Lei Shan

Person

Yorktown Heights, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic substrate stacking
- Patent number 12,170,252
- Issue date Dec 17, 2024
- International Business Machines Corporation
- Lei Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power decoupling attachment
- Patent number 11,297,717
- Issue date Apr 5, 2022
- ELPIS TECHNOLOGIES INC.
- Lei Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Functional stiffener that enables land grid array interconnections...
- Patent number 11,062,976
- Issue date Jul 13, 2021
- International Business Machines Corporation
- Lei Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer capacitor package
- Patent number 10,892,105
- Issue date Jan 12, 2021
- International Business Machines Corporation
- Lei Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedding discrete components having variable dimensions in a subst...
- Patent number 10,701,797
- Issue date Jun 30, 2020
- International Business Machines Corporation
- Lei Shan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally conductive interface composition and use thereof
- Patent number 10,190,031
- Issue date Jan 29, 2019
- Jiali Wu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Multi-layer capacitor package
- Patent number 10,170,249
- Issue date Jan 1, 2019
- International Business Machines Corporation
- Lei Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedding discrete components having variable dimensions in a subst...
- Patent number 9,986,633
- Issue date May 29, 2018
- International Business Machines Corporation
- Lei Shan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power decoupling attachment
- Patent number 9,872,392
- Issue date Jan 16, 2018
- International Business Machines Corporation
- Lei Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redundant clock channel for high reliability connectors
- Patent number 8,257,092
- Issue date Sep 4, 2012
- International Business Machines Corporation
- Sungjun Chun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Crosstalk reduction in dual inline memory module (DIMM) connectors
- Patent number 7,537,487
- Issue date May 26, 2009
- International Business Machines Corporation
- Lei Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crosstalk reduction in dual inline memory module (DIMM) connectors
- Patent number 7,407,415
- Issue date Aug 5, 2008
- International Business Machines Corporation
- Lei Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via and via landing structures for smoothing transitions in multi-l...
- Patent number 6,992,255
- Issue date Jan 31, 2006
- International Business Machines Corporation
- Modest Oprysko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Impedance matched electrical interconnect using dielectric compounds
- Patent number 6,940,165
- Issue date Sep 6, 2005
- International Business Machines Corporation
- Modest M. Oprysko
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC SUBSTRATE STACKING
- Publication number 20230098054
- Publication date Mar 30, 2023
- International Business Machines Corporation
- Lei Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FUNCTIONAL STIFFENER THAT ENABLES LAND GRID ARRAY INTERCONNECTIONS...
- Publication number 20200350234
- Publication date Nov 5, 2020
- International Business Machines Corporation
- LEI SHAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Processing Composition of Improved Metal Interconnect Protection an...
- Publication number 20190048292
- Publication date Feb 14, 2019
- Jiali Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER CAPACITOR PACKAGE
- Publication number 20180218841
- Publication date Aug 2, 2018
- International Business Machines Corporation
- Lei Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER CAPACITOR PACKAGE
- Publication number 20180218842
- Publication date Aug 2, 2018
- International Business Machines Corporation
- Lei Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDING DISCRETE COMPONENTS HAVING VARIABLE DIMENSIONS IN A SUBST...
- Publication number 20180206333
- Publication date Jul 19, 2018
- International Business Machines Corporation
- Lei Shan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER DECOUPLING ATTACHMENT
- Publication number 20180054895
- Publication date Feb 22, 2018
- International Business Machines Corporation
- Lei Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICALLY EMBEDDED DISCRETE COMPONENT
- Publication number 20170367176
- Publication date Dec 21, 2017
- International Business Machines Corporation
- Lei Shan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER DECOUPLING ATTACHMENT
- Publication number 20170359898
- Publication date Dec 14, 2017
- International Business Machines Corporation
- Lei Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARD EDGE CONNECTORS
- Publication number 20170162964
- Publication date Jun 8, 2017
- International Business Machines Corporation
- Lei Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUNDANT CLOCK CHANNEL FOR HIGH RELIABILITY CONNECTORS
- Publication number 20120120577
- Publication date May 17, 2012
- International Business Machines Corporation
- Sungjun Chun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
APPARATUS AND METHOD OF VIA-STUB RESONANCE EXTINCTION
- Publication number 20090295498
- Publication date Dec 3, 2009
- Lei Shan
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CROSSTALK REDUCTION IN DUAL INLINE MEMORY MODULE (DIMM) CONNECTORS
- Publication number 20080207059
- Publication date Aug 28, 2008
- International Business Machines Corporation
- Lei Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CROSSTALK REDUCTION IN DUAL INLINE MEMORY MODULE (DIMM) CONNECTORS
- Publication number 20070287333
- Publication date Dec 13, 2007
- International Business Machines Corporation
- Lei Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method of via-stub resonance extinction
- Publication number 20070152771
- Publication date Jul 5, 2007
- Lei Shan
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Via and via landing structures for smoothing transitions in multi-l...
- Publication number 20050011674
- Publication date Jan 20, 2005
- Modest Oprysko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Impedance-Matched electrical interconnect
- Publication number 20040046235
- Publication date Mar 11, 2004
- International Business Machines Corporation
- Modest M. Oprysko
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Electronic substrate stacking

Power decoupling attachment

Functional stiffener that enables land grid array interconnections...

Multi-layer capacitor package

Embedding discrete components having variable dimensions in a subst...

Thermally conductive interface composition and use thereof

Multi-layer capacitor package

Embedding discrete components having variable dimensions in a subst...

Power decoupling attachment

Redundant clock channel for high reliability connectors

Crosstalk reduction in dual inline memory module (DIMM) connectors

Crosstalk reduction in dual inline memory module (DIMM) connectors

Via and via landing structures for smoothing transitions in multi-l...

Impedance matched electrical interconnect using dielectric compounds

Patents Applicationslast 30 patents

ELECTRONIC SUBSTRATE STACKING

FUNCTIONAL STIFFENER THAT ENABLES LAND GRID ARRAY INTERCONNECTIONS...

Processing Composition of Improved Metal Interconnect Protection an...

MULTI-LAYER CAPACITOR PACKAGE

MULTI-LAYER CAPACITOR PACKAGE

EMBEDDING DISCRETE COMPONENTS HAVING VARIABLE DIMENSIONS IN A SUBST...

POWER DECOUPLING ATTACHMENT

VERTICALLY EMBEDDED DISCRETE COMPONENT

POWER DECOUPLING ATTACHMENT

CARD EDGE CONNECTORS

REDUNDANT CLOCK CHANNEL FOR HIGH RELIABILITY CONNECTORS

APPARATUS AND METHOD OF VIA-STUB RESONANCE EXTINCTION

CROSSTALK REDUCTION IN DUAL INLINE MEMORY MODULE (DIMM) CONNECTORS

CROSSTALK REDUCTION IN DUAL INLINE MEMORY MODULE (DIMM) CONNECTORS

Apparatus and method of via-stub resonance extinction

Via and via landing structures for smoothing transitions in multi-l...

Impedance-Matched electrical interconnect