Leonard W. Schaper

Person

Fayetteville, AR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Low noise high thermal conductivity mixed signal package
- Patent number 8,207,021
- Issue date Jun 26, 2012
- Raytheon Company
- Dennis R. Kling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low noise high thermal conductivity mixed signal package
- Patent number 8,067,833
- Issue date Nov 29, 2011
- Raytheon Company
- Dennis R. Kling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging RF MEMS
- Patent number 7,049,175
- Issue date May 23, 2006
- Board of Trustees of the University of Arkansas
- Leonard W. Schaper
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
RC terminator and production method therefor
- Patent number 7,005,722
- Issue date Feb 28, 2006
- The Board of Trustees of the University of Arkansas
- Leonard W. Schaper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Decoupling capacitor for integrated circuit package and electrical...
- Patent number 6,806,568
- Issue date Oct 19, 2004
- The Board of Trustees of the University of Arkansas
- Leonard W. Schaper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for providing low-loss transmission lines in i...
- Patent number 6,800,939
- Issue date Oct 5, 2004
- The Board of Trustees for the University of Arkansas
- Leonard W. Schaper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface applied passives
- Patent number 6,707,680
- Issue date Mar 16, 2004
- Board of Trustees of the University of Arkansas
- Leonard W. Schaper
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making capacitor with extremely wide band low impedance
- Patent number 6,516,504
- Issue date Feb 11, 2003
- The Board of Trustees of the University of Arkansas
- Leonard W. Schaper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic interconnection medium having offset electrical mesh plane
- Patent number 6,388,200
- Issue date May 14, 2002
- The Board of Trustees of the University of Arkansas
- Leonard W. Schaper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip module and method of forming same
- Patent number 6,297,460
- Issue date Oct 2, 2001
- The Board of Trustees of the University of Arkansas
- Leonard W. Schaper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Floating plate capacitor with extremely wide band low impedance
- Patent number 6,272,003
- Issue date Aug 7, 2001
- The Board of Trustees of the University of Arkansas
- Leonard W. Schaper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic interconnection medium having offset electrical mesh plane
- Patent number 6,255,600
- Issue date Jul 3, 2001
- The Board of Trustees of the University of Arkansas
- Leonard W. Schaper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Floating plate capacitor with extremely wide band low impedance
- Patent number 6,023,408
- Issue date Feb 8, 2000
- The Board of Trustees of the University of Arkansas
- Leonard W. Schaper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of electroplating a substrate, and products made thereby
- Patent number 5,873,992
- Issue date Feb 23, 1999
- The Board of Trustees of the University of Arkansas
- John H. Glezen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of planarizing polycrystalline diamonds, planarized polycrys...
- Patent number 5,472,370
- Issue date Dec 5, 1995
- University of Arkansas
- Ajay P. Malshe
- B24 - GRINDING POLISHING
Information Patent Grant
Multichip module
- Patent number 5,410,107
- Issue date Apr 25, 1995
- The Board of Trustees of the University of Arkansas
- Leonard W. Schaper
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LOW NOISE HIGH THERMAL CONDUCTIVITY MIXED SIGNAL PACKAGE
- Publication number 20120015485
- Publication date Jan 19, 2012
- Raytheon Company
- Dennis R. Kling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW NOISE HIGH THERMAL CONDUCTIVITY MIXED SIGNAL PACKAGE
- Publication number 20110018126
- Publication date Jan 27, 2011
- Raytheon Company
- Dennis R. Kling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and process for packaging RF MEMS and other devices
- Publication number 20060211177
- Publication date Sep 21, 2006
- The Board of Trustees of the University of Arkansas
- Leonard W. Schaper
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Structure and process for packaging rf mems and other devices
- Publication number 20050006738
- Publication date Jan 13, 2005
- Leonard W. Schaper
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of forming capacitor with extremely wide band low impedance
- Publication number 20040016094
- Publication date Jan 29, 2004
- The Board of Trustees of the University of Arkansas
- Leonard W. Schaper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for providing low-loss transmission lines in i...
- Publication number 20030222288
- Publication date Dec 4, 2003
- The Board of Trustees for the University of Arkansas
- Leonard W. Schaper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Decoupling capacitor for integrated circuit package and electrical...
- Publication number 20030015783
- Publication date Jan 23, 2003
- The Board of Trustees of the University of Arkansas
- Leonard W. Schaper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface applied passives
- Publication number 20020131254
- Publication date Sep 19, 2002
- Leonard W. Schaper
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLOATING PLATE CAPACITOR WITH EXTREMELY WIDE BAND LOW IMPEDANCE
- Publication number 20020027763
- Publication date Mar 7, 2002
- LEONARD W. SCHAPER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic interconnection medium having offset electrical mesh plane
- Publication number 20010047588
- Publication date Dec 6, 2001
- The Board of Trustees of the University of Arkansas
- Leonard W. Schaper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic interconnection medium having offset electrical mesh plane
- Publication number 20010013422
- Publication date Aug 16, 2001
- Leonard W. Schaper
- H01 - BASIC ELECTRIC ELEMENTS

Leonard W. Schaper

Person

Patents Grantslast 30 patents

Low noise high thermal conductivity mixed signal package

Low noise high thermal conductivity mixed signal package

Method of packaging RF MEMS

RC terminator and production method therefor

Decoupling capacitor for integrated circuit package and electrical...

Apparatus and method for providing low-loss transmission lines in i...

Surface applied passives

Method of making capacitor with extremely wide band low impedance

Electronic interconnection medium having offset electrical mesh plane

Multichip module and method of forming same

Floating plate capacitor with extremely wide band low impedance

Electronic interconnection medium having offset electrical mesh plane

Floating plate capacitor with extremely wide band low impedance

Method of electroplating a substrate, and products made thereby

Method of planarizing polycrystalline diamonds, planarized polycrys...

Multichip module

Patents Applicationslast 30 patents

LOW NOISE HIGH THERMAL CONDUCTIVITY MIXED SIGNAL PACKAGE

LOW NOISE HIGH THERMAL CONDUCTIVITY MIXED SIGNAL PACKAGE

Structure and process for packaging RF MEMS and other devices

Structure and process for packaging rf mems and other devices

Method of forming capacitor with extremely wide band low impedance

Apparatus and method for providing low-loss transmission lines in i...

Decoupling capacitor for integrated circuit package and electrical...

Surface applied passives

FLOATING PLATE CAPACITOR WITH EXTREMELY WIDE BAND LOW IMPEDANCE

Electronic interconnection medium having offset electrical mesh plane

Electronic interconnection medium having offset electrical mesh plane