Larry Zhao

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Hoeilaart, BE

People

Patents Grantslast 30 patents

Information Patent Grant
Copper based nitride liner passivation layers for conductive copper...
- Patent number 9,318,436
- Issue date Apr 19, 2016
- GLOBALFOUNDRIES Inc.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming a metal cap layer on copper-based conductive str...
- Patent number 9,236,299
- Issue date Jan 12, 2016
- GLOBALFOUNDRIES Inc.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming cap layers for semiconductor devices with self-a...
- Patent number 9,070,711
- Issue date Jun 30, 2015
- GLOBALFOUNDRIES Inc.
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming copper-based nitride liner/passivation layers fo...
- Patent number 8,859,419
- Issue date Oct 14, 2014
- GLOBALFOUNDRIES Inc.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming conductive copper-based structures using a coppe...
- Patent number 8,753,975
- Issue date Jun 17, 2014
- GLOBALFOUNDRIES Inc.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming copper-based conductive structures by forming a...
- Patent number 8,673,766
- Issue date Mar 18, 2014
- GLOBALFOUNDRIES Inc.
- Sean X. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming copper-based conductive structures on an integra...
- Patent number 8,517,769
- Issue date Aug 27, 2013
- GLOBALFOUNDRIES Inc.
- Sean X. Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF FORMING A METAL CAP LAYER ON COPPER-BASED CONDUCTIVE STR...
- Publication number 20150255339
- Publication date Sep 10, 2015
- GLOBALFOUNDRIES INC.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAP LAYERS FOR SEMICONDUCTOR DEVICES WITH SELF-ALIGNED CONTACT ELEM...
- Publication number 20150243604
- Publication date Aug 27, 2015
- GLOBALFOUNDRIES INC.
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING CAP LAYERS FOR SEMICONDUCTOR DEVICES WITH SELF-A...
- Publication number 20150035086
- Publication date Feb 5, 2015
- GLOBALFOUNDRIES INC.
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING COPPER-BASED NITRIDE LINER/PASSIVATION LAYERS FO...
- Publication number 20140361435
- Publication date Dec 11, 2014
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING COPPER-BASED NITRIDE LINER/PASSIVATION LAYERS FO...
- Publication number 20140217588
- Publication date Aug 7, 2014
- GLOBALFOUNDRIES INC.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING GRAPHENE LINERS AND/OR CAP LAYERS ON COPPER-BASE...
- Publication number 20140145332
- Publication date May 29, 2014
- GLOBALFOUNDRIES INC.
- Errol T. Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING COPPER-BASED CONDUCTIVE STRUCTURES BY FORMING A...
- Publication number 20130309863
- Publication date Nov 21, 2013
- Sean X. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING COPPER-BASED CONDUCTIVE STRUCTURES ON AN INTEGRA...
- Publication number 20130244421
- Publication date Sep 19, 2013
- GLOBALFOUNDRIES INC.
- Sean X. LIN
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Copper based nitride liner passivation layers for conductive copper...

Methods of forming a metal cap layer on copper-based conductive str...

Methods of forming cap layers for semiconductor devices with self-a...

Methods of forming copper-based nitride liner/passivation layers fo...

Methods of forming conductive copper-based structures using a coppe...

Methods of forming copper-based conductive structures by forming a...

Methods of forming copper-based conductive structures on an integra...

Patents Applicationslast 30 patents

METHODS OF FORMING A METAL CAP LAYER ON COPPER-BASED CONDUCTIVE STR...

CAP LAYERS FOR SEMICONDUCTOR DEVICES WITH SELF-ALIGNED CONTACT ELEM...

METHODS OF FORMING CAP LAYERS FOR SEMICONDUCTOR DEVICES WITH SELF-A...

METHODS OF FORMING COPPER-BASED NITRIDE LINER/PASSIVATION LAYERS FO...

METHODS OF FORMING COPPER-BASED NITRIDE LINER/PASSIVATION LAYERS FO...

METHODS OF FORMING GRAPHENE LINERS AND/OR CAP LAYERS ON COPPER-BASE...

METHODS OF FORMING COPPER-BASED CONDUCTIVE STRUCTURES BY FORMING A...

METHODS OF FORMING COPPER-BASED CONDUCTIVE STRUCTURES ON AN INTEGRA...