Lay Yeap Lim

Person

Penang, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor die package and method for making the same
- Patent number 9,159,656
- Issue date Oct 13, 2015
- Fairchild Semiconductor Corporation
- Oseob Jeon
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor die package and method for making the same
- Patent number 8,664,752
- Issue date Mar 4, 2014
- Fairchild Semiconductor Corporation
- Oseob Jeon
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of making and designing lead frames for semiconductor packages
- Patent number 8,110,447
- Issue date Feb 7, 2012
- Fairchild Semiconductor Corporation
- Lay Yeap Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etched leadframe structure
- Patent number 7,923,301
- Issue date Apr 12, 2011
- Fairchild Semiconductor Corporation
- Lay Yeap Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etched leadframe structure including recesses
- Patent number 7,683,463
- Issue date Mar 23, 2010
- Fairchild Semiconductor Corporation
- Lay Yeap Lim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20140167238
- Publication date Jun 19, 2014
- Fairchild Semiconductor Corporation
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20120181675
- Publication date Jul 19, 2012
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20100258925
- Publication date Oct 14, 2010
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Etched Leadframe Structure
- Publication number 20100136750
- Publication date Jun 3, 2010
- Lay Yeap Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING AND DESIGNING LEAD FRAMES FOR SEMICONDUCTOR PACKAGES
- Publication number 20090236711
- Publication date Sep 24, 2009
- Lay Yeap Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ultra-Thin Semiconductor Package
- Publication number 20090189261
- Publication date Jul 30, 2009
- Lay Yeap Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHED LEADFRAME STRUCTURE
- Publication number 20080258272
- Publication date Oct 23, 2008
- Lay Yeap Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor die package and method for making the same
- Publication number 20070001278
- Publication date Jan 4, 2007
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS

Lay Yeap Lim

Person

Patents Grantslast 30 patents

Semiconductor die package and method for making the same

Semiconductor die package and method for making the same

Method of making and designing lead frames for semiconductor packages

Etched leadframe structure

Etched leadframe structure including recesses

Patents Applicationslast 30 patents

SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME

SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME

SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME

Etched Leadframe Structure

METHOD OF MAKING AND DESIGNING LEAD FRAMES FOR SEMICONDUCTOR PACKAGES

Ultra-Thin Semiconductor Package

ETCHED LEADFRAME STRUCTURE

Semiconductor die package and method for making the same