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Leo M. Higgins, III
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Austin, TX, US
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Patents Grants
last 30 patents
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Patent Grant
Thin array plastic package without die attach pad and process for f...
Patent number
7,358,119
Issue date
Apr 15, 2008
ASAT Ltd.
Neil McLellan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package and method for fabricating same
Patent number
7,348,663
Issue date
Mar 25, 2008
ASAT Ltd.
Mohan Kirloskar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package and method for fabricating same
Patent number
7,344,920
Issue date
Mar 18, 2008
ASAT Ltd.
Mohan Kirloskar
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
METHOD FOR FORMNG A SEMICONDUCTOR DEVICE ASSEMBLY HAVING A HEAT SPR...
Publication number
20140213018
Publication date
Jul 31, 2014
Leo M. Higgins III
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH PROTECTIVE MATERIAL AND METHOD FOR ENCAPS...
Publication number
20120273954
Publication date
Nov 1, 2012
LEO M. HIGGINS, III
H01 - BASIC ELECTRIC ELEMENTS