KyuWon Lee

Person

Ansung-Si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming bump pad array on substr...
- Patent number 12,211,778
- Issue date Jan 28, 2025
- STATS ChipPAC Pte. Ltd.
- Hermes T. Apale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming bump pad array on substr...
- Patent number 11,764,136
- Issue date Sep 19, 2023
- STATS ChipPAC Pte. Ltd.
- Hermes T. Apale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a shielding layer over a...
- Patent number 9,401,347
- Issue date Jul 26, 2016
- STATS ChipPAC Pte. Ltd.
- SinJae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with posts and method of manufa...
- Patent number 9,082,887
- Issue date Jul 14, 2015
- Stats Chippac Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a shielding layer over a...
- Patent number 8,937,371
- Issue date Jan 20, 2015
- STATS ChipPAC, Ltd.
- SinJae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming partially-etched conduct...
- Patent number 8,932,908
- Issue date Jan 13, 2015
- STATS ChipPAC, Ltd.
- KyuWon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming electrical interconnecti...
- Patent number 8,574,964
- Issue date Nov 5, 2013
- STATS ChipPAC, Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a shielding layer over a...
- Patent number 8,531,012
- Issue date Sep 10, 2013
- STATS ChipPAC, Ltd.
- SinJae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming WLCSP structure using pr...
- Patent number 8,519,544
- Issue date Aug 27, 2013
- STATS Chip PAC, Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with vertical interconnection a...
- Patent number 8,502,387
- Issue date Aug 6, 2013
- Stats Chippac Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with partially-etched conductive layer recesse...
- Patent number 8,502,392
- Issue date Aug 6, 2013
- STATS ChipPAC, Ltd.
- KyuWon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with package-on-package and met...
- Patent number 8,432,028
- Issue date Apr 30, 2013
- Stats Chippac Ltd.
- JinGwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with embedded conductive struct...
- Patent number 8,310,038
- Issue date Nov 13, 2012
- Stats Chippac Ltd.
- JinGwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming partially-etched conductive layer recessed within...
- Patent number 8,288,202
- Issue date Oct 16, 2012
- STATS ChiPAC, Ltd.
- KyuWon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming WLCSP structure using pr...
- Patent number 8,273,604
- Issue date Sep 25, 2012
- STAT ChipPAC, Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package stacking system
- Patent number 8,004,093
- Issue date Aug 23, 2011
- Stats Chippac Ltd.
- JiHoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package system with heat spreader
- Patent number 7,683,469
- Issue date Mar 23, 2010
- Stats Chippac Ltd.
- JiHoon Oh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Forming Dummy SOP Within Saw Street
- Publication number 20250079372
- Publication date Mar 6, 2025
- STATS ChipPAC Pte Ltd.
- KyuWon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Bump Pad Array on Substr...
- Publication number 20230307335
- Publication date Sep 28, 2023
- STATS ChipPAC Pte Ltd.
- Hermes T. Apale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Stabilizing Heat Spreader on Sem...
- Publication number 20230230893
- Publication date Jul 20, 2023
- STATS ChipPAC Pte Ltd.
- SooJung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Bump Pad Array on Substr...
- Publication number 20230059429
- Publication date Feb 23, 2023
- STATS ChipPAC Pte Ltd.
- Hermes T. Apale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Shielding Layer Over a...
- Publication number 20150137334
- Publication date May 21, 2015
- STATS ChipPAC, Ltd.
- SinJae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Electrical Interconnecti...
- Publication number 20140008783
- Publication date Jan 9, 2014
- STATS ChipPAC, Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Shielding Layer over a...
- Publication number 20130292804
- Publication date Nov 7, 2013
- SinJae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Partially-Etched Conduct...
- Publication number 20130249090
- Publication date Sep 26, 2013
- STATS ChipPAC, Ltd.
- KyuWon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Partially-Etched Conduct...
- Publication number 20120326303
- Publication date Dec 27, 2012
- STATS ChipPAC, Ltd.
- KyuWon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming WLCSP Structure using Pr...
- Publication number 20120306097
- Publication date Dec 6, 2012
- STATS ChipPAC, Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH EMBEDDED CONDUCTIVE STRUCT...
- Publication number 20120241967
- Publication date Sep 27, 2012
- JinGwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE-ON-PACKAGE AND MET...
- Publication number 20120241936
- Publication date Sep 27, 2012
- JinGwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming WLCSP Structure Using Pr...
- Publication number 20120211892
- Publication date Aug 23, 2012
- STATS ChipPAC, Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH VERTICAL INTERCONNECTION A...
- Publication number 20120146235
- Publication date Jun 14, 2012
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Partially-Etched Conduct...
- Publication number 20120126416
- Publication date May 24, 2012
- STATS ChipPAC, Ltd.
- KyuWon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH POSTS AND METHOD OF MANUFA...
- Publication number 20110291264
- Publication date Dec 1, 2011
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Electrical Interconnecti...
- Publication number 20110254146
- Publication date Oct 20, 2011
- STATS ChipPAC, Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Shielding Layer over a...
- Publication number 20110095403
- Publication date Apr 28, 2011
- STATS ChipPAC, Ltd.
- SinJae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE STACKING SYSTEM
- Publication number 20100025835
- Publication date Feb 4, 2010
- JiHoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE SYSTEM WITH HEAT SPREADER
- Publication number 20090294941
- Publication date Dec 3, 2009
- JiHoon Oh
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor device and method of forming bump pad array on substr...

Semiconductor device and method of forming bump pad array on substr...

Semiconductor device and method of forming a shielding layer over a...

Integrated circuit packaging system with posts and method of manufa...

Semiconductor device and method of forming a shielding layer over a...

Semiconductor device and method of forming partially-etched conduct...

Semiconductor device and method of forming electrical interconnecti...

Semiconductor device and method of forming a shielding layer over a...

Semiconductor device and method of forming WLCSP structure using pr...

Integrated circuit packaging system with vertical interconnection a...

Semiconductor device with partially-etched conductive layer recesse...

Integrated circuit packaging system with package-on-package and met...

Integrated circuit packaging system with embedded conductive struct...

Method of forming partially-etched conductive layer recessed within...

Semiconductor device and method of forming WLCSP structure using pr...

Integrated circuit package stacking system

Package-on-package system with heat spreader

Patents Applicationslast 30 patents

Semiconductor Device and Method of Forming Dummy SOP Within Saw Street

Semiconductor Device and Method of Forming Bump Pad Array on Substr...

Semiconductor Device and Method of Stabilizing Heat Spreader on Sem...

Semiconductor Device and Method of Forming Bump Pad Array on Substr...

Semiconductor Device and Method of Forming a Shielding Layer Over a...

Semiconductor Device and Method of Forming Electrical Interconnecti...

Semiconductor Device and Method of Forming a Shielding Layer over a...

Semiconductor Device and Method of Forming Partially-Etched Conduct...

Semiconductor Device and Method of Forming Partially-Etched Conduct...

Semiconductor Device and Method of Forming WLCSP Structure using Pr...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH EMBEDDED CONDUCTIVE STRUCT...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE-ON-PACKAGE AND MET...

Semiconductor Device and Method of Forming WLCSP Structure Using Pr...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH VERTICAL INTERCONNECTION A...

Semiconductor Device and Method of Forming Partially-Etched Conduct...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH POSTS AND METHOD OF MANUFA...

Semiconductor Device and Method of Forming Electrical Interconnecti...

Semiconductor Device and Method of Forming a Shielding Layer over a...

INTEGRATED CIRCUIT PACKAGE STACKING SYSTEM

PACKAGE-ON-PACKAGE SYSTEM WITH HEAT SPREADER