Leo van Gemert

Person

Nijmegen, NL

People

Patents Grantslast 30 patents

Information Patent Grant
Selective underfill assembly and method therefor
- Patent number 12,183,595
- Issue date Dec 31, 2024
- NXP B.V.
- Leo van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Efficient wave guide transition between package and PCB using solde...
- Patent number 11,963,291
- Issue date Apr 16, 2024
- NXP B.V.
- Leo van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective underfill assembly and method therefor
- Patent number 11,557,491
- Issue date Jan 17, 2023
- NXP B.V.
- Leo van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for improved circuit structure thermal reliabi...
- Patent number 11,508,669
- Issue date Nov 22, 2022
- NXP B.V.
- Leo van Gemert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method of making a semiconductor device
- Patent number 11,011,446
- Issue date May 18, 2021
- Nexperia B.V.
- Tonny Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underbump metallization dimension variation with improved reliability
- Patent number 10,825,789
- Issue date Nov 3, 2020
- NXP B.V.
- Leo Van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus comprising a semiconductor arrangement
- Patent number 10,613,136
- Issue date Apr 7, 2020
- NXP B.V.
- Leo Van Gemert
- G01 - MEASURING TESTING
Information Patent Grant
Integrated circuit package
- Patent number 10,615,134
- Issue date Apr 7, 2020
- NXP B.V.
- Maristella Spella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier
- Patent number 10,315,821
- Issue date Jun 11, 2019
- NXP B.V.
- Jeroen Johannes Maria Zaal
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Wafer level chip scale semiconductor package
- Patent number 10,109,564
- Issue date Oct 23, 2018
- NXP B.V.
- Roelf Groenhuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out chip scale package
- Patent number 8,679,963
- Issue date Mar 25, 2014
- NXP B.V.
- Jan Gulpen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out chip scale package
- Patent number 8,482,136
- Issue date Jul 9, 2013
- NXP B.V.
- Jan Gulpen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DOUBLE-SIDED MULTICHIP PACKAGES
- Publication number 20240186301
- Publication date Jun 6, 2024
- NXP USA, Inc.
- Scott M. Hayes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP PACKAGES WITH 3D INTEGRATION
- Publication number 20240186303
- Publication date Jun 6, 2024
- NXP USA, Inc.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM
- Publication number 20240154300
- Publication date May 9, 2024
- NXP B.V.
- Harshitha Thippur Shivamurthy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH THROUGH PACKAGE VIA AND METHOD THEREFOR
- Publication number 20240088068
- Publication date Mar 14, 2024
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH UNDER-BUMP METALLIZATION AND METHOD THEREFOR
- Publication number 20240014152
- Publication date Jan 11, 2024
- NXP B.V.
- Leo van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Efficient Wave Guide Transition Between Package and PCB Using Solde...
- Publication number 20230345623
- Publication date Oct 26, 2023
- NXP B.V.
- Leo van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE UNDERFILL ASSEMBLY AND METHOD THEREFOR
- Publication number 20230108902
- Publication date Apr 6, 2023
- NXP B.V.
- Leo van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE UNDERFILL ASSEMBLY AND METHOD THEREFOR
- Publication number 20210134612
- Publication date May 6, 2021
- NXP B.V.
- Leo van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for improved Circuit Structure Thermal Reliabi...
- Publication number 20210066209
- Publication date Mar 4, 2021
- NXP B.V.
- Leo van Gemert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
APPARATUS COMPRISING A SEMICONDUCTOR ARRANGEMENT
- Publication number 20190011496
- Publication date Jan 10, 2019
- NXP B.V.
- Leo VAN GEMERT
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED CIRCUIT PACKAGE
- Publication number 20180233465
- Publication date Aug 16, 2018
- NXP B.V.
- Maristella SPELLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT CARRIER
- Publication number 20180134473
- Publication date May 17, 2018
- NXP B.V.
- Jeroen Johannes Maria Zaal
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
WAFER LEVEL CHIP SCALE SEMICONDUCTOR PACKAGE
- Publication number 20170372988
- Publication date Dec 28, 2017
- NXP B.V.
- ROELF GROENHUIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MAKING A SEMICONDUCTOR DEVICE
- Publication number 20170148697
- Publication date May 25, 2017
- NXP B.V.
- Tonny Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT CHIP SCALE PACKAGE
- Publication number 20130273731
- Publication date Oct 17, 2013
- Jan GULPEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT CHIP SCALE PACKAGE
- Publication number 20110156237
- Publication date Jun 30, 2011
- NXP B.V.
- Jan Gulpen
- H01 - BASIC ELECTRIC ELEMENTS

Leo van Gemert

Person

Patents Grantslast 30 patents

Selective underfill assembly and method therefor

Efficient wave guide transition between package and PCB using solde...

Selective underfill assembly and method therefor

Method and apparatus for improved circuit structure thermal reliabi...

Semiconductor device and method of making a semiconductor device

Underbump metallization dimension variation with improved reliability

Apparatus comprising a semiconductor arrangement

Integrated circuit package

Component carrier

Wafer level chip scale semiconductor package

Fan-out chip scale package

Fan-out chip scale package

Patents Applicationslast 30 patents

DOUBLE-SIDED MULTICHIP PACKAGES

MULTICHIP PACKAGES WITH 3D INTEGRATION

SYSTEM

SEMICONDUCTOR DEVICE WITH THROUGH PACKAGE VIA AND METHOD THEREFOR

SEMICONDUCTOR DEVICE WITH UNDER-BUMP METALLIZATION AND METHOD THEREFOR

Efficient Wave Guide Transition Between Package and PCB Using Solde...

SELECTIVE UNDERFILL ASSEMBLY AND METHOD THEREFOR

SELECTIVE UNDERFILL ASSEMBLY AND METHOD THEREFOR

Method and Apparatus for improved Circuit Structure Thermal Reliabi...

APPARATUS COMPRISING A SEMICONDUCTOR ARRANGEMENT

INTEGRATED CIRCUIT PACKAGE

COMPONENT CARRIER

WAFER LEVEL CHIP SCALE SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD OF MAKING A SEMICONDUCTOR DEVICE

FAN-OUT CHIP SCALE PACKAGE

FAN-OUT CHIP SCALE PACKAGE