Lap Kei CHOW

Person

Hong Kong, HK

People

Patents Grantslast 30 patents

Information Patent Grant
Laser processing method and apparatus
- Patent number 8,709,916
- Issue date Apr 29, 2014
- ASM Technology Singapore Pte. Ltd.
- Chi Hang Kwok
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Nozzle device employing high frequency wave energy
- Patent number 8,702,017
- Issue date Apr 22, 2014
- ASM Assembly Automation LTD
- Lap Kei Eric Chow
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Method of configuring a dicing device, and a dicing apparatus for d...
- Patent number 8,538,576
- Issue date Sep 17, 2013
- ASM Technology Singapore Pte. Ltd.
- Chi Wah Cheng
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Laser processing apparatus
- Patent number 8,354,612
- Issue date Jan 15, 2013
- ASM Assembly Automation LTD
- Chi Wah Cheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Alignment method for singulation system
- Patent number 8,289,388
- Issue date Oct 16, 2012
- ASM Assembly Automation LTD
- Chi Wah Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor semiconductor package and method of manufacturing the same
- Patent number 6,982,491
- Issue date Jan 3, 2006
- ASAT Ltd.
- Chun Ho Fan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Apparatus and method for testing semiconductor devices
- Patent number 6,783,316
- Issue date Aug 31, 2004
- ASM Assembly Automation Limited
- Ching Man Tsui
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
RADIATIVE WAFER CUTTING USING SELECTIVE FOCUSING DEPTHS
- Publication number 20190067049
- Publication date Feb 28, 2019
- ASM Technology Singapore Pte Ltd
- Chi Wah CHENG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING METHOD AND APPARATUS
- Publication number 20140011336
- Publication date Jan 9, 2014
- Chi Hang KWOK
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF CONFIGURING A DICING DEVICE, AND A DICING APPARATUS FOR D...
- Publication number 20120259444
- Publication date Oct 11, 2012
- ASM Technology Singapore Pte Ltd
- Chi Wah CHENG
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
LASER PROCESSING APPARATUS
- Publication number 20110233178
- Publication date Sep 29, 2011
- Chi Wah CHENG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ALIGNMENT METHOD FOR SINGULATION SYSTEM
- Publication number 20100289889
- Publication date Nov 18, 2010
- Chi Wah CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for testing semiconductor devices
- Publication number 20020196043
- Publication date Dec 26, 2002
- Ching Man Tsui
- G01 - MEASURING TESTING
Information Patent Application
Method and apparatus for processing an array of components
- Publication number 20020177875
- Publication date Nov 28, 2002
- ASM Assembly Automation Ltd
- Ching Man Stanley Tsui
- H01 - BASIC ELECTRIC ELEMENTS

Lap Kei CHOW

Person

Patents Grantslast 30 patents

Laser processing method and apparatus

Nozzle device employing high frequency wave energy

Method of configuring a dicing device, and a dicing apparatus for d...

Laser processing apparatus

Alignment method for singulation system

Sensor semiconductor package and method of manufacturing the same

Apparatus and method for testing semiconductor devices

Patents Applicationslast 30 patents

RADIATIVE WAFER CUTTING USING SELECTIVE FOCUSING DEPTHS

LASER PROCESSING METHOD AND APPARATUS

METHOD OF CONFIGURING A DICING DEVICE, AND A DICING APPARATUS FOR D...

LASER PROCESSING APPARATUS

ALIGNMENT METHOD FOR SINGULATION SYSTEM

Apparatus and method for testing semiconductor devices

Method and apparatus for processing an array of components