Laurent-Luc Chapelon

Person

Domene, FR

People

Patents Grantslast 30 patents

Information Patent Grant
Image acquisition device
- Patent number 11,948,950
- Issue date Apr 2, 2024
- STMicroelectronics (Crolles 2) SAS
- Mickael Fourel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Phase-change memory
- Patent number 10,403,682
- Issue date Sep 3, 2019
- STMicroelectronics (Crolles 2) SAS
- Pierre Morin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated structure with improved heat dissipation
- Patent number 9,520,334
- Issue date Dec 13, 2016
- STMicroelectronics (Crolles 2) SAS
- Laurent-Luc Chapelon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip and fabrication method
- Patent number 9,455,239
- Issue date Sep 27, 2016
- STMicroelectronics (Crolles 2) SAS
- Laurent-Luc Chapelon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for estimating the diffusion length of metallic species with...
- Patent number 9,431,373
- Issue date Aug 30, 2016
- STMicroelectronics S.A.
- Rachid Taibi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic chip comprising connection pillars and manufacturing method
- Patent number 9,293,429
- Issue date Mar 22, 2016
- STMicroelectronics (Crolles 2) SAS
- Laurent-Luc Chapelon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating a three-dimensional integrated structure wi...
- Patent number 9,136,233
- Issue date Sep 15, 2015
- STMicroelctronis (Crolles 2) SAS
- Laurent-Luc Chapelon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack of semiconductor structures and corresponding manufacturing m...
- Patent number 9,093,456
- Issue date Jul 28, 2015
- STMicroelectronics (Crolles 2) SAS
- Laurent-Luc Chapelon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip and fabrication method
- Patent number 9,093,505
- Issue date Jul 28, 2015
- STMicroelectronics (Crolles 2) SAS
- Laurent-Luc Chapelon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip and fabrication method
- Patent number 8,980,738
- Issue date Mar 17, 2015
- STMicroelectronics (Crolles 2) SAS
- Laurent-Luc Chapelon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for estimating the diffusion length of metallic species with...
- Patent number 8,916,393
- Issue date Dec 23, 2014
- STMicroelectronics S.A.
- Rachid Taibi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack of semiconductor structures and corresponding manufacturing m...
- Patent number 8,907,481
- Issue date Dec 9, 2014
- STMicroelectronics (Crolles 2) SAS
- Laurent-Luc Chapelon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly system
- Patent number 8,896,121
- Issue date Nov 25, 2014
- STMicroelectronics (Crolles 2) SAS
- Laurent-Luc Chapelon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional integrated structure capable of detecting a tempe...
- Patent number 8,890,276
- Issue date Nov 18, 2014
- STMicroelectronics (Crolles 2) SAS
- Laurent-Luc Chapelon
- G01 - MEASURING TESTING
Information Patent Grant
Method for manufacturing an integrated circuit comprising vias cros...
- Patent number 8,860,186
- Issue date Oct 14, 2014
- STMicroelectronics (Crolles 2) SAS
- Mohamed Bouchoucha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit comprising a device with a vertical mobile eleme...
- Patent number 8,766,381
- Issue date Jul 1, 2014
- STMicroelectronics S.A.
- Fabrice Casset
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for determining the local stress induced in a semiconductor...
- Patent number 8,726,736
- Issue date May 20, 2014
- STMicroelectronics (Crolles 2) SAS
- Mohamed Bouchoucha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of assembling two integrated circuits and corresponding stru...
- Patent number 8,674,517
- Issue date Mar 18, 2014
- STMicroelectronics (Crolles 2) SAS
- Laurent-Luc Chapelon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for formation of an electrically conducting through via
- Patent number 8,673,740
- Issue date Mar 18, 2014
- STMicroelectronics (Crolles 2) SAS
- Julien Cuzzocrea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating integrated-circuit chips
- Patent number 8,518,802
- Issue date Aug 27, 2013
- STMicroelectronics (Crolles 2) SAS
- Laurent-Luc Chapelon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating integrated-circuit chips
- Patent number 8,466,038
- Issue date Jun 18, 2013
- STMicroelectronics (Crolles 2) SAS
- Laurent-Luc Chapelon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
IMAGE ACQUISITION DEVICE
- Publication number 20240204017
- Publication date Jun 20, 2024
- STMicroelectronics (Crolles 2) SAS
- Mickael FOUREL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE ACQUISITION DEVICE
- Publication number 20210327936
- Publication date Oct 21, 2021
- STMicroelectronics (Crolles 2) SAS
- Mickael FOUREL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHASE-CHANGE MEMORY
- Publication number 20180323237
- Publication date Nov 8, 2018
- STMicroelectronics (Crolles 2) SAS
- Pierre MORIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP AND FABRICATION METHOD
- Publication number 20150287689
- Publication date Oct 8, 2015
- STMicroelectronics (Crolles 2) SAS
- Laurent-Luc Chapelon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ESTIMATING THE DIFFUSION LENGTH OF METALLIC SPECIES WITH...
- Publication number 20150137330
- Publication date May 21, 2015
- STMicroelectronics S.A.
- Rachid TAIBI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK OF SEMICONDUCTOR STRUCTURES AND CORRESPONDING MANUFACTURING M...
- Publication number 20150054140
- Publication date Feb 26, 2015
- STMicroelectronics (Crolles 2) SAS
- Laurent-Luc Chapelon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR FABRICATING A THREE-DIMENSIONAL INTEGRATED STRUCTURE WI...
- Publication number 20140361413
- Publication date Dec 11, 2014
- STMicroelectronics (Crolles 2) SAS
- Laurent-Luc Chapelon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED STRUCTURE WITH IMPROVED HEAT DISSIPATION
- Publication number 20140210071
- Publication date Jul 31, 2014
- STMicroelectronics (Crolles 2) SAS
- Laurent-Luc Chapelon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED STRUCTURE CAPABLE OF DETECTING A TEMPE...
- Publication number 20140015088
- Publication date Jan 16, 2014
- Laurent-Luc Chapelon
- G01 - MEASURING TESTING
Information Patent Application
STACK OF SEMICONDUCTOR STRUCTURES AND CORRESPONDING MANUFACTURING M...
- Publication number 20130292823
- Publication date Nov 7, 2013
- STMicroelectronics (Crolles 2) SAS
- Laurent-Luc Chapelon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ASSEMBLY SYSTEM
- Publication number 20130207268
- Publication date Aug 15, 2013
- STMicroelectronics (Crolles 2) SAS
- Laurent-Luc Chapelon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING AN INTEGRATED CIRCUIT COMPRISING VIAS CROS...
- Publication number 20130207279
- Publication date Aug 15, 2013
- STMicroelectronics (Crolles 2) SAS
- Mohamed BOUCHOUCHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ESTIMATING THE DIFFUSION LENGTH OF METALLIC SPECIES WITH...
- Publication number 20130181220
- Publication date Jul 18, 2013
- STMicroelectronics (Crolles 2) SAS
- Rachid Taibi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DETERMINING THE LOCAL STRESS INDUCED IN A SEMICONDUCTOR...
- Publication number 20130112974
- Publication date May 9, 2013
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Mohamed Bouchoucha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMATION OF AN ELECTRICALLY CONDUCTING THROUGH VIA
- Publication number 20130084687
- Publication date Apr 4, 2013
- STMicroelectronics (Crolles 2) SAS
- Julien CUZZOCREA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CHIP COMPRISING CONNECTION PILLARS AND MANUFACTURING METHOD
- Publication number 20130026627
- Publication date Jan 31, 2013
- STMicroelectronics (Crolles 2) SAS
- Laurent-Luc Chapelon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP AND FABRICATION METHOD
- Publication number 20120171877
- Publication date Jul 5, 2012
- STMICROELECTRONICS (CROLLES 2) SAS
- Laurent-Luc Chapelon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR FABRICATING INTEGRATED-CIRCUIT CHIPS
- Publication number 20120153425
- Publication date Jun 21, 2012
- STMICROELECTRONICS (CROLLES 2) SAS
- Laurent-Luc Chapelon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ASSEMBLING TWO INTEGRATED CIRCUITS AND CORRESPONDING STRU...
- Publication number 20120153475
- Publication date Jun 21, 2012
- STMicroelectronics (Crolles 2) SAS
- Laurent-Luc Chapelon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR FABRICATING INTEGRATED-CIRCUIT CHIPS
- Publication number 20120156859
- Publication date Jun 21, 2012
- STMICROELECTRONICS (CROLLES 2) SAS
- Laurent-Luc Chapelon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP AND FABRICATION METHOD
- Publication number 20120146226
- Publication date Jun 14, 2012
- STMICROELECTRONICS (CROLLES 2) SAS
- Laurent-Luc Chapelon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT COMPRISING A DEVICE WITH A VERTICAL MOBILE ELEME...
- Publication number 20120074527
- Publication date Mar 29, 2012
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Fabrice Casset
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Laurent-Luc Chapelon

Person

Patents Grantslast 30 patents

Image acquisition device

Phase-change memory

Integrated structure with improved heat dissipation

Integrated circuit chip and fabrication method

Method for estimating the diffusion length of metallic species with...

Electronic chip comprising connection pillars and manufacturing method

Process for fabricating a three-dimensional integrated structure wi...

Stack of semiconductor structures and corresponding manufacturing m...

Integrated circuit chip and fabrication method

Integrated circuit chip and fabrication method

Method for estimating the diffusion length of metallic species with...

Stack of semiconductor structures and corresponding manufacturing m...

Chip assembly system

Three-dimensional integrated structure capable of detecting a tempe...

Method for manufacturing an integrated circuit comprising vias cros...

Integrated circuit comprising a device with a vertical mobile eleme...

Method for determining the local stress induced in a semiconductor...

Method of assembling two integrated circuits and corresponding stru...

Method for formation of an electrically conducting through via

Process for fabricating integrated-circuit chips

Process for fabricating integrated-circuit chips

Patents Applicationslast 30 patents

IMAGE ACQUISITION DEVICE

IMAGE ACQUISITION DEVICE

PHASE-CHANGE MEMORY

INTEGRATED CIRCUIT CHIP AND FABRICATION METHOD

METHOD FOR ESTIMATING THE DIFFUSION LENGTH OF METALLIC SPECIES WITH...

STACK OF SEMICONDUCTOR STRUCTURES AND CORRESPONDING MANUFACTURING M...

PROCESS FOR FABRICATING A THREE-DIMENSIONAL INTEGRATED STRUCTURE WI...

INTEGRATED STRUCTURE WITH IMPROVED HEAT DISSIPATION

THREE-DIMENSIONAL INTEGRATED STRUCTURE CAPABLE OF DETECTING A TEMPE...

STACK OF SEMICONDUCTOR STRUCTURES AND CORRESPONDING MANUFACTURING M...

CHIP ASSEMBLY SYSTEM

METHOD FOR MANUFACTURING AN INTEGRATED CIRCUIT COMPRISING VIAS CROS...

METHOD FOR ESTIMATING THE DIFFUSION LENGTH OF METALLIC SPECIES WITH...

METHOD FOR DETERMINING THE LOCAL STRESS INDUCED IN A SEMICONDUCTOR...

METHOD FOR FORMATION OF AN ELECTRICALLY CONDUCTING THROUGH VIA

ELECTRONIC CHIP COMPRISING CONNECTION PILLARS AND MANUFACTURING METHOD

INTEGRATED CIRCUIT CHIP AND FABRICATION METHOD

PROCESS FOR FABRICATING INTEGRATED-CIRCUIT CHIPS

METHOD OF ASSEMBLING TWO INTEGRATED CIRCUITS AND CORRESPONDING STRU...

PROCESS FOR FABRICATING INTEGRATED-CIRCUIT CHIPS

INTEGRATED CIRCUIT CHIP AND FABRICATION METHOD

INTEGRATED CIRCUIT COMPRISING A DEVICE WITH A VERTICAL MOBILE ELEME...