Lee-Sheng Yen

Person

Taoyuan County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Fabrication method of packaging substrate
- Patent number 9,084,341
- Issue date Jul 14, 2015
- Advance Materials Corporation
- Lee-Sheng Yen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making circuit board
- Patent number 8,987,060
- Issue date Mar 24, 2015
- Advance Materials Corporation
- Lee-Sheng Yen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure and package structure
- Patent number 8,836,108
- Issue date Sep 16, 2014
- Advance Materials Corporation
- Lee-Sheng Yen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making circuit board
- Patent number 8,748,234
- Issue date Jun 10, 2014
- Advance Materials Corporation
- Lee-Sheng Yen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure and packaging structure comprising the circ...
- Patent number 8,742,567
- Issue date Jun 3, 2014
- Advance Materials Corporation
- Lee-Sheng Yen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging substrate and fabrication method thereof
- Patent number 8,698,008
- Issue date Apr 15, 2014
- Advance Materials Corporation
- Lee-Sheng Yen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a package substrate
- Patent number 8,628,636
- Issue date Jan 14, 2014
- Advance Materials Corporation
- Lee-Sheng Yen
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Pad structure with a nano-structured coating film
- Patent number 8,102,063
- Issue date Jan 24, 2012
- Advance Materials Corporation
- Lee-Sheng Yen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
LIGHT EMITTING PACKAGE AND CARRIER STRUCTURE THEREFOR
- Publication number 20150171296
- Publication date Jun 18, 2015
- Lee-Sheng Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF PACKAGING SUBSTRATE
- Publication number 20140174644
- Publication date Jun 26, 2014
- ADVANCE MATERIALS CORPORATION
- Lee-Sheng Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING CIRCUIT BOARD
- Publication number 20130298397
- Publication date Nov 14, 2013
- Lee-Sheng Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A PACKAGE SUBSTRATE
- Publication number 20130180651
- Publication date Jul 18, 2013
- ADVANCE MATERIALS CORPORATION
- Lee-Sheng Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND FABRICATION METHOD THEREOF
- Publication number 20130146336
- Publication date Jun 13, 2013
- ADVANCE MATERIALS CORPORATION
- Lee-Sheng Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING CIRCUIT BOARD
- Publication number 20120260502
- Publication date Oct 18, 2012
- Lee-Sheng Yen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND PACKAGING STRUCTURE COMPRISING THE CIRC...
- Publication number 20120261176
- Publication date Oct 18, 2012
- Lee-Sheng Yen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE, PACKAGING STRUCTURE AND METHOD FOR MAKING...
- Publication number 20110260308
- Publication date Oct 27, 2011
- Lee-Sheng Yen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE, PACKAGING STRUCTURE AND METHOD FOR MAKING...
- Publication number 20110260340
- Publication date Oct 27, 2011
- Lee-Sheng Yen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PAD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20110108876
- Publication date May 12, 2011
- Lee-Sheng Yen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Lee-Sheng Yen

Person

Patents Grantslast 30 patents

Fabrication method of packaging substrate

Method for making circuit board

Circuit board structure and package structure

Method for making circuit board

Circuit board structure and packaging structure comprising the circ...

Packaging substrate and fabrication method thereof

Method of manufacturing a package substrate

Pad structure with a nano-structured coating film

Patents Applicationslast 30 patents

LIGHT EMITTING PACKAGE AND CARRIER STRUCTURE THEREFOR

FABRICATION METHOD OF PACKAGING SUBSTRATE

METHOD FOR MAKING CIRCUIT BOARD

METHOD OF MANUFACTURING A PACKAGE SUBSTRATE

PACKAGING SUBSTRATE AND FABRICATION METHOD THEREOF

METHOD FOR MAKING CIRCUIT BOARD

CIRCUIT BOARD STRUCTURE AND PACKAGING STRUCTURE COMPRISING THE CIRC...

CIRCUIT BOARD STRUCTURE, PACKAGING STRUCTURE AND METHOD FOR MAKING...

CIRCUIT BOARD STRUCTURE, PACKAGING STRUCTURE AND METHOD FOR MAKING...

PAD STRUCTURE AND MANUFACTURING METHOD THEREOF