Leslie Stark

Person

Dallas, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Film covers for sensor packages
- Patent number 11,972,994
- Issue date Apr 30, 2024
- Texas Instruments Incorporated
- Sreenivasan Kalyani Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Proximity sensor
- Patent number 11,894,339
- Issue date Feb 6, 2024
- Texas Instruments Incorporated
- Sreenivasan Kalyani Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Covers for semiconductor package components
- Patent number 11,784,103
- Issue date Oct 10, 2023
- Texas Instruments Incorporated
- Sreenivasan Kalyani Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film covers for sensor packages
- Patent number 11,658,083
- Issue date May 23, 2023
- Texas Instruments Incorporated
- Sreenivasan Kalyani Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package cavities with polymer films
- Patent number 11,476,175
- Issue date Oct 18, 2022
- Texas Instruments Incorporated
- Sreenivasan Kalyani Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer die attachment
- Patent number 11,410,913
- Issue date Aug 9, 2022
- Texas Instruments Incorporated
- Mohammad Waseem Hussain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer die attachment
- Patent number 10,636,727
- Issue date Apr 28, 2020
- Texas Instruments Incorporated
- Mohammad Waseem Hussain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discrete device mounted on substrate
- Patent number 9,899,339
- Issue date Feb 20, 2018
- Texas Instruments Incorporated
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with printed circuit layer
- Patent number 9,111,845
- Issue date Aug 18, 2015
- Texas Instruments Incorporated
- Matthew David Romig
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assembly with three dimensional inkjet printed traces
- Patent number 8,945,986
- Issue date Feb 3, 2015
- Texas Instruments Incorporated
- Matthew David Romig
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package with printed circuit layer
- Patent number 8,847,349
- Issue date Sep 30, 2014
- Texas Instruments Incorporated
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly with three dimensional inkjet printed traces
- Patent number 8,816,513
- Issue date Aug 26, 2014
- Texas Instruments Incorporated
- Matthew David Romig
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for fabricating ball grid array package for enhanced stress...
- Patent number 6,689,678
- Issue date Feb 10, 2004
- Texas Instruments Incorporated
- Richard D. James
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ball grid array package for enhanced stress tolerance
- Patent number 6,583,515
- Issue date Jun 24, 2003
- Texas Instruments Incorporated
- Richard D. James
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for positioning a carrier relative to a travel path
- Patent number 6,234,296
- Issue date May 22, 2001
- Texas Instruments Incorporated
- Gonzalo Amador
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for applying a rotary force to strips of varying widths
- Patent number 6,227,353
- Issue date May 8, 2001
- Texas Instruments Incorporated
- Gonzalo Amador
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radiant chamber for simultaneous rapid die attach and lead frame em...
- Patent number 6,226,452
- Issue date May 1, 2001
- Texas Instruments Incorporated
- Paul Joseph Hundt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automated multiple lead frame strip radiant die attach material cur...
- Patent number 6,069,342
- Issue date May 30, 2000
- Texas Instruments Incorporated
- Gonzalo Amador
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coring of leadframes in carriers via radiant heat source
- Patent number 5,993,591
- Issue date Nov 30, 1999
- Texas Instruments Incorporated
- Jesus S. Buendia
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of forming ball grid array contacts
- Patent number 5,960,307
- Issue date Sep 28, 1999
- Texas Instruments Incorporated
- Leslie E. Stark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical curing process for intergrated circuit package assembly
- Patent number 5,846,476
- Issue date Dec 8, 1998
- Texas Instruments Incorporated
- Ming Hwang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Optical diebonding for semiconductor devices
- Patent number 5,783,025
- Issue date Jul 21, 1998
- Texas Instruments Incorporated
- Ming Hwang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FILM COVERS FOR SENSOR PACKAGES
- Publication number 20240243024
- Publication date Jul 18, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan Kalyani Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROXIMITY SENSOR
- Publication number 20240178184
- Publication date May 30, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan Kalyani KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COVERS FOR SEMICONDUCTOR PACKAGE COMPONENTS
- Publication number 20240038609
- Publication date Feb 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan Kalyani KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM COVERS FOR SENSOR PACKAGES
- Publication number 20230253277
- Publication date Aug 10, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan Kalyani KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE CAVITIES WITH POLYMER FILMS
- Publication number 20230030266
- Publication date Feb 2, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan Kalyani KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE CAVITIES WITH POLYMER FILMS
- Publication number 20220199479
- Publication date Jun 23, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan Kalyani KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROXIMITY SENSOR
- Publication number 20220189912
- Publication date Jun 16, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan Kalyani KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COVERS FOR SEMICONDUCTOR PACKAGE COMPONENTS
- Publication number 20220181223
- Publication date Jun 9, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan Kalyani KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM COVERS FOR SENSOR PACKAGES
- Publication number 20220181224
- Publication date Jun 9, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan Kalyani KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSOR PACKAGES WITH GLASS MEMBERS
- Publication number 20220173256
- Publication date Jun 2, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan Kalyani KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MINIATURE SENSOR CAVITIES
- Publication number 20220155109
- Publication date May 19, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan Kalyani KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Layer Die Attachment
- Publication number 20200219798
- Publication date Jul 9, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Mohammad Waseem Hussain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Layer Die Attachment
- Publication number 20190259685
- Publication date Aug 22, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Mohammad Waseem Hussain
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT CHIP FABRICATION LEADFRAME
- Publication number 20170018483
- Publication date Jan 19, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Robert L. Pitts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH PRINTED CIRCUIT LAYER
- Publication number 20140361402
- Publication date Dec 11, 2014
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH PRINTED CIRCUIT LAYER
- Publication number 20140175599
- Publication date Jun 26, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Assembly with Three Dimensional Inkjet Printed Traces
- Publication number 20140127856
- Publication date May 8, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCRETE DEVICE MOUNTED ON SUBSTRATE
- Publication number 20140124939
- Publication date May 8, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Assembly With Three Dimensional Inkjet Printed Traces
- Publication number 20140054795
- Publication date Feb 27, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball grid array package for enhanced stress tolerance
- Publication number 20030153160
- Publication date Aug 14, 2003
- Richard D. James
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Chip-scale packages stacked on folded interconnector for vertical a...
- Publication number 20020114143
- Publication date Aug 22, 2002
- Gary P. Morrison
- H01 - BASIC ELECTRIC ELEMENTS

Leslie Stark

Person

Patents Grantslast 30 patents

Film covers for sensor packages

Proximity sensor

Covers for semiconductor package components

Film covers for sensor packages

Sensor package cavities with polymer films

Multi-layer die attachment

Multi-layer die attachment

Discrete device mounted on substrate

Integrated circuit package with printed circuit layer

Electronic assembly with three dimensional inkjet printed traces

Integrated circuit package with printed circuit layer

Electronic assembly with three dimensional inkjet printed traces

Process for fabricating ball grid array package for enhanced stress...

Ball grid array package for enhanced stress tolerance

System for positioning a carrier relative to a travel path

System for applying a rotary force to strips of varying widths

Radiant chamber for simultaneous rapid die attach and lead frame em...

Automated multiple lead frame strip radiant die attach material cur...

Coring of leadframes in carriers via radiant heat source

Method of forming ball grid array contacts

Optical curing process for intergrated circuit package assembly

Optical diebonding for semiconductor devices

Patents Applicationslast 30 patents

FILM COVERS FOR SENSOR PACKAGES

PROXIMITY SENSOR

COVERS FOR SEMICONDUCTOR PACKAGE COMPONENTS

FILM COVERS FOR SENSOR PACKAGES

SENSOR PACKAGE CAVITIES WITH POLYMER FILMS

SENSOR PACKAGE CAVITIES WITH POLYMER FILMS

PROXIMITY SENSOR

COVERS FOR SEMICONDUCTOR PACKAGE COMPONENTS

FILM COVERS FOR SENSOR PACKAGES

OPTICAL SENSOR PACKAGES WITH GLASS MEMBERS

MINIATURE SENSOR CAVITIES

Multi-Layer Die Attachment

Multi-Layer Die Attachment

INTEGRATED CIRCUIT CHIP FABRICATION LEADFRAME

INTEGRATED CIRCUIT PACKAGE WITH PRINTED CIRCUIT LAYER

INTEGRATED CIRCUIT PACKAGE WITH PRINTED CIRCUIT LAYER

Electronic Assembly with Three Dimensional Inkjet Printed Traces

DISCRETE DEVICE MOUNTED ON SUBSTRATE

Electronic Assembly With Three Dimensional Inkjet Printed Traces

Ball grid array package for enhanced stress tolerance

Chip-scale packages stacked on folded interconnector for vertical a...