Leonardus Antonius Elisabeth van Gemert

Person

Nijmegen, NL

People

Patents Grantslast 30 patents

Information Patent Grant
Reduction of defects in wafer level chip scale package (WLCSP) devices
- Patent number 10,177,111
- Issue date Jan 8, 2019
- NXP B.V.
- Tonny Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded QFN package and method of making
- Patent number 10,096,555
- Issue date Oct 9, 2018
- NXP B.V.
- Jan Gulpen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heatsink very-thin quad flat no-leads (HVQFN) package
- Patent number 9,953,903
- Issue date Apr 24, 2018
- NXP B.V.
- Leonardus Antonius Elisabeth van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduction of defects in wafer level chip scale package (WLCSP) devices
- Patent number 9,704,823
- Issue date Jul 11, 2017
- NXP B.V.
- Tonny Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded QFN package and method of making
- Patent number 9,653,414
- Issue date May 16, 2017
- NXP B.V.
- Jan Gulpen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing defects in wafer level chip scale package (WLCSP) devices
- Patent number 9,466,585
- Issue date Oct 11, 2016
- NXP B.V.
- Tonny Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die interconnect
- Patent number 9,385,099
- Issue date Jul 5, 2016
- NXP, B.V.
- Leonardus Antonius Elisabeth van Gemert
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Exposed die clip bond power package
- Patent number 9,263,299
- Issue date Feb 16, 2016
- NXP B.V.
- Leonardus Antonius Elisabeth van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using a double-cut for mechanical protection of a wafer-level chip...
- Patent number 9,245,804
- Issue date Jan 26, 2016
- NXP B.V.
- Christian Zenz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection of a wafer-level chip scale package (WLCSP)
- Patent number 9,196,537
- Issue date Nov 24, 2015
- NXP B.V.
- Leonardus Antonius Elisabeth Van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated wafer-level chip scale (WLSCP) pedestal packaging
- Patent number 8,987,057
- Issue date Mar 24, 2015
- NXP B.V.
- Leonardus Antonius Elisabeth Van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and method of manufacturing the same
- Patent number 8,895,357
- Issue date Nov 25, 2014
- NXP B.V.
- Tonny Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package, method of manufacturing a package and frame
- Patent number 8,217,281
- Issue date Jul 10, 2012
- NXP B.V.
- Leonardus A. E. Van Gemert
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
SHIELDED QFN PACKAGE AND METHOD OF MAKING
- Publication number 20170213797
- Publication date Jul 27, 2017
- NXP B.V.
- Jan Gulpen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCTION OF DEFECTS IN WAFER LEVEL CHIP SCALE PACKAGE (WLCSP) DEVICES
- Publication number 20170179076
- Publication date Jun 22, 2017
- NXP B.V.
- Tonny Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRATHIN ROUTABLE QUAD FLAT NO-LEADS (QFN) PACKAGE
- Publication number 20170103939
- Publication date Apr 13, 2017
- NXP B.V.
- Jan Gulpen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED QFN PACKAGE AND METHOD OF MAKING
- Publication number 20170025369
- Publication date Jan 26, 2017
- NXP B.V.
- Jan Gulpen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATSINK VERY-THIN QUAD FLAT NO-LEADS (HVQFN) PACKAGE
- Publication number 20170025334
- Publication date Jan 26, 2017
- NXP B.V.
- Leonardus Antonius Elisabeth van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCTION OF DEFECTS IN WAFER LEVEL CHIP SCALE PACKAGE (WLCSP) DEVICES
- Publication number 20160276176
- Publication date Sep 22, 2016
- NXP B.V.
- Tonny Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING DEFECTS IN WAFER LEVEL CHIP SCALE PACKAGE (WLCSP) DEVICES
- Publication number 20160276306
- Publication date Sep 22, 2016
- NXP B.V.
- Tonny Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPOSED DIE CLIP BOND POWER PACKAGE
- Publication number 20160005626
- Publication date Jan 7, 2016
- NXP B.V.
- Leonardus Antonius Elisabeth van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Exposed-Heatsink Quad Flat No-Leads (QFN) Package
- Publication number 20160005680
- Publication date Jan 7, 2016
- NXP B.V.
- Emil Casey Israel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPOSED DIE QUAD FLAT NO-LEADS (QFN) PACKAGE
- Publication number 20160005679
- Publication date Jan 7, 2016
- NXP B.V.
- Emil Casey Israel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE WAFER-LEVEL CHIP-SCALE PACKAGES WITH IMPROVED BOARD-LEVEL...
- Publication number 20160005653
- Publication date Jan 7, 2016
- NXP B.V.
- Caroline Catharina Maria Beelen-Hendrikx
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE INTERCONNECT
- Publication number 20150279803
- Publication date Oct 1, 2015
- NXP B.V.
- Leonardus Antonius Elisabeth van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED WAFER-LEVEL CHIP SCALE (WLSCP) PEDESTAL PACKAGING
- Publication number 20150162306
- Publication date Jun 11, 2015
- NXP B.V.
- Leonardus Antonius Elisabeth VAN GEMERT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150069587
- Publication date Mar 12, 2015
- NXP B.V.
- Tonny Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTION OF A WAFER-LEVEL CHIP SCALE PACKAGE (WLCSP)
- Publication number 20140138855
- Publication date May 22, 2014
- NXP B.V.
- Leonardus Antonius Elisabeth VAN GEMERT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
USING A DOUBLE-CUT FOR MECHANICAL PROTECTION OF A WAFER-LEVEL CHIP...
- Publication number 20140110842
- Publication date Apr 24, 2014
- NXP B.V.
- Christian ZENZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED WAFER-LEVEL CHIP SCALE (WLSCP) PEDESTAL PACKAGING
- Publication number 20140091458
- Publication date Apr 3, 2014
- NXP B.V.
- Leonardus Antonius Elisabeth VAN GEMERT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130264691
- Publication date Oct 10, 2013
- NXP B.V.
- Tonny Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE, METHOD OF MANUFACTURING A PACKAGE AND FRAME
- Publication number 20100051345
- Publication date Mar 4, 2010
- NXP, B.V.
- Leonardus A. E. Van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Camera module, holder for use in a camera module, camera system and...
- Publication number 20050237419
- Publication date Oct 27, 2005
- KONINKLIJKE PHILLIPS ELECTRONICS N.V.
- Leonardus Antonius Elisabeth Van Gemert
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Leonardus Antonius Elisabeth van Gemert

Person

Patents Grantslast 30 patents

Reduction of defects in wafer level chip scale package (WLCSP) devices

Shielded QFN package and method of making

Heatsink very-thin quad flat no-leads (HVQFN) package

Reduction of defects in wafer level chip scale package (WLCSP) devices

Shielded QFN package and method of making

Reducing defects in wafer level chip scale package (WLCSP) devices

Die interconnect

Exposed die clip bond power package

Using a double-cut for mechanical protection of a wafer-level chip...

Protection of a wafer-level chip scale package (WLCSP)

Encapsulated wafer-level chip scale (WLSCP) pedestal packaging

Integrated circuit and method of manufacturing the same

Package, method of manufacturing a package and frame

Patents Applicationslast 30 patents

SHIELDED QFN PACKAGE AND METHOD OF MAKING

REDUCTION OF DEFECTS IN WAFER LEVEL CHIP SCALE PACKAGE (WLCSP) DEVICES

ULTRATHIN ROUTABLE QUAD FLAT NO-LEADS (QFN) PACKAGE

SHIELDED QFN PACKAGE AND METHOD OF MAKING

HEATSINK VERY-THIN QUAD FLAT NO-LEADS (HVQFN) PACKAGE

REDUCTION OF DEFECTS IN WAFER LEVEL CHIP SCALE PACKAGE (WLCSP) DEVICES

REDUCING DEFECTS IN WAFER LEVEL CHIP SCALE PACKAGE (WLCSP) DEVICES

EXPOSED DIE CLIP BOND POWER PACKAGE

Exposed-Heatsink Quad Flat No-Leads (QFN) Package

EXPOSED DIE QUAD FLAT NO-LEADS (QFN) PACKAGE

FLEXIBLE WAFER-LEVEL CHIP-SCALE PACKAGES WITH IMPROVED BOARD-LEVEL...

DIE INTERCONNECT

ENCAPSULATED WAFER-LEVEL CHIP SCALE (WLSCP) PEDESTAL PACKAGING

INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING THE SAME

PROTECTION OF A WAFER-LEVEL CHIP SCALE PACKAGE (WLCSP)

USING A DOUBLE-CUT FOR MECHANICAL PROTECTION OF A WAFER-LEVEL CHIP...

ENCAPSULATED WAFER-LEVEL CHIP SCALE (WLSCP) PEDESTAL PACKAGING

INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING THE SAME

PACKAGE, METHOD OF MANUFACTURING A PACKAGE AND FRAME

Camera module, holder for use in a camera module, camera system and...