Lei Li

Person

Richardson, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Structure and method for contact pads having a recessed bondable me...
- Patent number 7,351,651
- Issue date Apr 1, 2008
- Texas Instruments Incorporated
- Lei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for contact pads having a protected bondable m...
- Patent number 7,061,114
- Issue date Jun 13, 2006
- Texas Instruments Incorporated
- Edgardo R. Hortaleza
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Structure and method for contact pads having an overcoat-protected...
- Publication number 20060094228
- Publication date May 4, 2006
- Lei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and method for contact pads having a recessed bondable me...
- Publication number 20060082000
- Publication date Apr 20, 2006
- Lei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer with ditched scribe street
- Publication number 20050266661
- Publication date Dec 1, 2005
- Lei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and method for contact pads having a protected bondable m...
- Publication number 20050224984
- Publication date Oct 13, 2005
- Edgardo R. Hortaleza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and method for contact pads having double overcoat-protec...
- Publication number 20050224987
- Publication date Oct 13, 2005
- Edgardo R. Hortaleza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and method for contact pads having an overcoat-protected...
- Publication number 20050215048
- Publication date Sep 29, 2005
- Lei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and method for contact pads having a recessed bondable me...
- Publication number 20050206007
- Publication date Sep 22, 2005
- Lei Li
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Structure and method for contact pads having a recessed bondable me...

Structure and method for contact pads having a protected bondable m...

Patents Applicationslast 30 patents

Structure and method for contact pads having an overcoat-protected...

Structure and method for contact pads having a recessed bondable me...

Semiconductor wafer with ditched scribe street

Structure and method for contact pads having a protected bondable m...

Structure and method for contact pads having double overcoat-protec...

Structure and method for contact pads having an overcoat-protected...

Structure and method for contact pads having a recessed bondable me...