Lee-Cheng Shen

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Package structure comprising conductive metal board and ground element
- Patent number 11,869,850
- Issue date Jan 9, 2024
- Wistron NeWeb Corporation
- Lee-Cheng Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,410,901
- Issue date Aug 9, 2022
- Wistron NeWeb Corporation
- Lee-Cheng Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless communicating device and portable electronic apparatus usi...
- Patent number 8,692,721
- Issue date Apr 8, 2014
- Quanta Computer Inc.
- Tsung-Ying Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testing system and testing method
- Patent number 8,228,083
- Issue date Jul 24, 2012
- Quanta Computer, Inc.
- Lee-Cheng Shen
- G01 - MEASURING TESTING
Information Patent Grant
Wafer level chip scale packaging structure and method of fabricatin...
- Patent number 8,039,935
- Issue date Oct 18, 2011
- Industrial Technology Research Institute
- Shu-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packaging structure with inductors and manufacture meth...
- Patent number 7,436,683
- Issue date Oct 14, 2008
- Industrial Technology Research Institute
- Lee-Cheng Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level chip scale packaging structure and method of fabricatin...
- Patent number 7,319,050
- Issue date Jan 15, 2008
- Industrial Technology Research Institute
- Shu-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level chip scale packaging structure and method of fabricatin...
- Patent number 6,998,718
- Issue date Feb 14, 2006
- Industrial Technology Research Institute
- Shu-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230053850
- Publication date Feb 23, 2023
- WISTRON NEWEB CORPORATION
- LEE-CHENG SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210398911
- Publication date Dec 23, 2021
- WISTRON NEWEB CORPORATION
- LEE-CHENG SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210151358
- Publication date May 20, 2021
- WISTRON NEWEB CORPORATION
- LEE-CHENG SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED RADIO-FREQUENCY STRUCTURE WITH SELECTIVE ELECTROMAGNETIC SHI...
- Publication number 20130201650
- Publication date Aug 8, 2013
- Quanta Computer Inc.
- Lee-Cheng SHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRELESS COMMUNICATING DEVICE AND PORTABLE ELECTRONIC APPARATUS USI...
- Publication number 20100289706
- Publication date Nov 18, 2010
- Quanta Computer Inc.
- Tsung-Ying Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Testing System and Testing Method
- Publication number 20100283476
- Publication date Nov 11, 2010
- Quanta Computer, Inc.
- Lee-Cheng Shen
- G01 - MEASURING TESTING
Information Patent Application
Packaging structure with protective layers and packaging method the...
- Publication number 20080014679
- Publication date Jan 17, 2008
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Lee-Cheng Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer level packaging structure with inductors and manufacture meth...
- Publication number 20070217174
- Publication date Sep 20, 2007
- Industrial Technology Research Institute
- Lee-Cheng Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer level chip scale packaging structure and method of fabricatin...
- Publication number 20070108629
- Publication date May 17, 2007
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Shu-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer level chip scale packaging structure and method of fabricatin...
- Publication number 20050230846
- Publication date Oct 20, 2005
- Industrial Technology Research Institute
- Shu-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL CHIP SCALE PACKAGING STRUCTURE AND METHOD OF FABRICATIN...
- Publication number 20050104226
- Publication date May 19, 2005
- Shu-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flexible electronic/optical interconnection film assembly and metho...
- Publication number 20040218848
- Publication date Nov 4, 2004
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Lee-Cheng Shen
- G02 - OPTICS

Lee-Cheng Shen

Person

Patents Grantslast 30 patents

Package structure comprising conductive metal board and ground element

Package structure and manufacturing method thereof

Wireless communicating device and portable electronic apparatus usi...

Testing system and testing method

Wafer level chip scale packaging structure and method of fabricatin...

Wafer level packaging structure with inductors and manufacture meth...

Wafer level chip scale packaging structure and method of fabricatin...

Wafer level chip scale packaging structure and method of fabricatin...

Patents Applicationslast 30 patents

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

MOLDED RADIO-FREQUENCY STRUCTURE WITH SELECTIVE ELECTROMAGNETIC SHI...

WIRELESS COMMUNICATING DEVICE AND PORTABLE ELECTRONIC APPARATUS USI...

Testing System and Testing Method

Packaging structure with protective layers and packaging method the...

Wafer level packaging structure with inductors and manufacture meth...

Wafer level chip scale packaging structure and method of fabricatin...

Wafer level chip scale packaging structure and method of fabricatin...

WAFER LEVEL CHIP SCALE PACKAGING STRUCTURE AND METHOD OF FABRICATIN...

Flexible electronic/optical interconnection film assembly and metho...