Lee Han Meng @Eugene Lee

Person

Melaka, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Spring bar leadframe, method and packaged electronic device with ze...
- Patent number 12,087,674
- Issue date Sep 10, 2024
- Texas Instruments Incorporated
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal semiconductor package molds
- Patent number 11,791,170
- Issue date Oct 17, 2023
- Texas Instruments Incorporated
- Anis Fauzi Bin Abdul Aziz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cutting a leadframe assembly with a plurality of punching tools
- Patent number 11,626,350
- Issue date Apr 11, 2023
- Texas Instruments Incorporated
- Chong Han Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with lead pitch gap
- Patent number 11,569,152
- Issue date Jan 31, 2023
- Texas Instruments Incorporated
- Anis Fauzi Bin Abdul Aziz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making leadframe strip
- Patent number 11,373,940
- Issue date Jun 28, 2022
- Texas Instruments Incorporated
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spring bar leadframe, method and packaged electronic device with ze...
- Patent number 11,264,310
- Issue date Mar 1, 2022
- Texas Instruments Incorporated
- Lee Han Meng Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making leadframe strip
- Patent number 10,784,190
- Issue date Sep 22, 2020
- Texas Instruments Incorporated
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package having an IC die between top and bottom...
- Patent number 10,381,293
- Issue date Aug 13, 2019
- Texas Instruments Incorporated
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe strip with vertically offset die attach pads between adja...
- Patent number 10,115,660
- Issue date Oct 30, 2018
- Texas Instruments Incorporated
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe strip with vertically offset die attach pads between adja...
- Patent number 9,741,643
- Issue date Aug 22, 2017
- Texas Instruments Incorporated
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package
- Patent number 9,029,990
- Issue date May 12, 2015
- Texas Instruments Incorporated
- Lee Hang Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Making an integrated circuit module with dual leadframes
- Patent number 9,029,194
- Issue date May 12, 2015
- Texas Instruments Incorporated
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of making
- Patent number 9,013,028
- Issue date Apr 21, 2015
- Texas Instruments Incorporated
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit module with dual leadframe
- Patent number 8,884,414
- Issue date Nov 11, 2014
- Texas Instruments Incorporated
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Exposed die package that helps protect the exposed die from damage
- Patent number 8,847,370
- Issue date Sep 30, 2014
- Texas Instruments Incorporated
- Lee Han Meng Eugene Lee
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Flexible routing for high current module application
- Patent number 8,779,566
- Issue date Jul 15, 2014
- National Semiconductor Corporation
- Lee Han Meng @ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Delamination resistant device package having raised bond surface an...
- Patent number 8,736,042
- Issue date May 27, 2014
- National Semiconductor Corporation
- Felix C. Li
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SPRING BAR LEADFRAME, METHOD AND PACKAGED ELECTRONIC DEVICE WITH ZE...
- Publication number 20220223503
- Publication date Jul 14, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPRING BAR LEADFRAME, METHOD AND PACKAGED ELECTRONIC DEVICE WITH ZE...
- Publication number 20210384110
- Publication date Dec 9, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIVERSAL SEMICONDUCTOR PACKAGE MOLDS
- Publication number 20210242038
- Publication date Aug 5, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Anis Fauzi BIN ABDUL AZIZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME ASSEMBLY
- Publication number 20210202356
- Publication date Jul 1, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Chong Han LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIVERSAL SEMICONDUCTOR PACKAGE MOLDS
- Publication number 20210043466
- Publication date Feb 11, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Anis Fauzi BIN ABDUL AZIZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING LEADFRAME STRIP
- Publication number 20210005540
- Publication date Jan 7, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH LEAD PITCH GAP
- Publication number 20200235042
- Publication date Jul 23, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Anis Fauzi Bin Abdul Aziz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH LEAD LOCK
- Publication number 20200176365
- Publication date Jun 4, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Bin Abdul Aziz Anis Fauzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH LEAD LOCK
- Publication number 20190206770
- Publication date Jul 4, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Bin Abdul Aziz Anis Fauzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having Leadframe With Pressure-Absorbing Pad S...
- Publication number 20180122724
- Publication date May 3, 2018
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME STRIP WITH VERTICALLY OFFSET DIE ATTACH PADS BETWEEN ADJA...
- Publication number 20170358523
- Publication date Dec 14, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME STRIP WITH VERTICALLY OFFSET DIE ATTACH PADS BETWEEN ADJA...
- Publication number 20170345743
- Publication date Nov 30, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE
- Publication number 20170213781
- Publication date Jul 27, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME STRIP WITH VERTICALLY OFFSET DIE ATTACH PADS BETWEEN ADJA...
- Publication number 20170213784
- Publication date Jul 27, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MINIMIZING MOLD FLASH DURING DAMBAR CUT
- Publication number 20150144389
- Publication date May 28, 2015
- Lee Han Meng @Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAKING AN INTEGTATED CIRCUIT MODULE WITH DUAL LEADFRAMES
- Publication number 20140242755
- Publication date Aug 28, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT MODULE WITH DUAL LEADFRAME
- Publication number 20140191381
- Publication date Jul 10, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF MAKING
- Publication number 20140191380
- Publication date Jul 10, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO LEVEL LEADFRAME WITH UPSET BALL BONDING SURFACE AND DEVICE PACKAGE
- Publication number 20130127029
- Publication date May 23, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng @ Eugene LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGN FOR EXPOSED DIE PACKAGE
- Publication number 20130087901
- Publication date Apr 11, 2013
- National Semiconductor Corporation
- Lee Han Meng @ Eugene LEE
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
FLEXIBLE ROUTING FOR HIGH CURRENT MODULE APPLICATION
- Publication number 20130045572
- Publication date Feb 21, 2013
- National Semiconductor Corporation
- Lee Han Meng @ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS

Lee Han Meng @Eugene Lee

Person

Patents Grantslast 30 patents

Spring bar leadframe, method and packaged electronic device with ze...

Universal semiconductor package molds

Cutting a leadframe assembly with a plurality of punching tools

Electronic device with lead pitch gap

Method of making leadframe strip

Spring bar leadframe, method and packaged electronic device with ze...

Method of making leadframe strip

Integrated circuit package having an IC die between top and bottom...

Leadframe strip with vertically offset die attach pads between adja...

Leadframe strip with vertically offset die attach pads between adja...

Integrated circuit package

Making an integrated circuit module with dual leadframes

Integrated circuit package and method of making

Integrated circuit module with dual leadframe

Exposed die package that helps protect the exposed die from damage

Flexible routing for high current module application

Delamination resistant device package having raised bond surface an...

Patents Applicationslast 30 patents

SPRING BAR LEADFRAME, METHOD AND PACKAGED ELECTRONIC DEVICE WITH ZE...

SPRING BAR LEADFRAME, METHOD AND PACKAGED ELECTRONIC DEVICE WITH ZE...

UNIVERSAL SEMICONDUCTOR PACKAGE MOLDS

LEADFRAME ASSEMBLY

UNIVERSAL SEMICONDUCTOR PACKAGE MOLDS

METHOD OF MAKING LEADFRAME STRIP

ELECTRONIC DEVICE WITH LEAD PITCH GAP

INTEGRATED CIRCUIT PACKAGE WITH LEAD LOCK

INTEGRATED CIRCUIT PACKAGE WITH LEAD LOCK

Semiconductor Device Having Leadframe With Pressure-Absorbing Pad S...

LEADFRAME STRIP WITH VERTICALLY OFFSET DIE ATTACH PADS BETWEEN ADJA...

LEADFRAME STRIP WITH VERTICALLY OFFSET DIE ATTACH PADS BETWEEN ADJA...

INTEGRATED CIRCUIT PACKAGE

LEADFRAME STRIP WITH VERTICALLY OFFSET DIE ATTACH PADS BETWEEN ADJA...

METHOD OF MINIMIZING MOLD FLASH DURING DAMBAR CUT

MAKING AN INTEGTATED CIRCUIT MODULE WITH DUAL LEADFRAMES

INTEGRATED CIRCUIT MODULE WITH DUAL LEADFRAME

INTEGRATED CIRCUIT PACKAGE AND METHOD OF MAKING

TWO LEVEL LEADFRAME WITH UPSET BALL BONDING SURFACE AND DEVICE PACKAGE

DESIGN FOR EXPOSED DIE PACKAGE

FLEXIBLE ROUTING FOR HIGH CURRENT MODULE APPLICATION