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Patents Grants
last 30 patents
Information
Patent Grant
Circuit modules with front-side interposer terminals and through-mo...
Patent number
11,581,241
Issue date
Feb 14, 2023
NXP USA, INC.
Boon Yew Low
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with bond wire reinforcement structure
Patent number
11,056,457
Issue date
Jul 6, 2021
NXP USA, INC.
Boon Yew Low
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate interconnections for packaged semiconductor device
Patent number
9,997,445
Issue date
Jun 12, 2018
NXP USA, INC.
Kai Yun Yow
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package having two substrates
Patent number
9,721,928
Issue date
Aug 1, 2017
NXP USA, INC.
Navas Khan Oratti Kalandar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Combined QFN and QFP semiconductor package
Patent number
9,589,928
Issue date
Mar 7, 2017
NXP USA, INC.
Zhigang Bai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit substrate and method of manufacturing same
Patent number
9,474,162
Issue date
Oct 18, 2016
FREESCALE SEMIOCNDUCTOR, INC.
Chee Seng Foong
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Substrate for alternative semiconductor die configurations
Patent number
9,437,492
Issue date
Sep 6, 2016
FREESCALE SEMICONDUCTOR, INC.
Kai Yun Yow
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package with organic interposer
Patent number
9,401,345
Issue date
Jul 26, 2016
FREESCALE SEMICONDUCTOR, INC.
Chee Seng Foong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Pressure sensor device with through silicon via
Patent number
9,297,713
Issue date
Mar 29, 2016
Freescale Semiconductor,INC
Wai Yew Lo
G01 - MEASURING TESTING
Information
Patent Grant
Interposer with overmolded vias
Patent number
9,269,659
Issue date
Feb 23, 2016
FREESCALE SEMICONDUCTOR, INC.
Chee Seng Foong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Pressure sensor device with gel retainer
Patent number
9,214,402
Issue date
Dec 15, 2015
FREESCALE SEMICONDUCTOR, INC.
Kee Cheong Fam
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Non-homogeneous molding of packaged semiconductor devices
Patent number
9,202,770
Issue date
Dec 1, 2015
FREESCALE SEMICONDUCTOR, INC.
Chee Seng Foong
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Power bar design for lead frame-based packages
Patent number
9,177,834
Issue date
Nov 3, 2015
FREESCALE SEMICONDUCTOR, INC.
Chee Seng Foong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Insulated wire bonding with EFO before second bond
Patent number
9,165,904
Issue date
Oct 20, 2015
FREESCALE SEMICONDUCTOR, INC.
Chin Teck Siong
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Pillar bump formed using spot-laser
Patent number
9,053,972
Issue date
Jun 9, 2015
FREESCALE SEMICONDUCTOR, INC.
Chee Seng Foong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of making surface mount stacked semiconductor devices
Patent number
8,853,058
Issue date
Oct 7, 2014
FREESCALE SEMICONDUCTOR, INC.
Kesvakumar V. C. Muniandy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Pressure sensor and method of packaging same
Patent number
8,802,474
Issue date
Aug 12, 2014
FREESCALE SEMICONDUCTOR, INC.
Jinzhong Yao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming stacked die package using redistributed chip pack...
Patent number
8,669,140
Issue date
Mar 11, 2014
FREESCALE SEMICONDUCTOR, INC.
Kesvakumar V. C. Muniandy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged semiconductor die with power rail pads
Patent number
8,643,189
Issue date
Feb 4, 2014
FREESCALE SEMICONDUCTOR, INC.
Boon Yew Low
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
CIRCUIT MODULES WITH FRONT-SIDE INTERPOSER TERMINALS AND THROUGH-MO...
Publication number
20220208646
Publication date
Jun 30, 2022
NXP USA, Inc.
Boon Yew Low
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH BOND WIRE REINFORCEMMENT STRUCTURE
Publication number
20200105709
Publication date
Apr 2, 2020
NXP USA, Inc.
Boon Yew Low
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE INTERCONNECTIONS FOR PACKAGED SEMICONDUCTOR DEVICE
Publication number
20180114748
Publication date
Apr 26, 2018
NXP USA, Inc.
Kai Yun Yow
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE FOR ALTERNATIVE SEMICONDUCTOR DIE CONFIGURATIONS
Publication number
20160093533
Publication date
Mar 31, 2016
FREESCALE SEMICONDUCTOR, INC.
Kai Yun Yow
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MOLDED INTERPOSER FOR PACKAGED SEMICONDUCTOR DEVICE
Publication number
20160071789
Publication date
Mar 10, 2016
FREESCALE SEMICONDUCTOR, INC.
Pei Fan Tong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH ORGANIC INTERPOSER
Publication number
20160064356
Publication date
Mar 3, 2016
FREESCALE SEMICONDUCTOR, INC.
Chee Seng Foong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMBINED QFN AND QFP SEMICONDUCTOR PACKAGE
Publication number
20150294924
Publication date
Oct 15, 2015
Zhigang Bai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRESSURE SENSOR DEVICE WITH THROUGH SILICON VIA
Publication number
20150270206
Publication date
Sep 24, 2015
FREESCALE SEMICONDUCTOR, INC.
Wai Yew Lo
G01 - MEASURING TESTING
Information
Patent Application
POWER BAR DESIGN FOR LEAD FRAME-BASED PACKAGES
Publication number
20150235924
Publication date
Aug 20, 2015
Chee Seng Foong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRESSURE SENSOR DEVICE WITH GEL RETAINER
Publication number
20150200180
Publication date
Jul 16, 2015
Kee Cheong Fam
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CIRCUIT SUBSTRATE AND METHOD OF MANUFACTURING SAME
Publication number
20150201489
Publication date
Jul 16, 2015
Chee Seng Foong
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
WAFER LEVEL PACKAGE WITH REDISTRIBUTION LAYER FORMED WITH METALLIC...
Publication number
20150200177
Publication date
Jul 16, 2015
Chee Seng Foong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EMICONDUCTOR DEVICE WITH DIE TOP POWER CONNECTIONS
Publication number
20150187728
Publication date
Jul 2, 2015
Kesvakumar V.C. Muniandy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PILLAR BUMP FORMED USING SPOT-LASER
Publication number
20150137354
Publication date
May 21, 2015
Chee Seng Foong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SURFACE MOUNT SEMICONDUCTOR DEVICE WITH ADDITIONAL BOTTOM FACE CONT...
Publication number
20150097278
Publication date
Apr 9, 2015
FREESCALE SEMICONDUCTOR, INC.
Zhigang Bai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE-ON-PACKAGE SEMICONDUCTOR SENSOR DEVICE
Publication number
20150069537
Publication date
Mar 12, 2015
Wai Yew Lo
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
PRESSURE SENSOR DEVICE AND ASSEMBLY METHOD
Publication number
20150054099
Publication date
Feb 26, 2015
Kai Yun Yow
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRESSURE SENSOR AND METHOD OF PACKAGING SAME
Publication number
20140206124
Publication date
Jul 24, 2014
FREESCALE SEMICONDUCTOR, INC.
Jinzhong Yao
G01 - MEASURING TESTING
Information
Patent Application
PACKAGED SEMICONDUCTOR DIE WITH POWER RAIL PADS
Publication number
20140021621
Publication date
Jan 23, 2014
FREESCALE SEMICONDUCTOR, INC.
Boon Yew Low
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MAKING SURFACE MOUNT STACKED SEMICONDUCTOR DEVICES
Publication number
20130344656
Publication date
Dec 26, 2013
FREESCALE SEMICONDUCTOR, INC.
Kesvakumar V.C. Muniandy
H01 - BASIC ELECTRIC ELEMENTS