Laurent Barreau

Person

Cinq Mars La Pile, FR

People

Patents Grantslast 30 patents

Information Patent Grant
Method of direct encapsulation of a thin-film lithium-ion type batt...
- Patent number 8,840,686
- Issue date Sep 23, 2014
- STMicroelectronics (Tours) SAS
- Pierre Bouillon
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Method for encapsulating electronic components on a wafer
- Patent number 8,785,297
- Issue date Jul 22, 2014
- STMicroelectronics (Tours) SAS
- Marc Feron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface-mounted silicon chip
- Patent number 8,319,339
- Issue date Nov 27, 2012
- STMicroelectronics (Tours) SAS
- Christophe Serre
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for encapsulating electronic components on a wafer
- Patent number 8,309,403
- Issue date Nov 13, 2012
- STMicroelectronics (Tours) SAS
- Marc Feron
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20250096057
- Publication date Mar 20, 2025
- STMicroelectronics International N.V.
- Michael DE CRUZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING OF ELECTRONIC COMPONENTS
- Publication number 20230230906
- Publication date Jul 20, 2023
- STMicroelectronics (Tours) SAS
- Nicolas MODE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY COMPRISING A VERTICAL POWER COMPONENT ASSEMBLED ON A METAL...
- Publication number 20200258818
- Publication date Aug 13, 2020
- STMicroelectronics (Tours) SAS
- Samuel MENARD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ENCAPSULATING ELECTRONIC COMPONENTS ON A WAFER
- Publication number 20130043586
- Publication date Feb 21, 2013
- STMicroelectronics (Tours) SAS
- Marc Feron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ENCAPSULATING ELECTRONIC COMPONENTS ON A WAFER
- Publication number 20110124157
- Publication date May 26, 2011
- STMicroelectronics (Tours) SAS
- Marc Feron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DIRECT ENCAPSULATION OF A THIN-FILM LITHIUM-ION TYPE BATT...
- Publication number 20110052979
- Publication date Mar 3, 2011
- STMicroelectronics (Tours) SAS
- Pierre Bouillon
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SURFACE-MOUNTED SILICON CHIP
- Publication number 20110006423
- Publication date Jan 13, 2011
- STMicroelectronics (Tours) SAS
- Christophe Serre
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Laurent Barreau

Person

Patents Grantslast 30 patents

Method of direct encapsulation of a thin-film lithium-ion type batt...

Method for encapsulating electronic components on a wafer

Surface-mounted silicon chip

Method for encapsulating electronic components on a wafer

Patents Applicationslast 30 patents

ELECTRONIC COMPONENT

MANUFACTURING OF ELECTRONIC COMPONENTS

ASSEMBLY COMPRISING A VERTICAL POWER COMPONENT ASSEMBLED ON A METAL...

METHOD FOR ENCAPSULATING ELECTRONIC COMPONENTS ON A WAFER

METHOD FOR ENCAPSULATING ELECTRONIC COMPONENTS ON A WAFER

METHOD OF DIRECT ENCAPSULATION OF A THIN-FILM LITHIUM-ION TYPE BATT...

SURFACE-MOUNTED SILICON CHIP