication number
20200411447
Publication date
Dec 31, 2020
Applied Materials, Inc.
Daihua Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR SUBSTRATE REGISTRATION AND ANCHORING IN INKJET PRINTING
Publication number
20200411312
Publication date
Dec 31, 2020
Applied Materials, Inc.
Daihua Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR SUBSTRATE REGISTRATION AND ANCHORING IN INKJET PRINTING
Publication number
20200411351
Publication date
Dec 31, 2020
Applied Materials, Inc.
Daihua Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RECONSTITUTED SUBSTRATE STRUCTURE AND FABRICATION METHODS FOR HETER...
Publication number
20200395306
Publication date
Dec 17, 2020
Applied Materials, Inc.
Han-Wen CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RECONSTITUTED SUBSTRATE STRUCTURE AND FABRICATION METHODS FOR HETER...
Publication number
20200395305
Publication date
Dec 17, 2020
Applied Materials, Inc.
Han-Wen CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RECONSTITUTED SUBSTRATE STRUCTURE AND FABRICATION METHODS FOR HETER...
Publication number
20200395304
Publication date
Dec 17, 2020
Applied Materials, Inc.
Han-Wen CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND FABRICATION METHODS
Publication number
20200357749
Publication date
Nov 12, 2020
Applied Materials, Inc.
Han-Wen CHEN
H01 - BASIC ELECTRIC ELEMENTS