Lee Kong Yu

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Penang, MY

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Patents Grantslast 30 patents

Information Patent Grant
System and method to enhance reliability in connection with arrange...
- Patent number 11,264,301
- Issue date Mar 1, 2022
- Western Digital Technologies, Inc.
- Lee Kong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method to enhance solder joint reliability
- Patent number 11,094,604
- Issue date Aug 17, 2021
- Western Digital Technologies, Inc.
- Lee Kong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method to enhance solder joint reliability
- Patent number 10,636,722
- Issue date Apr 28, 2020
- Western Digital Technologies, Inc.
- Lee Kong Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING EMBEDDED MEMORY DIES AND METHOD OF M...
- Publication number 20230411340
- Publication date Dec 21, 2023
- Western Digital Technologies, Inc.
- Lee Kong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method to Enhance Solder Joint Reliability
- Publication number 20200219787
- Publication date Jul 9, 2020
- Western Digital Technologies, Inc.
- Lee Kong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD TO ENHANCE SOLDER JOINT RELIABILITY
- Publication number 20190326194
- Publication date Oct 24, 2019
- Western Digital Technologies, Inc.
- Lee Kong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD TO ENHANCE SOLDER JOINT RELIABILITY
- Publication number 20190096783
- Publication date Mar 28, 2019
- Western Digital Technologies, Inc.
- Lee Kong Yu
- H01 - BASIC ELECTRIC ELEMENTS