Leonard T. Olson Jr.

Person

Centerville, VA, US

People

Patents Grantslast 30 patents

Information Patent Grant
High speed optical interconnect
- Patent number 5,200,631
- Issue date Apr 6, 1993
- International Business Machines Corporation
- Francis D. Austin
- G02 - OPTICS
Information Patent Grant
Multilevel integrated circuit packaging structures
- Patent number 5,028,983
- Issue date Jul 2, 1991
- International Business Machines Corporation
- Harry R. Bickford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic assembly
- Patent number 5,005,939
- Issue date Apr 9, 1991
- International Business Machines Corporation
- Nicolaos C. Arvanitakis
- G02 - OPTICS
Information Patent Grant
Electronic package with integrated distributed decoupling capacitors
- Patent number 4,945,399
- Issue date Jul 31, 1990
- International Business Machines Corporation
- Michael B. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite dielectric structure for optimizing electrical performanc...
- Patent number 4,916,259
- Issue date Apr 10, 1990
- International Business Machines Corporation
- Ronald S. Charsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
De-coupled printed circuits
- Patent number 4,785,135
- Issue date Nov 15, 1988
- International Business Machines Corporation
- Mario E. Ecker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible film chip carrier with decoupling capacitors
- Patent number 4,744,008
- Issue date May 10, 1988
- International Business Machines Corporation
- Vincent J. Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Repairable multi-level overlay system for semiconductor device
- Patent number 4,549,200
- Issue date Oct 22, 1985
- International Business Machines Corporation
- Mario E. Ecker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnection means for chip carriers
- Patent number 4,377,316
- Issue date Mar 22, 1983
- International Business Machines Corporation
- Mario E. Ecker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package
- Patent number 4,251,852
- Issue date Feb 17, 1981
- International Business Machines Corporation
- Mario E. Ecker
- H01 - BASIC ELECTRIC ELEMENTS

Leonard T. Olson Jr.

Person

Patents Grantslast 30 patents

High speed optical interconnect

Multilevel integrated circuit packaging structures

Optoelectronic assembly

Electronic package with integrated distributed decoupling capacitors

Composite dielectric structure for optimizing electrical performanc...

De-coupled printed circuits

Flexible film chip carrier with decoupling capacitors

Repairable multi-level overlay system for semiconductor device

High density interconnection means for chip carriers

Integrated circuit package