Lee Hua Alvin Seah

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Dual interlock heatsink assembly for enhanced cavity PBGA packages,...
- Patent number 8,736,046
- Issue date May 27, 2014
- STMicroelectronics Asia Pacific PTE Ltd.
- Lee Hua Alvin Seah
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DUAL INTERLOCK HEATSINK ASSEMBLY FOR ENHANCED CAVITY PBGA PACKAGES,...
- Publication number 20130093085
- Publication date Apr 18, 2013
- STMicroelectronics Asia Pacific Pte. Ltd.
- Lee Hua Alvin Seah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY PACKAGE INTERCONNECT WITH COPPER HEAT SPREADER AND MET...
- Publication number 20130069218
- Publication date Mar 21, 2013
- STMicroelectronics Asia Pacific Pte. Ltd.
- Lee Hua Alvin Seah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carrier tape for electronic components
- Publication number 20070023931
- Publication date Feb 1, 2007
- Boon Kiat Chew
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR